JPS6399222A - Prepreg - Google Patents
PrepregInfo
- Publication number
- JPS6399222A JPS6399222A JP24229587A JP24229587A JPS6399222A JP S6399222 A JPS6399222 A JP S6399222A JP 24229587 A JP24229587 A JP 24229587A JP 24229587 A JP24229587 A JP 24229587A JP S6399222 A JPS6399222 A JP S6399222A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- parts
- prepreg
- polyamide
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 claims abstract description 38
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 38
- 239000000203 mixture Substances 0.000 claims abstract description 22
- 239000004952 Polyamide Substances 0.000 claims abstract description 13
- 229920002647 polyamide Polymers 0.000 claims abstract description 13
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims abstract description 11
- 125000003277 amino group Chemical group 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims abstract description 5
- -1 urea compound Chemical class 0.000 claims description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- 239000004202 carbamide Substances 0.000 claims 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 9
- 229920000049 Carbon (fiber) Polymers 0.000 abstract description 3
- 239000004917 carbon fiber Substances 0.000 abstract description 3
- 239000002657 fibrous material Substances 0.000 abstract description 3
- 238000004321 preservation Methods 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 22
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000003860 storage Methods 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 4
- 239000004760 aramid Substances 0.000 description 3
- 229920003235 aromatic polyamide Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- YBBLOADPFWKNGS-UHFFFAOYSA-N 1,1-dimethylurea Chemical compound CN(C)C(N)=O YBBLOADPFWKNGS-UHFFFAOYSA-N 0.000 description 1
- URZYXZHQFVVPAB-UHFFFAOYSA-N 1-chloro-3,3-dimethyl-1-phenylurea Chemical compound CN(C)C(=O)N(Cl)C1=CC=CC=C1 URZYXZHQFVVPAB-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- 229920003369 Kevlar® 49 Polymers 0.000 description 1
- MGJKQDOBUOMPEZ-UHFFFAOYSA-N N,N'-dimethylurea Chemical compound CNC(=O)NC MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 description 1
- JFKLNFNFYQVVNZ-UHFFFAOYSA-N OOCI Chemical compound OOCI JFKLNFNFYQVVNZ-UHFFFAOYSA-N 0.000 description 1
- 206010033557 Palpitations Diseases 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
Abstract
Description
【発明の詳細な説明】
本発明は、低温度での硬化速度が大きく、かつ保存安定
性に優れたエポキシ樹脂組成物を含浸してなるプリプレ
グに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a prepreg impregnated with an epoxy resin composition that has a high curing speed at low temperatures and excellent storage stability.
従来、炭素繊維、ガラスａＶｔ、芳香族ポリアミドｓａ
ｇ等のプリプレグにエポキシ樹脂が使われる例が多い。Conventionally, carbon fiber, glass aVt, aromatic polyamide sa
Epoxy resin is often used in prepregs such as g.
このエポキシ樹脂に要求される重要な特性として、硬化
速度が大きく低温硬化が可能で、しかも保存期間が長い
ことが挙げられる。エポキシ樹脂の硬化剤としてジシア
ンジアミドが用いられるが、この場合にはプリプレグの
保存期間が長い。この硬化剤ジシアンジアミドを硬化促
進剤、例えば３−（３，４−ジクロロフェニル） −
１，１−ジメチル尿素と組合せて使用することが提案さ
れており（特公昭５５−１６０５６号公報）、この組合
せの硬化剤系を例えばノボラック型エポキシ樹脂に適用
した場合１２０〜１３５℃、６０〜９０分で樹脂は完全
に硬化し一応の成果が得られている。Important properties required of this epoxy resin include a high curing speed, low temperature curing capability, and long shelf life. Dicyandiamide is used as a curing agent for epoxy resins, but in this case the prepreg has a long shelf life. This curing agent dicyandiamide is combined with a curing accelerator, such as 3-(3,4-dichlorophenyl)-
It has been proposed to use it in combination with 1,1-dimethylurea (Japanese Patent Publication No. 55-16056), and when a curing agent system of this combination is applied to, for example, a novolak type epoxy resin, the curing agent system can be used in combination with 120-135°C, 60- The resin was completely cured in 90 minutes, and some results were obtained.
最近、生産性の向上を目的としてエポキシ樹脂全般につ
いて硬化温度をさらに下げること、及び硬化速度をさら
に高めることが要求されているが、エポキシ樹脂全般、
特に最も一般的に使用されるビスフェノールＡ型エポキ
シ樹脂に上記硬化剤系を適用した場合、硬化速度の向上
はこの要求を充分に満足することができない。Recently, in order to improve productivity, there has been a demand for further lowering the curing temperature and further increasing the curing speed of epoxy resins in general.
