JPS6421082A - Production of powdery plated material - Google Patents
Production of powdery plated materialInfo
- Publication number
- JPS6421082A JPS6421082A JP62174919A JP17491987A JPS6421082A JP S6421082 A JPS6421082 A JP S6421082A JP 62174919 A JP62174919 A JP 62174919A JP 17491987 A JP17491987 A JP 17491987A JP S6421082 A JPS6421082 A JP S6421082A
- Authority
- JP
- Japan
- Prior art keywords
- suspension
- powdery
- production
- powder
- silica
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title abstract 2
- 239000000725 suspension Substances 0.000 abstract 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 239000000843 powder Substances 0.000 abstract 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 2
- 238000007772 electroless plating Methods 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
Abstract
PURPOSE:To obtain a uniform plating film contg. silica, etc., and to increase the lightness when the surface of powder in an aq. suspension is brought into an electroless plating reaction, by adding silica sol, etc., to the suspension. CONSTITUTION:Powder of a base material to be plated is put in an aq. soln. to prepare an aq. suspension and the surface of the powder in the suspension is brought into an electroless plating reaction. At this time, silica sol and/or alumina sol is added to the suspension and a uniform plating film contg. silica and/or alumina is obtd.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62174919A JPS6421082A (en) | 1987-07-15 | 1987-07-15 | Production of powdery plated material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62174919A JPS6421082A (en) | 1987-07-15 | 1987-07-15 | Production of powdery plated material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6421082A true JPS6421082A (en) | 1989-01-24 |
Family
ID=15987004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62174919A Pending JPS6421082A (en) | 1987-07-15 | 1987-07-15 | Production of powdery plated material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6421082A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004124261A (en) * | 2002-10-04 | 2004-04-22 | Enthone Inc | Electroless precipitation method for metal |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6059070A (en) * | 1983-09-12 | 1985-04-05 | Nippon Chem Ind Co Ltd:The | Manufacture of plated fine grain |
JPS60177182A (en) * | 1984-02-23 | 1985-09-11 | Nippon Chem Ind Co Ltd:The | Electroless plating liquid and plating method using said liquid |
JPS61113772A (en) * | 1984-11-09 | 1986-05-31 | Sumitomo Chem Co Ltd | Composite for forming transparent conductive film |
JPS61276979A (en) * | 1985-05-30 | 1986-12-06 | Nippon Chem Ind Co Ltd:The | Manufacture of nickel plated material |
JPS6230885A (en) * | 1985-04-01 | 1987-02-09 | Nippon Chem Ind Co Ltd:The | Production of nickel plated material |
JPS6233783A (en) * | 1985-08-06 | 1987-02-13 | Ube Ind Ltd | Coating layer for metallic magnesium molding and its production |
-
1987
- 1987-07-15 JP JP62174919A patent/JPS6421082A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6059070A (en) * | 1983-09-12 | 1985-04-05 | Nippon Chem Ind Co Ltd:The | Manufacture of plated fine grain |
JPS60177182A (en) * | 1984-02-23 | 1985-09-11 | Nippon Chem Ind Co Ltd:The | Electroless plating liquid and plating method using said liquid |
JPS61113772A (en) * | 1984-11-09 | 1986-05-31 | Sumitomo Chem Co Ltd | Composite for forming transparent conductive film |
JPS6230885A (en) * | 1985-04-01 | 1987-02-09 | Nippon Chem Ind Co Ltd:The | Production of nickel plated material |
JPS61276979A (en) * | 1985-05-30 | 1986-12-06 | Nippon Chem Ind Co Ltd:The | Manufacture of nickel plated material |
JPS6233783A (en) * | 1985-08-06 | 1987-02-13 | Ube Ind Ltd | Coating layer for metallic magnesium molding and its production |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004124261A (en) * | 2002-10-04 | 2004-04-22 | Enthone Inc | Electroless precipitation method for metal |
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