JPS6413749U - - Google Patents
Info
- Publication number
- JPS6413749U JPS6413749U JP1987110393U JP11039387U JPS6413749U JP S6413749 U JPS6413749 U JP S6413749U JP 1987110393 U JP1987110393 U JP 1987110393U JP 11039387 U JP11039387 U JP 11039387U JP S6413749 U JPS6413749 U JP S6413749U
- Authority
- JP
- Japan
- Prior art keywords
- housing
- attached
- conductive pattern
- outer lens
- substitute
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案に係る灯具の一実施例を示す一
部破断状態の平面図、第２図及び第３図は同実施
例の正面図及び側面図、第４図は同実施例におけ
るＳＭＴ ＬＥＤの実装状態を示す正面図、第５
図は第４図の−線断面図、第６図は従来例を
示す一部破断状態の平面図である。
１……ハウジング、１Ａ……反射枠、２……導
電パターン（抵抗分を含む）、３……ＳＭＴ Ｌ
ＥＤ、４……ワイヤーハーネス、５……アウター
レンズ、６……ハンダ。
FIG. 1 is a partially cutaway plan view showing an embodiment of the lighting device according to the present invention, FIGS. 2 and 3 are front and side views of the same embodiment, and FIG. 4 is an SMT in the same embodiment. Front view showing the mounting state of the LED, No. 5
The figure is a sectional view taken along the line -- in FIG. 4, and FIG. 6 is a partially broken plan view showing a conventional example. 1... Housing, 1A... Reflective frame, 2... Conductive pattern (including resistance), 3... SMT L
ED, 4...Wire harness, 5...Outer lens, 6...Solder.
Claims (1)
に成形するとともに、所定形状の導電パターンを
電流制限用抵抗の代用となる抵抗分を含むように
形成してＳＭＴ ＬＥＤ、逆電圧保護ダイオード
などを装着し、ハウジングの前面にアウターレン
ズを取付けたことを特徴とする灯具。 A predetermined number of reflective frames are integrally molded on the inner surface of the rear part of the housing, and a conductive pattern of a predetermined shape is formed to include a resistance that can serve as a substitute for a current limiting resistor, and SMT LEDs, reverse voltage protection diodes, etc. are attached. A light fixture characterized by having an outer lens attached to the front of the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987110393U JPH0536293Y2 (en) | 1987-07-17 | 1987-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987110393U JPH0536293Y2 (en) | 1987-07-17 | 1987-07-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6413749U true JPS6413749U (en) | 1989-01-24 |
| JPH0536293Y2 JPH0536293Y2 (en) | 1993-09-14 |
Family
ID=31347509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987110393U Expired - Lifetime JPH0536293Y2 (en) | 1987-07-17 | 1987-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0536293Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04119592U (en) * | 1991-04-11 | 1992-10-26 | 株式会社シブタニ | Gap closing device for single door |
| US7264456B2 (en) | 2001-10-10 | 2007-09-04 | Micron Technology, Inc. | Leadframe and method for reducing mold compound adhesion problems |
-
1987
- 1987-07-17 JP JP1987110393U patent/JPH0536293Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04119592U (en) * | 1991-04-11 | 1992-10-26 | 株式会社シブタニ | Gap closing device for single door |
| US7264456B2 (en) | 2001-10-10 | 2007-09-04 | Micron Technology, Inc. | Leadframe and method for reducing mold compound adhesion problems |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0536293Y2 (en) | 1993-09-14 |