JPS6416611A - Dicing device for semiconductive wafer - Google Patents
Dicing device for semiconductive waferInfo
- Publication number
- JPS6416611A JPS6416611A JP17218487A JP17218487A JPS6416611A JP S6416611 A JPS6416611 A JP S6416611A JP 17218487 A JP17218487 A JP 17218487A JP 17218487 A JP17218487 A JP 17218487A JP S6416611 A JPS6416611 A JP S6416611A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- cooling
- dicing stage
- diamond blade
- semiconductive wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/02—Devices for lubricating or cooling circular saw blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
PURPOSE:To prevent the temperature rising of a diamond blade, while the friction heat between the diamond blade and a wafer sheet is easily diffused by providing the mechanism for cooling the semiconductive wafer in a dicing stage. CONSTITUTION:The ejecting nozzle 2 ejecting cooling wafer adjacently to a diamond blade 1 in contact with the part to be cut of a semiconductive wafer 3, is provided in a dicing stage 5. The dicing stage 5 includes the cooling pipe 6 for cooling the semiconductive wafer 3. For the cooling medium flowing in this cooling pipe 6, wafer or the oil cooled at most to 0 deg.C, etc., is used. In order to cool uniformly the total surface of the dicing stage 5, the high heat conductive material such as SiC ceramic or copper, etc., is used as the material of the dicing stage 5, and its surface is polished as flatly as possible. Thus, by providing the mechanism for cooling the semiconductive wafer 3 in the dicing stage 5, the friction heat built up in the wafer sheet 7, etc., is removed, whereby the life of the diamond blade 1 can be extended.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17218487A JPS6416611A (en) | 1987-07-10 | 1987-07-10 | Dicing device for semiconductive wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17218487A JPS6416611A (en) | 1987-07-10 | 1987-07-10 | Dicing device for semiconductive wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6416611A true JPS6416611A (en) | 1989-01-20 |
Family
ID=15937134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17218487A Pending JPS6416611A (en) | 1987-07-10 | 1987-07-10 | Dicing device for semiconductive wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6416611A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06132396A (en) * | 1992-10-19 | 1994-05-13 | Rohm Co Ltd | Dicing method |
US6105567A (en) * | 1997-05-29 | 2000-08-22 | Samsung Electronics Co., Ltd. | Wafer sawing apparatus having washing solution spray and suction devices for debris removal and heat dissipation |
KR100699542B1 (en) * | 2006-07-31 | 2007-03-23 | 신성공업주식회사 | Device for manufacturing of transformer |
JP2010093005A (en) * | 2008-10-07 | 2010-04-22 | Disco Abrasive Syst Ltd | Processing method of wafer |
US8049018B2 (en) | 2006-03-13 | 2011-11-01 | Kabushiki Kaisha Hayashibara Seibutsu Kagaku Kenkyujo | Methine dyes and uses of the same |
KR200470836Y1 (en) * | 2011-12-29 | 2014-01-13 | 세메스 주식회사 | Work table for sawing a electronic component |
JP2015061016A (en) * | 2013-09-20 | 2015-03-30 | Towa株式会社 | Cutting device and cutting method |
-
1987
- 1987-07-10 JP JP17218487A patent/JPS6416611A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06132396A (en) * | 1992-10-19 | 1994-05-13 | Rohm Co Ltd | Dicing method |
US6105567A (en) * | 1997-05-29 | 2000-08-22 | Samsung Electronics Co., Ltd. | Wafer sawing apparatus having washing solution spray and suction devices for debris removal and heat dissipation |
US8049018B2 (en) | 2006-03-13 | 2011-11-01 | Kabushiki Kaisha Hayashibara Seibutsu Kagaku Kenkyujo | Methine dyes and uses of the same |
KR100699542B1 (en) * | 2006-07-31 | 2007-03-23 | 신성공업주식회사 | Device for manufacturing of transformer |
JP2010093005A (en) * | 2008-10-07 | 2010-04-22 | Disco Abrasive Syst Ltd | Processing method of wafer |
KR200470836Y1 (en) * | 2011-12-29 | 2014-01-13 | 세메스 주식회사 | Work table for sawing a electronic component |
JP2015061016A (en) * | 2013-09-20 | 2015-03-30 | Towa株式会社 | Cutting device and cutting method |
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