JPS6410642A - Bonding method for semiconductor substrate - Google Patents

Bonding method for semiconductor substrate

Info

Publication number
JPS6410642A
JPS6410642A JP62166147A JP16614787A JPS6410642A JP S6410642 A JPS6410642 A JP S6410642A JP 62166147 A JP62166147 A JP 62166147A JP 16614787 A JP16614787 A JP 16614787A JP S6410642 A JPS6410642 A JP S6410642A
Authority
JP
Japan
Prior art keywords
bubbles
bonding material
pressing
semiconductor substrate
order
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62166147A
Other languages
Japanese (ja)
Inventor
Hiroshi Sato
Nobuyuki Izawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP62166147A priority Critical patent/JPS6410642A/en
Publication of JPS6410642A publication Critical patent/JPS6410642A/en
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To push out bubbles from bonding material when bubbles mix in the bonding material, and prevent effectively bubbles from mixing in the bonding material, by pressing a region on a semiconductor substrate along one direction, against a retaining base, in order, via the bonding material. CONSTITUTION:Pressing is performed by applying only a shaft-center cylinder 26, and then pressing is performed in order by applying outer-peripheral cylinders 27-29. Elastic bodies 26a-29a have the form of a part of a sphere or the form of a part of a cone. In addition, the concentric circular ring parts of a semiconductor substrate 11 are pressed in order against a retaining base 12. Therefore, if bubbles are included in bonding material 13, these bubbles are pushed out in the form of concentric circles toward the outer periphery of the semiconductor substrate 11, and after all, the bubbles are discharged from the bonding material 13. While the pressing force of the cylinder 26 or the like applied to the initial pressing is kept, the pressing applying outer- peripheral cylinders 27-29, etc., is performed in order. Therefore the bubbles once discharged do not permeate again into the bonding material 13.
JP62166147A 1987-07-02 1987-07-02 Bonding method for semiconductor substrate Pending JPS6410642A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62166147A JPS6410642A (en) 1987-07-02 1987-07-02 Bonding method for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62166147A JPS6410642A (en) 1987-07-02 1987-07-02 Bonding method for semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS6410642A true JPS6410642A (en) 1989-01-13

Family

ID=15825925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62166147A Pending JPS6410642A (en) 1987-07-02 1987-07-02 Bonding method for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS6410642A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0768148A1 (en) * 1995-10-09 1997-04-16 Ebara Corporation Apparatus for and method of polishing workpiece
JP2006116454A (en) * 2004-10-22 2006-05-11 Seiko Epson Corp Slit coat type coater and slit coat type application method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0768148A1 (en) * 1995-10-09 1997-04-16 Ebara Corporation Apparatus for and method of polishing workpiece
US6033520A (en) * 1995-10-09 2000-03-07 Ebara Corporation Apparatus for and method of polishing workpiece
US6432258B1 (en) 1995-10-09 2002-08-13 Ebara Corporation Apparatus for and method of polishing workpiece
JP2006116454A (en) * 2004-10-22 2006-05-11 Seiko Epson Corp Slit coat type coater and slit coat type application method

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