JPS6410642A - Bonding method for semiconductor substrate - Google Patents
Bonding method for semiconductor substrateInfo
- Publication number
- JPS6410642A JPS6410642A JP62166147A JP16614787A JPS6410642A JP S6410642 A JPS6410642 A JP S6410642A JP 62166147 A JP62166147 A JP 62166147A JP 16614787 A JP16614787 A JP 16614787A JP S6410642 A JPS6410642 A JP S6410642A
- Authority
- JP
- Japan
- Prior art keywords
- bubbles
- bonding material
- pressing
- semiconductor substrate
- order
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
PURPOSE:To push out bubbles from bonding material when bubbles mix in the bonding material, and prevent effectively bubbles from mixing in the bonding material, by pressing a region on a semiconductor substrate along one direction, against a retaining base, in order, via the bonding material. CONSTITUTION:Pressing is performed by applying only a shaft-center cylinder 26, and then pressing is performed in order by applying outer-peripheral cylinders 27-29. Elastic bodies 26a-29a have the form of a part of a sphere or the form of a part of a cone. In addition, the concentric circular ring parts of a semiconductor substrate 11 are pressed in order against a retaining base 12. Therefore, if bubbles are included in bonding material 13, these bubbles are pushed out in the form of concentric circles toward the outer periphery of the semiconductor substrate 11, and after all, the bubbles are discharged from the bonding material 13. While the pressing force of the cylinder 26 or the like applied to the initial pressing is kept, the pressing applying outer- peripheral cylinders 27-29, etc., is performed in order. Therefore the bubbles once discharged do not permeate again into the bonding material 13.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62166147A JPS6410642A (en) | 1987-07-02 | 1987-07-02 | Bonding method for semiconductor substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62166147A JPS6410642A (en) | 1987-07-02 | 1987-07-02 | Bonding method for semiconductor substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6410642A true JPS6410642A (en) | 1989-01-13 |
Family
ID=15825925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62166147A Pending JPS6410642A (en) | 1987-07-02 | 1987-07-02 | Bonding method for semiconductor substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6410642A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0768148A1 (en) * | 1995-10-09 | 1997-04-16 | Ebara Corporation | Apparatus for and method of polishing workpiece |
JP2006116454A (en) * | 2004-10-22 | 2006-05-11 | Seiko Epson Corp | Slit coat type coater and slit coat type application method |
-
1987
- 1987-07-02 JP JP62166147A patent/JPS6410642A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0768148A1 (en) * | 1995-10-09 | 1997-04-16 | Ebara Corporation | Apparatus for and method of polishing workpiece |
US6033520A (en) * | 1995-10-09 | 2000-03-07 | Ebara Corporation | Apparatus for and method of polishing workpiece |
US6432258B1 (en) | 1995-10-09 | 2002-08-13 | Ebara Corporation | Apparatus for and method of polishing workpiece |
JP2006116454A (en) * | 2004-10-22 | 2006-05-11 | Seiko Epson Corp | Slit coat type coater and slit coat type application method |
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