JPS6435928A - Semiconductor inspection device - Google Patents

Semiconductor inspection device

Info

Publication number
JPS6435928A
JPS6435928A JP19081087A JP19081087A JPS6435928A JP S6435928 A JPS6435928 A JP S6435928A JP 19081087 A JP19081087 A JP 19081087A JP 19081087 A JP19081087 A JP 19081087A JP S6435928 A JPS6435928 A JP S6435928A
Authority
JP
Japan
Prior art keywords
semiconductor
semiconductor devices
data
characteristic curves
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19081087A
Other languages
Japanese (ja)
Other versions
JPH084102B2 (en
Inventor
Jun Murata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP62190810A priority Critical patent/JPH084102B2/en
Publication of JPS6435928A publication Critical patent/JPS6435928A/en
Publication of JPH084102B2 publication Critical patent/JPH084102B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To enable correct data on semiconductor devices to be collected by a method wherein the measured data on semiconductor devices are displayed as characteristic curves on a wafer map corresponding to the positions on a semiconductor wafer. CONSTITUTION:The title semiconductor inspecting device is composed of a measuring part 2, a storage part 3 and a display part 4. The data on multiple semiconductor devices measured by the measuring part 2 and stored in the storage part 3 are displayed by the display part 4 as characteristic curves 11 on a wafer map 10 corresponding to the positions on a semiconductor wafer 8 of the semiconductor device. Consequently, the shapes of the characteristic curves 11 of respective semiconductor devices can be compared with one another to collect data on the functions of the semiconductor devices.
JP62190810A 1987-07-30 1987-07-30 Semiconductor inspection equipment Expired - Lifetime JPH084102B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62190810A JPH084102B2 (en) 1987-07-30 1987-07-30 Semiconductor inspection equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62190810A JPH084102B2 (en) 1987-07-30 1987-07-30 Semiconductor inspection equipment

Publications (2)

Publication Number Publication Date
JPS6435928A true JPS6435928A (en) 1989-02-07
JPH084102B2 JPH084102B2 (en) 1996-01-17

Family

ID=16264125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62190810A Expired - Lifetime JPH084102B2 (en) 1987-07-30 1987-07-30 Semiconductor inspection equipment

Country Status (1)

Country Link
JP (1) JPH084102B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04159747A (en) * 1990-10-23 1992-06-02 Nec Corp Data control analyzation system
JP2006267029A (en) * 2005-03-25 2006-10-05 Aitesu:Kk Inspection apparatus displaying simultaneously a plurality of associated test results and the like on same screen
JP2007531922A (en) * 2003-07-11 2007-11-08 エムケーエス インスツルメンツ インコーポレイテッド Graphical representation with process quality indicators
WO2018121184A1 (en) * 2016-12-30 2018-07-05 上海华岭集成电路技术股份有限公司 Wafer test system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS562648A (en) * 1979-06-20 1981-01-12 Mitsubishi Electric Corp Method for describing position distribution figure of measured data
JPS5683045A (en) * 1979-12-10 1981-07-07 Nippon Maikuronikusu:Kk Wafer probe
JPS5817631A (en) * 1981-07-24 1983-02-01 Hitachi Ltd Inspecting device for semiconductor device
JPS59127844A (en) * 1983-01-12 1984-07-23 Toshiba Corp Test of semiconductor wafer
JPS61134036U (en) * 1985-02-08 1986-08-21

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS562648A (en) * 1979-06-20 1981-01-12 Mitsubishi Electric Corp Method for describing position distribution figure of measured data
JPS5683045A (en) * 1979-12-10 1981-07-07 Nippon Maikuronikusu:Kk Wafer probe
JPS5817631A (en) * 1981-07-24 1983-02-01 Hitachi Ltd Inspecting device for semiconductor device
JPS59127844A (en) * 1983-01-12 1984-07-23 Toshiba Corp Test of semiconductor wafer
JPS61134036U (en) * 1985-02-08 1986-08-21

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04159747A (en) * 1990-10-23 1992-06-02 Nec Corp Data control analyzation system
JP2007531922A (en) * 2003-07-11 2007-11-08 エムケーエス インスツルメンツ インコーポレイテッド Graphical representation with process quality indicators
JP4838125B2 (en) * 2003-07-11 2011-12-14 エムケーエス インスツルメンツ，インコーポレイテッド GUI and program for process quality display
JP2006267029A (en) * 2005-03-25 2006-10-05 Aitesu:Kk Inspection apparatus displaying simultaneously a plurality of associated test results and the like on same screen
WO2018121184A1 (en) * 2016-12-30 2018-07-05 上海华岭集成电路技术股份有限公司 Wafer test system
GB2567968A (en) * 2016-12-30 2019-05-01 Sino Ic Tech Co Ltd Wafer test system

Also Published As

Publication number Publication date
JPH084102B2 (en) 1996-01-17

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