JPS6445463A - Addition type polyimide polymer composition - Google Patents

Addition type polyimide polymer composition

Info

Publication number
JPS6445463A
JPS6445463A JP20233687A JP20233687A JPS6445463A JP S6445463 A JPS6445463 A JP S6445463A JP 20233687 A JP20233687 A JP 20233687A JP 20233687 A JP20233687 A JP 20233687A JP S6445463 A JPS6445463 A JP S6445463A
Authority
JP
Japan
Prior art keywords
formula
expressed
type polyimide
blending
addition type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20233687A
Other languages
Japanese (ja)
Inventor
Tetsuo Yoshida
Yoshio Fujimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP20233687A priority Critical patent/JPS6445463A/en
Publication of JPS6445463A publication Critical patent/JPS6445463A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE:To obtain the titled composition, having excellent curability, electrical characteristics, etc., at high temperatures and humidifies and suitable for sealing semiconductors, etc., by blending an addition type polyimide prepared by addition polymerization of a specific bismaleimide with a diamine with a specific amount of a specified curing accelerator, etc. CONSTITUTION:A composition obtained by blending (A) 100pts.wt. reaction product prepared by addition polymerization of (A1) a bismaleimide expressed by formula I (R<1> is bifunctional organic group) with (A2) a diamine expressed by formula II (R<2> is bifunctional organic group) at 0.5-2, preferably 1-1.5 molar ratio (A1/A2) with (B) 0.1-3pts.wt. curing accelerator selected from imidazole compounds, phosphine compounds and peroxides, (C) 100-600pts.wt. crystalline or noncrystalline quartz, having >=98% purity and 5-50mum average particle diameter and containing <=0.2wt.% particles having >=200mum particle diameter and (D) 0.3-10pts.wt. silicone compound expressed by formula II (R<3>-R<5> are H, etc.; c is 1-3; a+b+c=4).
JP20233687A 1987-08-13 1987-08-13 Addition type polyimide polymer composition Pending JPS6445463A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20233687A JPS6445463A (en) 1987-08-13 1987-08-13 Addition type polyimide polymer composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20233687A JPS6445463A (en) 1987-08-13 1987-08-13 Addition type polyimide polymer composition

Publications (1)

Publication Number Publication Date
JPS6445463A true JPS6445463A (en) 1989-02-17

Family

ID=16455857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20233687A Pending JPS6445463A (en) 1987-08-13 1987-08-13 Addition type polyimide polymer composition

Country Status (1)

Country Link
JP (1) JPS6445463A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01203464A (en) * 1988-02-09 1989-08-16 Shin Etsu Chem Co Ltd Maleimide resin composition, its cured product and semiconductor device using same
JPH04359052A (en) * 1991-06-04 1992-12-11 Hitachi Chem Co Ltd Polyaminobismalemide resin composition and production of copper-clad laminate sheet using the same
JP2017214524A (en) * 2016-06-02 2017-12-07 日立化成株式会社 Thermosetting resin composition, prepreg, laminate, printed wiring board and semiconductor package
JP2021080457A (en) * 2021-01-13 2021-05-27 昭和電工マテリアルズ株式会社 Thermosetting resin composition, prepreg, laminate, printed wiring board, and semiconductor package

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5045096A (en) * 1973-08-28 1975-04-22
JPS5216156A (en) * 1975-07-30 1977-02-07 Hitachi Ltd Code conversion system
JPS5410988A (en) * 1977-06-27 1979-01-26 Nippon Telegr & Teleph Corp <Ntt> Flexible waveguide
JPS57103207A (en) * 1980-12-17 1982-06-26 Fujitsu Ltd Material for coating electronic components
JPS61258863A (en) * 1985-05-13 1986-11-17 Shin Etsu Chem Co Ltd Curable resin composition
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS62106927A (en) * 1985-11-01 1987-05-18 Mitsubishi Petrochem Co Ltd Heat-resistant resin composition
JPS63256652A (en) * 1987-04-14 1988-10-24 Mitsui Petrochem Ind Ltd Polyimide resin composition

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5045096A (en) * 1973-08-28 1975-04-22
JPS5216156A (en) * 1975-07-30 1977-02-07 Hitachi Ltd Code conversion system
JPS5410988A (en) * 1977-06-27 1979-01-26 Nippon Telegr & Teleph Corp <Ntt> Flexible waveguide
JPS57103207A (en) * 1980-12-17 1982-06-26 Fujitsu Ltd Material for coating electronic components
JPS61258863A (en) * 1985-05-13 1986-11-17 Shin Etsu Chem Co Ltd Curable resin composition
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS62106927A (en) * 1985-11-01 1987-05-18 Mitsubishi Petrochem Co Ltd Heat-resistant resin composition
JPS63256652A (en) * 1987-04-14 1988-10-24 Mitsui Petrochem Ind Ltd Polyimide resin composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01203464A (en) * 1988-02-09 1989-08-16 Shin Etsu Chem Co Ltd Maleimide resin composition, its cured product and semiconductor device using same
JPH04359052A (en) * 1991-06-04 1992-12-11 Hitachi Chem Co Ltd Polyaminobismalemide resin composition and production of copper-clad laminate sheet using the same
JP2017214524A (en) * 2016-06-02 2017-12-07 日立化成株式会社 Thermosetting resin composition, prepreg, laminate, printed wiring board and semiconductor package
JP2021080457A (en) * 2021-01-13 2021-05-27 昭和電工マテリアルズ株式会社 Thermosetting resin composition, prepreg, laminate, printed wiring board, and semiconductor package

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