In particular, when the above-mentioned curing agent system is applied to the most commonly used bisphenol A type epoxy resin, the improvement in curing speed cannot sufficiently satisfy this requirement.
本発明考らは、こうした現状にかんがみ上記要求を満た
し、しかも保存安定性に浸れたエポキシ樹脂組成物を含
浸したプリプレグを開発すべく鋭意検討した結果、硬化
剤としてジシアンジアミドを含むエポキシ樹脂に特定の
ポリアミドを添加すると目的に適合するプリプレグが得
られることを見出し、本発明に到達した。In view of the current situation, the present invention was conceived to develop a prepreg impregnated with an epoxy resin composition that satisfies the above requirements and has excellent storage stability. It was discovered that a prepreg suitable for the purpose could be obtained by adding polyamide, and the present invention was achieved.
本発明は、下記のとおりである。The present invention is as follows.
エポキシ樹脂１００１ 間部とジシアンジアミド１〜１
０重量部と下記構造式で示される末端にアミノ基を有す
る液状又は半固形状ポリアミド１〜１０重間部とを含む
エポキシ樹脂組成物を含浸してなるプリプレグ。Epoxy resin 1001 interspace and dicyandiamide 1-1
A prepreg impregnated with an epoxy resin composition containing 0 parts by weight and 1 to 10 parts by weight of a liquid or semisolid polyamide having an amino group at the end represented by the following structural formula.
一１〜Ｈ＋ どＡ６ごン１２．〜′せど′ｈシ（Ｊｌｘ
Ｎｌｌ：ｉｍ、ｎはいずれも１以上の整数
（１、ｎは化合物の品質、グレードによる異なる。）
本発明におけるエポキシ樹脂組成物は、ジシアンジアミ
ドと３−（３，４−ジクロロフェニル）−１，１−ジメ
チル尿素とのみの従来の硬化剤系の場合に比し、約２０
〜３０℃低い温度で硬化反応を行うことができ、また、
温度をそのままにすれば硬化時間を短縮することができ
る。しかも、本組成物は保存安定であって保存期間は２
０’Ｃで４５日以上である。以上の効果はエポキシ樹脂
、ノボラック型エポキシ樹脂、グリシジルアミン型エポ
キシ樹脂等に共通して得ることができる。11~H+ Do A6 Gon 12. ~'sedo'hshi (Jlx
Nll: im and n are both integers of 1 or more (1 and n vary depending on the quality and grade of the compound). The epoxy resin composition in the present invention comprises dicyandiamide and 3-(3,4-dichlorophenyl)-1,1 - compared to conventional curing agent systems with only dimethylurea,
The curing reaction can be carried out at temperatures as low as ~30°C, and
Curing time can be shortened by keeping the temperature the same. Moreover, this composition is storage stable and has a storage period of 2
45 days or more at 0'C. The above effects can be obtained in common with epoxy resins, novolac type epoxy resins, glycidylamine type epoxy resins, and the like.
ここで、末端にアミノ基を有する液状又は半固形状ポリ
アミドとは、不飽和脂肪酸を２ｆｆｉ体化させた、いわ
ゆるダイマー酸と、ポリアミンとを反応させて１！７ら
れるところの前記構造式で示される反応性を有する熱可
塑性樹脂のことである。このポリアミドの液状のものは
、粘度的３００〜７０，０ＯＯＣＩ）Ｓである。このポ
リアミドは、例えばトーマイド（富士化成工業社製）又
はパーサミド（第一ゼネラル社？Ｊ）の商標で販売され
ている。同じポリアミドでも固形のものはエポキシ樹脂
と相溶性が悪く適当でない。また、末端にアミノ基を有
しないものはエポキシ樹脂と反応せず硬化反応を促進さ
せる効果に乏しく硬化物の動悸を箸しく低下させるので
、不適当である。Here, the liquid or semi-solid polyamide having an amino group at the terminal is represented by the above-mentioned structural formula, which is obtained by reacting a so-called dimer acid, which is a 2ffi unsaturated fatty acid, with a polyamine. It is a thermoplastic resin that has the reactivity of This liquid polyamide has a viscosity of 300 to 70.0 OOCI)S. This polyamide is sold, for example, under the trademark Tomide (manufactured by Fuji Kasei Kogyo Co., Ltd.) or Persamide (Daiichi General Co., Ltd.?J). Solid polyamides have poor compatibility with epoxy resins and are not suitable. Moreover, those having no amino group at the terminal are not suitable because they do not react with the epoxy resin, have a poor effect of accelerating the curing reaction, and significantly reduce the palpitation of the cured product.
