JPS6410750U - - Google Patents

Info

Publication number
JPS6410750U
JPS6410750U JP1987103882U JP10388287U JPS6410750U JP S6410750 U JPS6410750 U JP S6410750U JP 1987103882 U JP1987103882 U JP 1987103882U JP 10388287 U JP10388287 U JP 10388287U JP S6410750 U JPS6410750 U JP S6410750U
Authority
JP
Japan
Prior art keywords
entrance
molded member
plate
shaped molded
passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987103882U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987103882U priority Critical patent/JPS6410750U/ja
Publication of JPS6410750U publication Critical patent/JPS6410750U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係るＬＥＤアレイの斜視図、
第２図ならびに第３図は正逆方向から２次曲線部
を切断した図、第４図は筒状部内を進む平行光線
を示す図、第５図は従来構造の斜視図である。 FIG. 1 is a perspective view of an LED array according to the present invention;
FIGS. 2 and 3 are views of the quadratic curved portion cut from the forward and reverse directions, FIG. 4 is a view showing parallel rays of light traveling inside the cylindrical portion, and FIG. 5 is a perspective view of the conventional structure.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 配線基板と、ここに互い違いに固定しほぼ直線
状に形成するＬＥＤペレツトと、前記配線基板に
一体に固定する板状の成型部材と、前記ＬＥＤペ
レツトに対応しこの成型部材を貫通して設ける光
通路と、前記各ＬＥＤペレツトに対応して設置す
る光通路の入口と、この入口に連続して形成しこ
の入口より離れた位置から前記板状の成型部材の
厚さ方向を貫通して形成する筒状部と、この筒状
部端と前記入口間に接続し前記光通路を構成する
２次曲面とを具備しこの２次曲面を前記板状の成
型部材の厚さ方向に切断して得られる相対向する
両２次曲面の共通の焦点位置を前記筒状部の軸よ
り前記光通路の入口方向にずらしたとを特徴とす
るＬＥＤアレイ。 A wiring board, LED pellets fixed alternately thereto and formed in a substantially straight line, a plate-shaped molded member integrally fixed to the wiring board, and a light provided corresponding to the LED pellets and penetrating the molded member. a passage, an entrance of an optical passage installed corresponding to each of the LED pellets, and a passage formed continuously with the entrance and passing through the thickness direction of the plate-shaped molded member from a position away from the entrance. A cylindrical part, and a quadratic curved surface connected between the end of the cylindrical part and the inlet to form the optical path, and obtained by cutting the quadratic curved surface in the thickness direction of the plate-shaped molded member. The LED array is characterized in that a common focal point of both opposing quadratic curved surfaces is shifted from the axis of the cylindrical portion toward the entrance of the optical path.
JP1987103882U 1987-07-08 1987-07-08 Pending JPS6410750U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987103882U JPS6410750U (en) 1987-07-08 1987-07-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987103882U JPS6410750U (en) 1987-07-08 1987-07-08

Publications (1)

Publication Number Publication Date
JPS6410750U true JPS6410750U (en) 1989-01-20

Family

ID=31335103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987103882U Pending JPS6410750U (en) 1987-07-08 1987-07-08

Country Status (1)

Country Link
JP (1) JPS6410750U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009250997A (en) * 2008-04-01 2009-10-29 Panasonic Corp Light emitting display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009250997A (en) * 2008-04-01 2009-10-29 Panasonic Corp Light emitting display device

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