JPS6431498A - Method of sealing hybrid ic with resin - Google Patents

Method of sealing hybrid ic with resin

Info

Publication number
JPS6431498A
JPS6431498A JP18808887A JP18808887A JPS6431498A JP S6431498 A JPS6431498 A JP S6431498A JP 18808887 A JP18808887 A JP 18808887A JP 18808887 A JP18808887 A JP 18808887A JP S6431498 A JPS6431498 A JP S6431498A
Authority
JP
Japan
Prior art keywords
hybrid
resin
resin powder
adhesive
peripheral edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18808887A
Other languages
Japanese (ja)
Inventor
Minoru Fukumori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP18808887A priority Critical patent/JPS6431498A/en
Publication of JPS6431498A publication Critical patent/JPS6431498A/en
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

PURPOSE:To improve insulation and reliability by applying an adhesive on the peripheral edge of surface mount parts before impregnating a hybrid IC in resin power and rounding off the corner part of the printed board. CONSTITUTION:A hybrid IC 1 is constructed by allowing terminal forming discrete parts 3a such as a power transistor connected with a terminal 6 to be packaged on a printed circuit board 5 as surface mounting parts 3. First, an adhesive 4 is applied on the peripheral edge of the surface mounting parts 3 before impregnating the hybrid IC in resin powder. Thereupon, the adhesive 4 is applied on the peripheral edge of the surface mounting parts 3 which is tall preferentially. In addition, the corner part 5a of the printed circuit board 5 is rounded off. Thereafter, the hybrid IC is heated over about 150 deg.C its surface by a heater and the like. In succession, the hybrid IC is impregnated in resin powder such as epoxy resin powder and coated with the resin powder. This is repeated 3-4 times. Finally, it is again heated over 150 deg.C by the heater to form a resin-coated film 2, thereby sealing the hybrid IC 1 with the resin.
JP18808887A 1987-07-28 1987-07-28 Method of sealing hybrid ic with resin Pending JPS6431498A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18808887A JPS6431498A (en) 1987-07-28 1987-07-28 Method of sealing hybrid ic with resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18808887A JPS6431498A (en) 1987-07-28 1987-07-28 Method of sealing hybrid ic with resin

Publications (1)

Publication Number Publication Date
JPS6431498A true JPS6431498A (en) 1989-02-01

Family

ID=16217492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18808887A Pending JPS6431498A (en) 1987-07-28 1987-07-28 Method of sealing hybrid ic with resin

Country Status (1)

Country Link
JP (1) JPS6431498A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5223171A (en) * 1990-07-02 1993-06-29 Rhone Poulenc Chimie Detergent composition containing a biodegradable graft polysaccharide

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5223171A (en) * 1990-07-02 1993-06-29 Rhone Poulenc Chimie Detergent composition containing a biodegradable graft polysaccharide

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