前記樹脂組成物におけるエポキシ樹脂成分は、特に種類
において制限がなく、ビスフェノールへ望エポキシ樹脂
、ノボラック型エポキシ樹脂、グリシジルアミン型エポ
キシ樹脂等であり、好ましくはビスフェノールＡ型エポ
キシ樹脂である。The epoxy resin component in the resin composition is not particularly limited in type, and may be a bisphenol-based epoxy resin, a novolac type epoxy resin, a glycidylamine type epoxy resin, etc., and preferably a bisphenol A type epoxy resin.
本発明におけるエポキシ樹脂組成物の成分の含有比は次
の範囲である。The content ratio of the components of the epoxy resin composition in the present invention is within the following range.
すなわち、エポキシ樹脂１００重量部に対しジシアンジ
アミド１〜１０、好ましくは２〜６重は部、アミノ基を
有するポリアミド１〜１０、好ましくは２〜６重最部で
ある。ジシアンジアミドが１重量部未満では硬化反応が
遅＜１０重量部を超えるとコンポジット特性の低下を招
き好ましくない。また、アミノ基を有するポリアミドが
１重量部未満では低温硬化性又は硬化速度に対する効果
が小さり１０重量部を超えると硬化物の耐熱性が低下し
好ましくない。That is, 1 to 10 parts by weight, preferably 2 to 6 parts, of dicyandiamide and 1 to 10 parts, preferably 2 to 6 parts, of polyamide having amino groups are used per 100 parts by weight of the epoxy resin. If the amount of dicyandiamide is less than 1 part by weight, the curing reaction is slow; if it is more than 10 parts by weight, the composite properties may deteriorate, which is not preferable. Furthermore, if the amount of polyamide having an amino group is less than 1 part by weight, the effect on low temperature curability or curing rate will be small, and if it exceeds 10 parts by weight, the heat resistance of the cured product will decrease, which is not preferable.
本発明におけるエポキシ樹脂組成物は、必要に応じ他の
成分を含むことができる。硬化促進剤として尿素化合物
、例えば３−（３，，１−ジクロ［コフェニル） −
１，１−ジメチル尿素、クロロフェニル−１，１−ジメ
チル尿素等、又は、イミダゾール化合物、例えば２−フ
ェニル−４−メチル−５−ヒドロキシメチルイミダゾー
ル、２−フェニル−４，５−ジヒドロキシメチルイミダ
ゾール等を添加すると一層有効である。これらの化合物
はエポキシ樹脂１００重Ｍ部に対し１〜１０、好ましく
は３〜７重量部添加される。The epoxy resin composition in the present invention can contain other components as necessary. Urea compounds such as 3-(3,,1-dichloro[cophenyl)-
1,1-dimethylurea, chlorophenyl-1,1-dimethylurea, etc., or imidazole compounds such as 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, etc. It is even more effective when added. These compounds are added in an amount of 1 to 10 parts by weight, preferably 3 to 7 parts by weight, per 100 parts by weight of the epoxy resin.
本発明のプリプレグは、このようなエポキシ樹脂組成物
をｍ雑材に含浸してなるものであり、この場合の繊維材
としては、炭素繊維、ガラス１１雑、芳香族ポリアミド
繊維等が挙げられる。The prepreg of the present invention is obtained by impregnating a miscellaneous material with such an epoxy resin composition, and examples of the fiber material in this case include carbon fiber, glass 11 miscellaneous, aromatic polyamide fiber, etc.
通常の方法によりプリプレグとすることができる。本発
明のプリプレグは、低温瓜での硬化速度が大きく、かつ
保存安定性に優れている。It can be made into a prepreg by a normal method. The prepreg of the present invention has a high curing speed at low temperatures and excellent storage stability.
次に、本発明を実施例によって説明する。同時に製造例
及び製造比較例を示す。６例において部とあるは重量品
を表わす。Next, the present invention will be explained by examples. At the same time, production examples and comparative production examples are shown. In the 6 examples, parts indicate heavy items.
製造例１ 下記組成のエポキシ樹脂組成物を作った。Manufacturing example 1 An epoxy resin composition having the following composition was prepared.
