JPS6396911A - Substrate holder - Google Patents

Abstract

PURPOSE:To realize the formation of a uniform film for a long duration by a method wherein a substrate holder part is installed on either side of an upper electrode whose shape is symmetrical on both faces and both faces are used after inversion so that the stress causing a curvature during the formation of the film can be accumulated on both faces equally. CONSTITUTION:A flange part 2a remains formed in the central part of a substrate holder 1 composed of a flat and conductive plate, and an upper electrode 2 is formed in such a way that recessed parts 2b are formed so that the surfaces of the plate can become symmetrical. An almost rod-like substrate holder part 3 composed of the identical material is attached to one recessed part 2b of this upper electrode 2 by means of a screw 4 or the like. After a substrate 5 has been mounted on the substrate holder 1 formed in this manner, it is covered with a substrate cover 6. When a thin film is formed by means of the substrate holder 1, a substrate holder part 3 is removed to the recessed part 2b on the reverse face and the substrate holder 1 is inverted. By repeating this inversion, the stress causing a curvature during the formation of a film is accumulated on both faces equally.

Description

【発明の詳細な説明】[Detailed description of the invention] 【産業上の利用分野】[Industrial application field]

本発明は、ＣｖＤ装置、或いはスパッタ装置などで基板
上に薄膜を形成するときに上部電極を兼ねるようにして
前記基板を保持する基板ホルダに関するものである。The present invention relates to a substrate holder that holds a substrate and also serves as an upper electrode when forming a thin film on a substrate using a CvD device, a sputtering device, or the like.

