JPS6411354A - Sealing structure of electronic circuit - Google Patents

Sealing structure of electronic circuit

Info

Publication number
JPS6411354A
JPS6411354A JP62166671A JP16667187A JPS6411354A JP S6411354 A JPS6411354 A JP S6411354A JP 62166671 A JP62166671 A JP 62166671A JP 16667187 A JP16667187 A JP 16667187A JP S6411354 A JPS6411354 A JP S6411354A
Authority
JP
Japan
Prior art keywords
wiring substrate
sealing substance
sealing
glass
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62166671A
Other languages
Japanese (ja)
Inventor
Masao Funada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Priority to JP62166671A priority Critical patent/JPS6411354A/en
Publication of JPS6411354A publication Critical patent/JPS6411354A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent a disconnection due to a temperature change and to obtain a sealing structure protected against a mechanical force from the outside by a method wherein an electrically connected part between divided substrates whose coefficient of thermal expansion differs from each other is covered with a gel-like sealing substance and a circumferential part of this sealing substance is sealed by using a hard-coating sealing substance. CONSTITUTION:A glass wiring substrate 2 where a photodetector 4 is mounted and a glass epoxy wiring substrate 3 where an IC 5 for driving use is mounted are placed on a support material 1; wiring parts for the IC 5 and the glass wiring substrate 2 are connected by a wire bonding operation using a gold wire 6; the divided wiring substrates are connected electrically. A part where the glass wiring substrate 2 comes into contact with the glass epoxy wiring substrate 3 is sealed by using a gel-like silicone risen as a first sealing substance 7 for a part which comes into direct contact with the wire 6 which is used for electrical connection. The surface of this sealing substance 7 is sealed by using a second sealing substance 8 composed of a hard-coating sealing material.
JP62166671A 1987-07-03 1987-07-03 Sealing structure of electronic circuit Pending JPS6411354A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62166671A JPS6411354A (en) 1987-07-03 1987-07-03 Sealing structure of electronic circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62166671A JPS6411354A (en) 1987-07-03 1987-07-03 Sealing structure of electronic circuit

Publications (1)

Publication Number Publication Date
JPS6411354A true JPS6411354A (en) 1989-01-13

Family

ID=15835567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62166671A Pending JPS6411354A (en) 1987-07-03 1987-07-03 Sealing structure of electronic circuit

Country Status (1)

Country Link
JP (1) JPS6411354A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0355898A (en) * 1989-07-25 1991-03-11 Matsushita Electric Ind Co Ltd Electronic circuit module
JPH0469958A (en) * 1990-07-10 1992-03-05 Mitsubishi Electric Corp Semiconductor device
JPH04137753A (en) * 1990-09-28 1992-05-12 Sanyo Electric Co Ltd High frequency semiconductor device
US5379186A (en) * 1993-07-06 1995-01-03 Motorola, Inc. Encapsulated electronic component having a heat diffusing layer
JPH0725521U (en) * 1993-10-14 1995-05-12 サンアロー株式会社 Push button structure of push button switch
JP2011210759A (en) * 2010-03-29 2011-10-20 Casio Computer Co Ltd Semiconductor device and method of manufacturing the same
JP2014188683A (en) * 2013-03-26 2014-10-06 Toshiba Hokuto Electronics Corp Thermal print head and method for producing the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0355898A (en) * 1989-07-25 1991-03-11 Matsushita Electric Ind Co Ltd Electronic circuit module
JPH0469958A (en) * 1990-07-10 1992-03-05 Mitsubishi Electric Corp Semiconductor device
JPH04137753A (en) * 1990-09-28 1992-05-12 Sanyo Electric Co Ltd High frequency semiconductor device
US5379186A (en) * 1993-07-06 1995-01-03 Motorola, Inc. Encapsulated electronic component having a heat diffusing layer
JPH0725521U (en) * 1993-10-14 1995-05-12 サンアロー株式会社 Push button structure of push button switch
JP2011210759A (en) * 2010-03-29 2011-10-20 Casio Computer Co Ltd Semiconductor device and method of manufacturing the same
JP2014188683A (en) * 2013-03-26 2014-10-06 Toshiba Hokuto Electronics Corp Thermal print head and method for producing the same

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