エピコート８２８〈シェル化学社製）１００部〔ビスフ
ェノールＡ型エポキシ樹脂〕
ジシアンジアミド ４部３−（３
，４−ジクロロフェニル）
−１，１−ジメチル尿素 ５部トー
マイド２１５ｘ （富士化成工業社製〉 ４部（アミノ
基を有するポリアミド〕
本組成物の保存期間は２０℃で４５日であった。Epicoat 828 (manufactured by Shell Chemical Co., Ltd.) 100 parts [Bisphenol A type epoxy resin] Dicyandiamide 4 parts 3-(3
, 4-dichlorophenyl) -1,1-dimethylurea 5 parts Tomide 215x (manufactured by Fuji Kasei Kogyo Co., Ltd.) 4 parts (polyamide having an amino group) The storage period of this composition was 45 days at 20°C.
このもののゲルタイムは第１表に示すとおりであった。The gel time of this product was as shown in Table 1.
製造比較例１
トーマイドを添加しないほかは！ｘｌ造例１と同じ組成
物を作り、硬化性を調べた。結果は第１表に示すとおり
であった。Manufacturing Comparative Example 1 Except without adding Tomide! The same composition as in xl Preparation Example 1 was prepared and its curability was examined. The results were as shown in Table 1.
第１表 製造例２ 下記組成のエポキシ樹脂組成物を作った。Table 1 Manufacturing example 2 An epoxy resin composition having the following composition was prepared.
ＥＰＮ１１３ｇ（チバ・ガイギー社製）１００部（フェ
ノールノボラック型エポキシ樹脂）ジシアンジアミド
４部３−（３，４−ジクロロフェ
ニル）
−１，１−ジメチル尿素 ５部トー
マイド２１５ｘ （富士化成工業社製）４部（アミノ基
を有するポリアミド）
本組成物の保存期間は２０℃で４０日以上あり、ゲルタ
イムは第２表に示すとおりであった。EPN113g (manufactured by Ciba Geigy) 100 parts (phenol novolac type epoxy resin) dicyandiamide
4 parts 3-(3,4-dichlorophenyl)-1,1-dimethylurea 5 parts Tomide 215x (manufactured by Fuji Kasei Kogyo Co., Ltd.) 4 parts (polyamide having an amino group) The storage period of this composition is 40 days at 20°C The gel times were as shown in Table 2.
製造比較例２
トーマイドを添加しないほかは製造例２と同じ組成物を
作り硬化性を調べた。結果は第２表に示すとおりであっ
た。Comparative Production Example 2 The same composition as in Production Example 2 was prepared except that Tomide was not added, and the curability was examined. The results were as shown in Table 2.
第２表
実施例１
！ｙＪ造例１で１りた樹脂組成物をアセトン−メチルセ
ロソルブ混合溶剤に溶解し５０％溶液とした。Table 2 Example 1! The resin composition obtained in yJ Preparation Example 1 was dissolved in an acetone-methyl cellosolve mixed solvent to make a 50% solution.
この溶液に炭素ＩＩ維（ＣＦ）を含浸させながら連続的
にドラムに巻き取った摂、８０℃で１時間乾燥させて一
方向のプリプレグを得た。This solution was impregnated with carbon II fibers (CF), which were continuously wound onto a drum and dried at 80° C. for 1 hour to obtain a unidirectional prepreg.
これを積層し１３０℃で９０分、７ｋｊＪ ／Ｃ１（７
）硬化条件でホットプレス成形した成形板を得た。This was laminated and heated at 130℃ for 90 minutes to 7kjJ/C1 (7
) A molded plate was obtained by hot press molding under curing conditions.
この成形板の居間剪断強度（ＩＬＳＳ＞は８．０ｋ（］
／ １１１１１１’であった。The living room shear strength (ILSS>) of this molded board is 8.0k (]
/111111'.
一方、比較のために製造比較例１で１ｑた組成物を使用
してＣ１：の一方向プリプレグを作った。On the other hand, for comparison, a unidirectional prepreg C1 was prepared using 1 q of the composition obtained in Comparative Production Example 1.
これを積層し１３０℃で９０分、７ｋ（１／Ｃｍ２の硬
化条件でホットプレス成形し成形板を得た。この成形板
のＩ ＬＳＳは７．１ｋｇ／ ｍｍ’ ｒ Ｉ） ッｔ
ｃ。この成形板を１５０℃で１時間アフターキュアーす
るとＩ ＬＳＳは８．２ｋ（１／＋＋ｍ’ ニなツタ。This was laminated and hot press molded at 130°C for 90 minutes under the curing conditions of 7K (1/Cm2) to obtain a molded plate. The ILSS of this molded plate was 7.1kg/mm' r I) t
c. When this molded plate is after-cured at 150°C for 1 hour, the ILSS is 8.2k (1/++m').
