JPS6414947A - Lead forming apparatus of semiconductor device - Google Patents
Lead forming apparatus of semiconductor deviceInfo
- Publication number
- JPS6414947A JPS6414947A JP17158287A JP17158287A JPS6414947A JP S6414947 A JPS6414947 A JP S6414947A JP 17158287 A JP17158287 A JP 17158287A JP 17158287 A JP17158287 A JP 17158287A JP S6414947 A JPS6414947 A JP S6414947A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- leads
- pusher
- lead bending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To make the aligning property of leads excellent after molding, by providing a lead bending stage for supporting the leads, providing a lead pusher, which can be freely moved up and down at the upper part of the lead bending stage, and forming the pushing surface of the lead pusher and the supporting surface of the lead bending stage with the surface, which is in conformity with the warping of the package of a semiconductor device. CONSTITUTION:Leads 2a of a semiconductor device 2 are supported on a supporting surface 11a of a lead bending stage 11. At this time, a lead bending punch 3 and a lead pusher 12 are positioned at the upper part of the semiconductor device 2. The Iead pusher 12 is lowered, and the leads 2a of the semiconductor device 2 are pushed on the supporting surface 11a. At this time, the supporting surface 11a of the lead bending stage 11 and the pushing surface 12a of the lead pusher 12 face the supported surface and the pushed surface of each Iead 2a. Thereafter the lead bending punch 3 is lowered, and the leads 2a of the semiconductor device 2 are bent. Thus the fabrication is performed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17158287A JPS6414947A (en) | 1987-07-08 | 1987-07-08 | Lead forming apparatus of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17158287A JPS6414947A (en) | 1987-07-08 | 1987-07-08 | Lead forming apparatus of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6414947A true JPS6414947A (en) | 1989-01-19 |
Family
ID=15925826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17158287A Pending JPS6414947A (en) | 1987-07-08 | 1987-07-08 | Lead forming apparatus of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6414947A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01321663A (en) * | 1988-06-23 | 1989-12-27 | Nec Corp | Lead molding device for semiconductor device |
JPH02210855A (en) * | 1989-02-10 | 1990-08-22 | Fujitsu Miyagi Electron:Kk | Manufacture of semiconductor device |
US7964873B2 (en) * | 2003-11-12 | 2011-06-21 | Samsung Electronics Co., Ltd. | Thin film transistor array panel and manufacturing method thereof |
-
1987
- 1987-07-08 JP JP17158287A patent/JPS6414947A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01321663A (en) * | 1988-06-23 | 1989-12-27 | Nec Corp | Lead molding device for semiconductor device |
JPH02210855A (en) * | 1989-02-10 | 1990-08-22 | Fujitsu Miyagi Electron:Kk | Manufacture of semiconductor device |
US7964873B2 (en) * | 2003-11-12 | 2011-06-21 | Samsung Electronics Co., Ltd. | Thin film transistor array panel and manufacturing method thereof |
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