JPS6429416A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS6429416A JPS6429416A JP18499387A JP18499387A JPS6429416A JP S6429416 A JPS6429416 A JP S6429416A JP 18499387 A JP18499387 A JP 18499387A JP 18499387 A JP18499387 A JP 18499387A JP S6429416 A JPS6429416 A JP S6429416A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- thixotropic
- sealant
- filler
- dispersion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To obtain the title compsn. which is highly thixotropic and excellent in shape retention and is useful for IC sealant for chip-on-board, by mixing an epoxy resin with a specified curing agent, a cure accelerator, a filler and an fine silica powder which has been made hydrophobic as a thixotropic agent by dispersion. CONSTITUTION:One-pack epoxy resin compsn. contg. a hydrazinotriazine curing agent, an imidazole cure accelerator and a filler is mixed with a fine silica powder (SiO2 whose affinity for water has been decreased by methylating its surface) as a thixotropic agent by dispersion to give an epoxy resin compsn. which is highly thixotropic, excellent in shape retention and yet free from an extremely increased viscosity and a worsened defoaming property and is useful for IC sealant for chip-on-board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62184993A JP2515344B2 (en) | 1987-07-24 | 1987-07-24 | One-part liquid epoxy resin composition for sealing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62184993A JP2515344B2 (en) | 1987-07-24 | 1987-07-24 | One-part liquid epoxy resin composition for sealing |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6429416A true JPS6429416A (en) | 1989-01-31 |
JP2515344B2 JP2515344B2 (en) | 1996-07-10 |
Family
ID=16162910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62184993A Expired - Lifetime JP2515344B2 (en) | 1987-07-24 | 1987-07-24 | One-part liquid epoxy resin composition for sealing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2515344B2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0724289A3 (en) * | 1995-01-30 | 1996-12-04 | Matsushita Electric Ind Co Ltd | Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging |
WO1996042106A1 (en) * | 1995-06-12 | 1996-12-27 | Matsushita Electric Industrial Co., Ltd. | Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging |
WO1999036484A1 (en) * | 1998-01-16 | 1999-07-22 | Loctite (R & D) Limited | Curable epoxy-based compositions |
US6653371B1 (en) | 1998-01-16 | 2003-11-25 | Barry E. Burns | One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid |
US6872762B2 (en) | 2000-07-13 | 2005-03-29 | Loctite (R&D) Limited | Epoxy resin composition with solid organic acid |
JP2008207403A (en) * | 2007-02-23 | 2008-09-11 | Matsushita Electric Works Ltd | Manufacturing method of thermosetting resin molding |
CN103275664A (en) * | 2013-06-17 | 2013-09-04 | 漳州丽都化工有限公司 | Quartz clock outer frame coating glue as well as preparation and use method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60127702A (en) * | 1983-11-17 | 1985-07-08 | チバ‐ガイギー アクチエンゲゼルシヤフト | Method of using 1-component epoxy resin coating material forhardening fixed resistor |
JPS6123666A (en) * | 1984-07-13 | 1986-02-01 | Hitachi Ltd | Plating-resistant solder resist ink composition |
-
1987
- 1987-07-24 JP JP62184993A patent/JP2515344B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60127702A (en) * | 1983-11-17 | 1985-07-08 | チバ‐ガイギー アクチエンゲゼルシヤフト | Method of using 1-component epoxy resin coating material forhardening fixed resistor |
JPS6123666A (en) * | 1984-07-13 | 1986-02-01 | Hitachi Ltd | Plating-resistant solder resist ink composition |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0724289A3 (en) * | 1995-01-30 | 1996-12-04 | Matsushita Electric Ind Co Ltd | Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging |
EP0878839A1 (en) * | 1995-01-30 | 1998-11-18 | Matsushita Electric Industrial Co., Ltd. | Semiconductor unit package and semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging |
EP1154470A3 (en) * | 1995-01-30 | 2001-12-19 | Matsushita Electric Industrial Co., Ltd. | Semiconductor unit packaging method |
WO1996042106A1 (en) * | 1995-06-12 | 1996-12-27 | Matsushita Electric Industrial Co., Ltd. | Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging |
WO1999036484A1 (en) * | 1998-01-16 | 1999-07-22 | Loctite (R & D) Limited | Curable epoxy-based compositions |
US6653371B1 (en) | 1998-01-16 | 2003-11-25 | Barry E. Burns | One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid |
US6872762B2 (en) | 2000-07-13 | 2005-03-29 | Loctite (R&D) Limited | Epoxy resin composition with solid organic acid |
JP2008207403A (en) * | 2007-02-23 | 2008-09-11 | Matsushita Electric Works Ltd | Manufacturing method of thermosetting resin molding |
CN103275664A (en) * | 2013-06-17 | 2013-09-04 | 漳州丽都化工有限公司 | Quartz clock outer frame coating glue as well as preparation and use method thereof |
Also Published As
Publication number | Publication date |
---|---|
JP2515344B2 (en) | 1996-07-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080430 Year of fee payment: 12 |