実施例２
製造例２で得た樹脂組成物をアセトンーメチルセロソル
ブ混合溶剤に溶解し５０％溶液とした。Example 2 The resin composition obtained in Production Example 2 was dissolved in an acetone-methyl cellosolve mixed solvent to form a 50% solution.
この溶液に芳香族ポリアミド繊維ケブラー４９（デュポ
ン社製）を含浸させながら実施例１と同様の条件で一方
向のプリプレグを作った。A unidirectional prepreg was produced under the same conditions as in Example 1 while impregnating aromatic polyamide fiber Kevlar 49 (manufactured by DuPont) in this solution.
これを積層し１１０℃で９０分、７ｋｇ／ｃｒ’の硬化
条件でホラ１〜プレス成形し成形板を得た。この成形板
のＩ ＬＳＳは７．０ｋｇ／ ＋ｕ＋’であった。This was laminated and press-molded at 110°C for 90 minutes under curing conditions of 7 kg/cr' to obtain a molded plate. The ILSS of this molded plate was 7.0 kg/+u+'.
一方、比較のために製造比較例２で得た組成物を用いて
ケブラーの一方向ブリブレグを作った。これを１１０℃
で９０分、７ｋｇ／ｃｍ２の硬化条件でホットプレス成
形し成形板を得た。この成形板のＩ ＬＳＳは５．９ｋ
ｇ／ Ｏ１ｍ’であった。この成形板を１５０℃で１時
間アフターキュアーするとＩ ＬＳＳは７．２ｋｇ／
ｍｔａ２になった。On the other hand, for comparison, a Kevlar unidirectional brev leg was made using the composition obtained in Comparative Manufacturing Example 2. This is heated to 110℃
Hot press molding was carried out under curing conditions of 7 kg/cm2 for 90 minutes to obtain a molded plate. The I LSS of this molded plate is 5.9k
g/O1m'. When this molded plate is after-cured at 150℃ for 1 hour, the I LSS is 7.2 kg/
It became mta2.
Claims (2)
〜１０重量部と下記構造式で示される末端にアミノ基を
有する液状又は半固形状ポリアミド１〜１０重量部とを
含むエポキシ樹脂組成物を含浸してなるプリプレグ。 ▲数式、化学式、表等があります▼ Ｒ：▲数式、化学式、表等があります▼ ｍ、ｎはいずれも１以上の整数(1) 100 parts by weight of epoxy resin and 1 part of dicyandiamide
A prepreg impregnated with an epoxy resin composition containing ~10 parts by weight and 1 to 10 parts by weight of a liquid or semisolid polyamide having an amino group at the end represented by the following structural formula. ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ R: ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ Both m and n are integers of 1 or more.
ル化合物を含むものである特許請求の範囲（１）のプリ
プレグ。(2) The prepreg according to claim (1), wherein the epoxy resin composition contains a urea compound or an imidazole compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24229587A JPS6399222A (en) | 1987-09-26 | 1987-09-26 | Prepreg |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24229587A JPS6399222A (en) | 1987-09-26 | 1987-09-26 | Prepreg |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15326581A Division JPS5853913A (en) | 1981-09-28 | 1981-09-28 | Epoxy resin composition and prepreg |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6399222A true JPS6399222A (en) | 1988-04-30 |
| JPH049810B2 JPH049810B2 (en) | 1992-02-21 |
Family
ID=17087111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24229587A Granted JPS6399222A (en) | 1987-09-26 | 1987-09-26 | Prepreg |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6399222A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0382575A2 (en) * | 1989-02-10 | 1990-08-16 | Toray Industries, Inc. | Thermosetting resin composition, cured resin product, prepreg and fiber-reinforced plastic |
| JPH03203934A (en) * | 1989-12-28 | 1991-09-05 | Nippon Steel Chem Co Ltd | Epoxy resin prepreg |
| US7883766B2 (en) | 2005-07-13 | 2011-02-08 | Mitsubishi Rayon Co., Ltd. | Prepreg |
-
1987
- 1987-09-26 JP JP24229587A patent/JPS6399222A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0382575A2 (en) * | 1989-02-10 | 1990-08-16 | Toray Industries, Inc. | Thermosetting resin composition, cured resin product, prepreg and fiber-reinforced plastic |
| JPH03203934A (en) * | 1989-12-28 | 1991-09-05 | Nippon Steel Chem Co Ltd | Epoxy resin prepreg |
| US7883766B2 (en) | 2005-07-13 | 2011-02-08 | Mitsubishi Rayon Co., Ltd. | Prepreg |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH049810B2 (en) | 1992-02-21 |
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