JPS6419794A - Method of soldering electronic component - Google Patents
Method of soldering electronic componentInfo
- Publication number
- JPS6419794A JPS6419794A JP17497687A JP17497687A JPS6419794A JP S6419794 A JPS6419794 A JP S6419794A JP 17497687 A JP17497687 A JP 17497687A JP 17497687 A JP17497687 A JP 17497687A JP S6419794 A JPS6419794 A JP S6419794A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- tin
- section
- rosinate
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To perform a soldering at a low temperature so as to prevent an electronic component from being damaged to heat and plastic coating after soldering for prevention of the erosion of the part, by a method wherein a contact part of a pad section with a lead section is dipped into a heated solution which consists of a solvent which dissolves lead rosinate or tin lead rosinate in it. CONSTITUTION:An electronic component is mounted on a printed substrate 11 and a pad section 13 is made to be in contact with a lead section 14. A contacting part is dipped into a heated lead rosinate solution 18. Tin plating 19 is performed on the surface of the pad section 13 and a copper-tin alloy layer 20 is formed on the interface. Such the contacting section is dipped into a lead rosinate solution 18, where tin of the tin plated face 19 is replaced with lead which separates out at the face and tin diffuses into lead separated out for the formation of solder. The copper-tin alloy layer 20 of the pad section 13 is made to be exposed at the part around a solidified solder 21, where tin plating vanishes. A plastic coating 23 is performed on the surface so as to prevent erosion from taking place at the exposed part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17497687A JPS6419794A (en) | 1987-07-15 | 1987-07-15 | Method of soldering electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17497687A JPS6419794A (en) | 1987-07-15 | 1987-07-15 | Method of soldering electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6419794A true JPS6419794A (en) | 1989-01-23 |
Family
ID=15988036
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17497687A Pending JPS6419794A (en) | 1987-07-15 | 1987-07-15 | Method of soldering electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6419794A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2171753A1 (en) * | 2007-06-28 | 2010-04-07 | Agere Systems Inc. | Inhibition of copper dissolution for lead-free soldering |
DE102017200782B4 (en) | 2016-03-29 | 2021-11-11 | Mitsubishi Electric Corporation | Power reuse field effect transistor amplifier |
-
1987
- 1987-07-15 JP JP17497687A patent/JPS6419794A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2171753A1 (en) * | 2007-06-28 | 2010-04-07 | Agere Systems Inc. | Inhibition of copper dissolution for lead-free soldering |
EP2171753A4 (en) * | 2007-06-28 | 2010-09-08 | Agere Systems Inc | Inhibition of copper dissolution for lead-free soldering |
DE102017200782B4 (en) | 2016-03-29 | 2021-11-11 | Mitsubishi Electric Corporation | Power reuse field effect transistor amplifier |
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