JPS6445463A - Addition type polyimide polymer composition - Google Patents
Addition type polyimide polymer compositionInfo
- Publication number
- JPS6445463A JPS6445463A JP20233687A JP20233687A JPS6445463A JP S6445463 A JPS6445463 A JP S6445463A JP 20233687 A JP20233687 A JP 20233687A JP 20233687 A JP20233687 A JP 20233687A JP S6445463 A JPS6445463 A JP S6445463A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- expressed
- type polyimide
- blending
- addition type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE:To obtain the titled composition, having excellent curability, electrical characteristics, etc., at high temperatures and humidifies and suitable for sealing semiconductors, etc., by blending an addition type polyimide prepared by addition polymerization of a specific bismaleimide with a diamine with a specific amount of a specified curing accelerator, etc. CONSTITUTION:A composition obtained by blending (A) 100pts.wt. reaction product prepared by addition polymerization of (A1) a bismaleimide expressed by formula I (R<1> is bifunctional organic group) with (A2) a diamine expressed by formula II (R<2> is bifunctional organic group) at 0.5-2, preferably 1-1.5 molar ratio (A1/A2) with (B) 0.1-3pts.wt. curing accelerator selected from imidazole compounds, phosphine compounds and peroxides, (C) 100-600pts.wt. crystalline or noncrystalline quartz, having >=98% purity and 5-50mum average particle diameter and containing <=0.2wt.% particles having >=200mum particle diameter and (D) 0.3-10pts.wt. silicone compound expressed by formula II (R<3>-R<5> are H, etc.; c is 1-3; a+b+c=4).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20233687A JPS6445463A (en) | 1987-08-13 | 1987-08-13 | Addition type polyimide polymer composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20233687A JPS6445463A (en) | 1987-08-13 | 1987-08-13 | Addition type polyimide polymer composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6445463A true JPS6445463A (en) | 1989-02-17 |
Family
ID=16455857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20233687A Pending JPS6445463A (en) | 1987-08-13 | 1987-08-13 | Addition type polyimide polymer composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6445463A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01203464A (en) * | 1988-02-09 | 1989-08-16 | Shin Etsu Chem Co Ltd | Maleimide resin composition, its cured product and semiconductor device using same |
JPH04359052A (en) * | 1991-06-04 | 1992-12-11 | Hitachi Chem Co Ltd | Polyaminobismalemide resin composition and production of copper-clad laminate sheet using the same |
JP2017214524A (en) * | 2016-06-02 | 2017-12-07 | 日立化成株式会社 | Thermosetting resin composition, prepreg, laminate, printed wiring board and semiconductor package |
JP2021080457A (en) * | 2021-01-13 | 2021-05-27 | 昭和電工マテリアルズ株式会社 | Thermosetting resin composition, prepreg, laminate, printed wiring board, and semiconductor package |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5045096A (en) * | 1973-08-28 | 1975-04-22 | ||
JPS5216156A (en) * | 1975-07-30 | 1977-02-07 | Hitachi Ltd | Code conversion system |
JPS5410988A (en) * | 1977-06-27 | 1979-01-26 | Nippon Telegr & Teleph Corp <Ntt> | Flexible waveguide |
JPS57103207A (en) * | 1980-12-17 | 1982-06-26 | Fujitsu Ltd | Material for coating electronic components |
JPS61258863A (en) * | 1985-05-13 | 1986-11-17 | Shin Etsu Chem Co Ltd | Curable resin composition |
JPS6259626A (en) * | 1985-09-10 | 1987-03-16 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
JPS62106927A (en) * | 1985-11-01 | 1987-05-18 | Mitsubishi Petrochem Co Ltd | Heat-resistant resin composition |
JPS63256652A (en) * | 1987-04-14 | 1988-10-24 | Mitsui Petrochem Ind Ltd | Polyimide resin composition |
-
1987
- 1987-08-13 JP JP20233687A patent/JPS6445463A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5045096A (en) * | 1973-08-28 | 1975-04-22 | ||
JPS5216156A (en) * | 1975-07-30 | 1977-02-07 | Hitachi Ltd | Code conversion system |
JPS5410988A (en) * | 1977-06-27 | 1979-01-26 | Nippon Telegr & Teleph Corp <Ntt> | Flexible waveguide |
JPS57103207A (en) * | 1980-12-17 | 1982-06-26 | Fujitsu Ltd | Material for coating electronic components |
JPS61258863A (en) * | 1985-05-13 | 1986-11-17 | Shin Etsu Chem Co Ltd | Curable resin composition |
JPS6259626A (en) * | 1985-09-10 | 1987-03-16 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
JPS62106927A (en) * | 1985-11-01 | 1987-05-18 | Mitsubishi Petrochem Co Ltd | Heat-resistant resin composition |
JPS63256652A (en) * | 1987-04-14 | 1988-10-24 | Mitsui Petrochem Ind Ltd | Polyimide resin composition |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01203464A (en) * | 1988-02-09 | 1989-08-16 | Shin Etsu Chem Co Ltd | Maleimide resin composition, its cured product and semiconductor device using same |
JPH04359052A (en) * | 1991-06-04 | 1992-12-11 | Hitachi Chem Co Ltd | Polyaminobismalemide resin composition and production of copper-clad laminate sheet using the same |
JP2017214524A (en) * | 2016-06-02 | 2017-12-07 | 日立化成株式会社 | Thermosetting resin composition, prepreg, laminate, printed wiring board and semiconductor package |
JP2021080457A (en) * | 2021-01-13 | 2021-05-27 | 昭和電工マテリアルズ株式会社 | Thermosetting resin composition, prepreg, laminate, printed wiring board, and semiconductor package |
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