JPS6418294A - Flexible printed circuit board - Google Patents

Flexible printed circuit board

Info

Publication number
JPS6418294A
JPS6418294A JP17383187A JP17383187A JPS6418294A JP S6418294 A JPS6418294 A JP S6418294A JP 17383187 A JP17383187 A JP 17383187A JP 17383187 A JP17383187 A JP 17383187A JP S6418294 A JPS6418294 A JP S6418294A
Authority
JP
Japan
Prior art keywords
polyimide
heat
anhydride
copper foil
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17383187A
Other languages
Japanese (ja)
Other versions
JPH0366825B2 (en
Inventor
Sumitoshi Asakuma
Akira Toko
Toshiro Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP17383187A priority Critical patent/JPS6418294A/en
Publication of JPS6418294A publication Critical patent/JPS6418294A/en
Publication of JPH0366825B2 publication Critical patent/JPH0366825B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To improve heat-resistant properties, electric characteristics and so forth by a method wherein specific polyamic acid solution is spread and applied on a copper foil and cured by heat to form a copper/polyimide laminated unit and the polyamide side surfaces of the two laminated units are bonded together with polyester system adhesive. CONSTITUTION:Polyamic acid solution which is obtained by a reaction between tetracarbonic acid di-anhydride component composed of 50-80mol% of 3,3', 4,4'-biphenyl tetracarbonic acid di-anhydride and 50-20mol% of pyromeric acid di-anhydride and diamine component composed of 50-80mol% of paraphenylene diamine and 50-20mol% of 4,4'-diamino-diphenylether is spread and applied on a copper foil. The applied solution is cured by heat to form a copper/polyimide laminated unit. The polyimide side surfaces of the two laminated units are bonded together with polyester system adhesive. With this constitution, as there is no adhesive layer between the copper foil circuit layer and the polyimide layer, heat-resistant properties, electric characteristics and so forth can be improved.
JP17383187A 1987-07-14 1987-07-14 Flexible printed circuit board Granted JPS6418294A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17383187A JPS6418294A (en) 1987-07-14 1987-07-14 Flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17383187A JPS6418294A (en) 1987-07-14 1987-07-14 Flexible printed circuit board

Publications (2)

Publication Number Publication Date
JPS6418294A true JPS6418294A (en) 1989-01-23
JPH0366825B2 JPH0366825B2 (en) 1991-10-18

Family

ID=15967963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17383187A Granted JPS6418294A (en) 1987-07-14 1987-07-14 Flexible printed circuit board

Country Status (1)

Country Link
JP (1) JPS6418294A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0411772A2 (en) * 1989-07-31 1991-02-06 Chisso Corporation Flexible printed-circuit base board and process for producing the same
JPH05105777A (en) * 1991-10-15 1993-04-27 Sumitomo Bakelite Co Ltd Polyisoimide film and production of substrate for flexible printed circuit with the same
JPH05105755A (en) * 1991-10-15 1993-04-27 Sumitomo Bakelite Co Ltd Polyisoimide and its film
JP2011014727A (en) * 2009-07-02 2011-01-20 Mitsui Mining & Smelting Co Ltd Copper foil with composite resin layer, method of manufacturing the same, and method of manufacturing flexible double-sided copper clad laminate and solid molding printed wiring board
JP2012522863A (en) * 2009-04-03 2012-09-27 ドゥーサン コーポレイション Polyamic acid solution, polyimide resin, and flexible metal foil-clad laminate using the same
DE102021115741A1 (en) 2020-06-23 2021-12-23 Makita Corporation Fastening tool

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0411772A2 (en) * 1989-07-31 1991-02-06 Chisso Corporation Flexible printed-circuit base board and process for producing the same
JPH05105777A (en) * 1991-10-15 1993-04-27 Sumitomo Bakelite Co Ltd Polyisoimide film and production of substrate for flexible printed circuit with the same
JPH05105755A (en) * 1991-10-15 1993-04-27 Sumitomo Bakelite Co Ltd Polyisoimide and its film
JP2012522863A (en) * 2009-04-03 2012-09-27 ドゥーサン コーポレイション Polyamic acid solution, polyimide resin, and flexible metal foil-clad laminate using the same
JP2011014727A (en) * 2009-07-02 2011-01-20 Mitsui Mining & Smelting Co Ltd Copper foil with composite resin layer, method of manufacturing the same, and method of manufacturing flexible double-sided copper clad laminate and solid molding printed wiring board
DE102021115741A1 (en) 2020-06-23 2021-12-23 Makita Corporation Fastening tool

Also Published As

Publication number Publication date
JPH0366825B2 (en) 1991-10-18

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