JPS6421978A - Mounting of magnetic detector - Google Patents

Mounting of magnetic detector

Info

Publication number
JPS6421978A
JPS6421978A JP62177512A JP17751287A JPS6421978A JP S6421978 A JPS6421978 A JP S6421978A JP 62177512 A JP62177512 A JP 62177512A JP 17751287 A JP17751287 A JP 17751287A JP S6421978 A JPS6421978 A JP S6421978A
Authority
JP
Japan
Prior art keywords
bump
layer
gold
solder
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62177512A
Other languages
Japanese (ja)
Inventor
Yuji Kojima
Michiko Endou
Shigemi Kurashima
Shinkichi Shimizu
Noboru Wakatsuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62177512A priority Critical patent/JPS6421978A/en
Publication of JPS6421978A publication Critical patent/JPS6421978A/en
Pending legal-status Critical Current

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  • Hall/Mr Elements (AREA)

Abstract

PURPOSE:To increase the mechanical strength of an electrical connection part and to improve the reliability of the connection part by a method wherein a gold bump is formed on the external connecting terminals of a magnetic detector and the gold bump and a lead wire and are connected electrically to each other utilizing a solder bump, which is formed on the gold bump or is formed on the nonmagnetic metal lead wire having a solder layer adhering to its surface. CONSTITUTION:A gold bump 13 made by laminating an adhesive layer 14, a barrier layer 15, a gold thin film layer 16 and a gold-plated layer 17 in the order of the layers 14, 15, 16 and 17 is formed on external connecting terminals 4-1-4-4 formed integrally with a magnetic detecting pattern 5 and a solder layer 19 is formed on the surface of an external lead wire 18 consisting of a nonmagnetic metal. A solder bump 20 is formed on the above bump 13 or layer 19 and the bump 13 and the wire 18 are connected to each other utilizing the bump 20. For example, an unnecessary part of a protective layer 8 is removed and after a Cr film 21, a Cu film 22 and an Au film 23 adhere in order, a resist pattern 24 adheres and unnecessary parts of the films 21-23 are removed to form the bump 13. Then, after the pattern 24 is removed, the layer 17 is formed on the layer 16 and the bump 20 adheres thereto.
JP62177512A 1987-07-16 1987-07-16 Mounting of magnetic detector Pending JPS6421978A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62177512A JPS6421978A (en) 1987-07-16 1987-07-16 Mounting of magnetic detector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62177512A JPS6421978A (en) 1987-07-16 1987-07-16 Mounting of magnetic detector

Publications (1)

Publication Number Publication Date
JPS6421978A true JPS6421978A (en) 1989-01-25

Family

ID=16032202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62177512A Pending JPS6421978A (en) 1987-07-16 1987-07-16 Mounting of magnetic detector

Country Status (1)

Country Link
JP (1) JPS6421978A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0685347A (en) * 1992-09-03 1994-03-25 Mitsubishi Electric Corp Magnetic sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0685347A (en) * 1992-09-03 1994-03-25 Mitsubishi Electric Corp Magnetic sensor

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