JPS6422093A - Resin composition for printed wiring board - Google Patents

Resin composition for printed wiring board

Info

Publication number
JPS6422093A
JPS6422093A JP17871787A JP17871787A JPS6422093A JP S6422093 A JPS6422093 A JP S6422093A JP 17871787 A JP17871787 A JP 17871787A JP 17871787 A JP17871787 A JP 17871787A JP S6422093 A JPS6422093 A JP S6422093A
Authority
JP
Japan
Prior art keywords
printed wiring
polybutadiene
resin composition
epoxidized
phenol resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17871787A
Other languages
Japanese (ja)
Inventor
Hiroichi Motai
Shunkichi Koike
Toshiya Kawabe
Isao Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Sheet Glass Co Ltd
Original Assignee
Nippon Sheet Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Sheet Glass Co Ltd filed Critical Nippon Sheet Glass Co Ltd
Priority to JP17871787A priority Critical patent/JPS6422093A/en
Publication of JPS6422093A publication Critical patent/JPS6422093A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE:To improve the adhesion of a metal foil, by making the resin composition for a printed wiring board contain epoxidized 1, 4 polybutadiene having hydroxyl group at the end and phenol resin, the printed wiring board being formed by laminating a prepreg impregnated with thermosetting resin composition, and a metal foil. CONSTITUTION:A printed wiring 1 is formed by the following process. First, for example, 1, 4 polybutadiene having hydroxyl group at the end is epoxidized to obtain epoxidized 1, 4 polybutadiene, which is dissolved in a solvent together with resin composition containing phenol resin. With this solution, a glass nonwoven fabric 3 or a glass woven fabric 4 is impregnated to prepare prepregs. There are laminated, and thereon copper foils 6, 6 are stacked and subjected to thermocompression bonding. For the epoxidized 1, 4 polybutadiene, the following are preferable; molecular weight is 1000-3000, 1, 4 bonding is more than or equal to 70%, and epoxy equivalent is 200-1500. For the phenol resin, the following are used; tetrabromobisphenol A, novolak type phenol resin, and the mixture of them. Considering flame retardancy, tetrabromobisphenol A is preferable.
JP17871787A 1987-07-17 1987-07-17 Resin composition for printed wiring board Pending JPS6422093A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17871787A JPS6422093A (en) 1987-07-17 1987-07-17 Resin composition for printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17871787A JPS6422093A (en) 1987-07-17 1987-07-17 Resin composition for printed wiring board

Publications (1)

Publication Number Publication Date
JPS6422093A true JPS6422093A (en) 1989-01-25

Family

ID=16053331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17871787A Pending JPS6422093A (en) 1987-07-17 1987-07-17 Resin composition for printed wiring board

Country Status (1)

Country Link
JP (1) JPS6422093A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0467928U (en) * 1990-10-22 1992-06-16
US5124950A (en) * 1989-09-20 1992-06-23 Fujitsu Limited Multi-port semiconductor memory
JP2008244301A (en) * 2007-03-28 2008-10-09 Mitsubishi Electric Corp Electronic apparatus
JP2017115020A (en) * 2015-12-24 2017-06-29 日立化成株式会社 Thermosetting resin composition, prepreg, copper-clad laminate and printed wiring board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5124950A (en) * 1989-09-20 1992-06-23 Fujitsu Limited Multi-port semiconductor memory
JPH0467928U (en) * 1990-10-22 1992-06-16
JP2008244301A (en) * 2007-03-28 2008-10-09 Mitsubishi Electric Corp Electronic apparatus
JP2017115020A (en) * 2015-12-24 2017-06-29 日立化成株式会社 Thermosetting resin composition, prepreg, copper-clad laminate and printed wiring board

Similar Documents

Publication Publication Date Title
KR840008609A (en) Flame Retardant Board
EP0374514A3 (en) Curable dielectric polyphenylene ether-polyepoxide compositions useful in printed circuit board production
EP0294232A3 (en) An epoxy resin multi-layer laminate
JPS6422093A (en) Resin composition for printed wiring board
JP2692508B2 (en) Manufacturing method of laminated board
JP2612129B2 (en) Laminated board
IE850184L (en) Circuit boards made of laminates
JPS61179221A (en) Epoxy glass/copper laminate
EP0373363A2 (en) Filling of vias in a metallic plane
JPS6422094A (en) Resin composition for printed wiring board
JP2663596B2 (en) Copper clad laminate
JP2950969B2 (en) Manufacturing method of laminated board
JP2935329B2 (en) Manufacturing method of metal foil clad laminate
SE8902491D0 (en) POLYEPOXIDE AND POLYPHENYLENE ETHER-POLYEPOXIDE COMPOSITIONS USEFUL IN PRINTED CIRCUIT BOARD PRODUCTION
JPS6334104A (en) Manufacture of epoxy resin laminated sheet
ES8702105A1 (en) Method for the production of printed circuit boards with more than four conductive layers.
JPS61209234A (en) Epoxy resin laminate
JPH06112611A (en) Laminated board for printed circuit
JPH0244798A (en) Manufacture of multilayer interconnection board
JPH10219010A (en) Production of prepreg for copper-clad laminate
JPS61138621A (en) Production of epoxy resin laminated board
JPS56122826A (en) Epoxy resin composition for laminate
JPH03227332A (en) Production of laminated board
JPS6195934A (en) Copper lined laminated board
JPS6225505B2 (en)