JPS6418781U - - Google Patents
Info
- Publication number
- JPS6418781U JPS6418781U JP11424887U JP11424887U JPS6418781U JP S6418781 U JPS6418781 U JP S6418781U JP 11424887 U JP11424887 U JP 11424887U JP 11424887 U JP11424887 U JP 11424887U JP S6418781 U JPS6418781 U JP S6418781U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- electronic component
- lead terminals
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案になるプリント基板の一実施例
を示す接続パターン部付近の拡大平面図、第２図
は従来の電子部品を実装したプリント基板の一部
外観斜視図、第３図は従来のプリント基板の接続
パターン部付近の拡大平面図である。
２……パターン銅箔、４……電子部品、４ａ…
…本体部、５……リード端子、１０……接続パタ
ーン部、１０ａ……半田付け部分。
Fig. 1 is an enlarged plan view of the vicinity of the connection pattern showing an embodiment of the printed circuit board according to the present invention, Fig. 2 is a partial external perspective view of a conventional printed circuit board on which electronic components are mounted, and Fig. 3 is a conventional FIG. 3 is an enlarged plan view of the vicinity of the connection pattern portion of the printed circuit board. 2...Patterned copper foil, 4...Electronic component, 4a...
...Body part, 5...Lead terminal, 10...Connection pattern part, 10a...Soldering part.
Claims (1)
本のリード端子を有する電子部品が面実装される
プリント基板において、前記電子部品のリード端
子が半田付けされる接続パターン部の半田付け部
分を隣設するもの同士が互いに近接しないようパ
ターン方向にずらして配置したことを特徴とする
プリント基板。 In a printed circuit board on which an electronic component having a plurality of lead terminals led out from the side surface of the main body toward the mounting surface is surface-mounted, the soldered portion of the connection pattern portion to which the lead terminals of the electronic component are soldered is placed next to the printed circuit board. What is claimed is: 1. A printed circuit board characterized in that the printed circuit boards are staggered in the pattern direction so that they do not come close to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11424887U JPS6418781U (en) | 1987-07-25 | 1987-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11424887U JPS6418781U (en) | 1987-07-25 | 1987-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6418781U true JPS6418781U (en) | 1989-01-30 |
Family
ID=31354823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11424887U Pending JPS6418781U (en) | 1987-07-25 | 1987-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6418781U (en) |
-
1987
- 1987-07-25 JP JP11424887U patent/JPS6418781U/ja active Pending