JPS6421978A - Mounting of magnetic detector - Google Patents
Mounting of magnetic detectorInfo
- Publication number
- JPS6421978A JPS6421978A JP62177512A JP17751287A JPS6421978A JP S6421978 A JPS6421978 A JP S6421978A JP 62177512 A JP62177512 A JP 62177512A JP 17751287 A JP17751287 A JP 17751287A JP S6421978 A JPS6421978 A JP S6421978A
- Authority
- JP
- Japan
- Prior art keywords
- bump
- layer
- gold
- solder
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Hall/Mr Elements (AREA)
Abstract
PURPOSE:To increase the mechanical strength of an electrical connection part and to improve the reliability of the connection part by a method wherein a gold bump is formed on the external connecting terminals of a magnetic detector and the gold bump and a lead wire and are connected electrically to each other utilizing a solder bump, which is formed on the gold bump or is formed on the nonmagnetic metal lead wire having a solder layer adhering to its surface. CONSTITUTION:A gold bump 13 made by laminating an adhesive layer 14, a barrier layer 15, a gold thin film layer 16 and a gold-plated layer 17 in the order of the layers 14, 15, 16 and 17 is formed on external connecting terminals 4-1-4-4 formed integrally with a magnetic detecting pattern 5 and a solder layer 19 is formed on the surface of an external lead wire 18 consisting of a nonmagnetic metal. A solder bump 20 is formed on the above bump 13 or layer 19 and the bump 13 and the wire 18 are connected to each other utilizing the bump 20. For example, an unnecessary part of a protective layer 8 is removed and after a Cr film 21, a Cu film 22 and an Au film 23 adhere in order, a resist pattern 24 adheres and unnecessary parts of the films 21-23 are removed to form the bump 13. Then, after the pattern 24 is removed, the layer 17 is formed on the layer 16 and the bump 20 adheres thereto.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62177512A JPS6421978A (en) | 1987-07-16 | 1987-07-16 | Mounting of magnetic detector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62177512A JPS6421978A (en) | 1987-07-16 | 1987-07-16 | Mounting of magnetic detector |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6421978A true JPS6421978A (en) | 1989-01-25 |
Family
ID=16032202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62177512A Pending JPS6421978A (en) | 1987-07-16 | 1987-07-16 | Mounting of magnetic detector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6421978A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0685347A (en) * | 1992-09-03 | 1994-03-25 | Mitsubishi Electric Corp | Magnetic sensor |
-
1987
- 1987-07-16 JP JP62177512A patent/JPS6421978A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0685347A (en) * | 1992-09-03 | 1994-03-25 | Mitsubishi Electric Corp | Magnetic sensor |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3781596A (en) | Semiconductor chip carriers and strips thereof | |
WO1986006878A1 (en) | Magneto-electric converter element | |
JPH02500231A (en) | Method for producing electronic module circuit tape and tape obtained by this method | |
US6452258B1 (en) | Ultra-thin composite surface finish for electronic packaging | |
US4668581A (en) | Bonding electrical conductors and bonded products | |
JPS63106910A (en) | Thin film magnetic head | |
EP0559384A3 (en) | Devices with tape automated bonding | |
JPS6421978A (en) | Mounting of magnetic detector | |
EP0193907A3 (en) | Hybrid and multi-layer circuitry | |
EP0357050A2 (en) | Assembly packing method for sensor element | |
US6124642A (en) | Lead structure for a semiconductor device with an isolating protective layer and method of fabricating the same | |
JPH01164044A (en) | Mounting of chip | |
JP2654032B2 (en) | Method for manufacturing semiconductor IC device | |
EP0587296A1 (en) | Tab tape and method for producing it | |
JPS57164552A (en) | Lead-frame for semiconductor device | |
JPH02106059A (en) | Lead frame and its manufacture | |
JPS62128133A (en) | Manufacture of semiconductor device | |
JPS556862A (en) | Mounting structure of ic for electronic timepiece | |
JPS54146960A (en) | Semiconductor device | |
JPS5838610Y2 (en) | semiconductor equipment | |
JPS594195A (en) | Structure of circuit board | |
JPH02121360A (en) | Electronic component mounting substrate | |
EP1204305A2 (en) | Device comprising an electrical circuit carried by a carrier element and method for the manufacture of such a device | |
JPS63296346A (en) | Film carrier for semiconductor device | |
JPS558363A (en) | Thermocompression bonding method |