JPS6414947A - Lead forming apparatus of semiconductor device - Google Patents

Lead forming apparatus of semiconductor device

Info

Publication number
JPS6414947A
JPS6414947A JP17158287A JP17158287A JPS6414947A JP S6414947 A JPS6414947 A JP S6414947A JP 17158287 A JP17158287 A JP 17158287A JP 17158287 A JP17158287 A JP 17158287A JP S6414947 A JPS6414947 A JP S6414947A
Authority
JP
Japan
Prior art keywords
lead
semiconductor device
leads
pusher
lead bending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17158287A
Other languages
Japanese (ja)
Inventor
Hirotaka Ueda
Nobuo Eguchi
Hideyoshi Yano
Shuichi Osaka
Yoshimori Tone
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP17158287A priority Critical patent/JPS6414947A/en
Publication of JPS6414947A publication Critical patent/JPS6414947A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To make the aligning property of leads excellent after molding, by providing a lead bending stage for supporting the leads, providing a lead pusher, which can be freely moved up and down at the upper part of the lead bending stage, and forming the pushing surface of the lead pusher and the supporting surface of the lead bending stage with the surface, which is in conformity with the warping of the package of a semiconductor device. CONSTITUTION:Leads 2a of a semiconductor device 2 are supported on a supporting surface 11a of a lead bending stage 11. At this time, a lead bending punch 3 and a lead pusher 12 are positioned at the upper part of the semiconductor device 2. The Iead pusher 12 is lowered, and the leads 2a of the semiconductor device 2 are pushed on the supporting surface 11a. At this time, the supporting surface 11a of the lead bending stage 11 and the pushing surface 12a of the lead pusher 12 face the supported surface and the pushed surface of each Iead 2a. Thereafter the lead bending punch 3 is lowered, and the leads 2a of the semiconductor device 2 are bent. Thus the fabrication is performed.
JP17158287A 1987-07-08 1987-07-08 Lead forming apparatus of semiconductor device Pending JPS6414947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17158287A JPS6414947A (en) 1987-07-08 1987-07-08 Lead forming apparatus of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17158287A JPS6414947A (en) 1987-07-08 1987-07-08 Lead forming apparatus of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6414947A true JPS6414947A (en) 1989-01-19

Family

ID=15925826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17158287A Pending JPS6414947A (en) 1987-07-08 1987-07-08 Lead forming apparatus of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6414947A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01321663A (en) * 1988-06-23 1989-12-27 Nec Corp Lead molding device for semiconductor device
JPH02210855A (en) * 1989-02-10 1990-08-22 Fujitsu Miyagi Electron:Kk Manufacture of semiconductor device
US7964873B2 (en) * 2003-11-12 2011-06-21 Samsung Electronics Co., Ltd. Thin film transistor array panel and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01321663A (en) * 1988-06-23 1989-12-27 Nec Corp Lead molding device for semiconductor device
JPH02210855A (en) * 1989-02-10 1990-08-22 Fujitsu Miyagi Electron:Kk Manufacture of semiconductor device
US7964873B2 (en) * 2003-11-12 2011-06-21 Samsung Electronics Co., Ltd. Thin film transistor array panel and manufacturing method thereof

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