【従来の技術１ 従来のこの種の平行平板式の装置に用いられる基板ホル
ダは第２図に示すようなものであり、一体の平板状の金
属など導電性部材に下面側に枠状部を設けた基板嵌合穴
部１１ａを形成して上部電極１１とし、該上部電極１１
の前記基板嵌合穴部１１ａに基板５を装着すると共に背
面側から基板カバー１２を嵌着して前記基板５の背面側
を覆い、前記基板カバー１２の重量で前記上部電極１１
と基板５とを密着させ、必要以外の部分にｆｉｌｌ！が
付着するのを防止するものである。　このときに前記基
板カバー１２は前記上部電極１１と同一部材で形成され
、例えばＳ膜の付着性向上のために基板５を加熱すると
きに基板温度を均一化する目的も持つものである。 Ｋ発明が解決しようとする問題点１ しかしながら、前記した従来の上部電極１１はＺ！温温
熱熱行うこと、或いは成膜時のストレスにより長期間の
使用で徐々に中央部が垂下るような湾曲を生ずるもので
あり、この湾曲により対極との電極間隔が不均一となり
放電状態に片寄りを生じ、形成される膜面の厚さにムラ
を発生すると云う問題点を生ずるものであり、また、こ
の問題点は徐々に発生するものであるために前記上部電
極１１を交換するときにも限界が定め難く生産管理も困
難である問題点も生ずるものであり、更に交換直後には
新しい上部電極１１はガス発生も生じ易く作業能率も低
下するので交換すること自体にも問題点があるものであ
った。 に問題点を解決するための手段】 特に微細加工が必要な薄膜を基板上に形成するときには
前記上部電極を兼ねる基板ホルダに基板を装着する方法
がチャンバー内の塵埃からの影響を逃れるためにも最適
のものであるが、前記した問題点のために長期間に渡り
均一な膜面を得るのが困難であった。　その点を考慮し
て本発明は前記した従来の問題点を解決するための具体
的手段として、平行平板弐〇ＶＤ装置などに設けられ、
上部電極に基板保持部を有する基板ホルダにおいて、前
記上部電極は表面側と裏面側とが対称の形状とされ、か
つ前記上部電極と前記基板保持部とは別体に形成され、
前記上部電極のいずれの側にも前記基板保持部が着脱自
在とされていることを特徴とする基板ホルダを提供する
ことで前記従来の問題点を解決するものである。 に実　施　例】 つぎに、本発明を第１図に示す一実施例に基づいて詳細
に説明する。 図中に符号１で示すものは本発明による基板ホルダであ
り、該基板ホルダ１は平板状の導電性の板材の中心部に
フランジ部２ａを残し、板材の表裏面が対称となるよう
に穴部２ｂが形成された上部電極２と、前記上部電極２
の一方の穴部２ｂには好ましくは前記上部電極２と同一
部材で別体に略枠状に形成された基板保持部３とが螺子
４による螺着など適時な方法で取付けられ構成されるも
のである。　ここで特に説明を加えるならば、前記螺着
を行った後の上部電極２と前記基板保持部３とは同一平
面を形成することが放電の均一性の保持の面から好まし
く、また、同様の理由により螺着のネジ穴は貫通してい
ないことが好ましい。 このように形成された基板ホルダ１には基板５が装着さ
れ、従来例と略同様な基板カバー６でカバーされて使用
される。 以上に説明したように形成された基板ホルダ１を使用し
て薄膜の形成ｉ行うときには、表裏が対称に形成されて
いることを利用して、適宜の回数の作業が行われた後に
前記基板保持部３を裏面側の穴部２ｂに移設し、前記基
板ホルダ１を反転して使用し、この反転を繰返す。　こ
の様にすることで成膜時に生ずるストレスの基板ホルダ
１への蓄積は表裏面に均等なものとされるので、該基板
ホルダ１の垂下すなどの湾曲、変形は生じないものとな
り、長期間に渡りこの基板ホルダ１を使用□することが
可能となる。 に発明の効果】 以上に説明したように上部電極を表裏対称の形状どし、
該上部電極のいずれの側にも基板保持部を取付けられ表
裏面が反転して使用できるようにしたことで、本発明の
基板ホルダは湾曲の原因となる成膜時のストレスを表裏
両面に均等に蓄積させることが可能なものとなり、これ
により変形を生じないものとして長期間に渡り均一の成
膜を可能とする優れた効果を奏するものであり、更に前
記基板保持部および基板カバーの交換のみで異なる寸法
、形状の基板に対応できる効果も奏するものである。[Prior art 1] The conventional substrate holder used in this type of parallel plate type device is as shown in Fig. 2, which consists of a conductive member such as a flat metal plate with a frame-shaped portion on the lower side. The provided substrate fitting hole 11a is formed to form the upper electrode 11, and the upper electrode 11
The board 5 is attached to the board fitting hole 11a, and the board cover 12 is fitted from the back side to cover the back side of the board 5, and the weight of the board cover 12 pushes the upper electrode 11.
and the board 5, and fill in the unnecessary parts! This prevents the adhesion of At this time, the substrate cover 12 is formed of the same material as the upper electrode 11, and has the purpose of making the substrate temperature uniform when heating the substrate 5, for example, to improve the adhesion of the S film. Problem 1 to be solved by the K invention However, the conventional upper electrode 11 described above is Z! After long-term use, due to heat treatment or stress during film formation, the central part gradually becomes sagging, and this curvature causes the electrode spacing between the counter electrode and the counter electrode to become uneven, resulting in uneven discharge. This causes the problem of unevenness in the thickness of the formed film surface, and since this problem occurs gradually, it is difficult to replace the upper electrode 11 when replacing the upper electrode 11. However, there are also problems in that it is difficult to set limits and production control is difficult, and furthermore, immediately after replacement, the new upper electrode 11 is likely to generate gas and work efficiency is reduced, so there are problems in replacing it itself. It was something. In particular, when forming a thin film that requires microfabrication on a substrate, mounting the substrate on the substrate holder that also serves as the upper electrode is recommended in order to avoid the influence of dust in the chamber. Although this method is optimal, it is difficult to obtain a uniform film surface over a long period of time due to the problems described above. In consideration of this point, the present invention is provided in a parallel plate two
In a substrate holder having a substrate holding part in an upper electrode, the upper electrode has a symmetrical shape on a front side and a back side, and the upper electrode and the substrate holding part are formed separately,
The above-mentioned conventional problems are solved by providing a substrate holder characterized in that the substrate holder is detachably attached to either side of the upper electrode. Embodiment Next, the present invention will be explained in detail based on an embodiment shown in FIG. What is designated by the reference numeral 1 in the figure is a substrate holder according to the present invention, and the substrate holder 1 has a flange portion 2a left in the center of a flat conductive plate, and holes formed in the plate so that the front and back surfaces of the plate are symmetrical. an upper electrode 2 in which a portion 2b is formed, and the upper electrode 2
Preferably, a substrate holder 3, which is made of the same material as the upper electrode 2 and formed in a separate substantially frame shape, is attached to one of the holes 2b by a suitable method such as screwing with a screw 4. It is. To explain specifically here, it is preferable that the upper electrode 2 and the substrate holding part 3 after the screwing are formed on the same plane from the viewpoint of maintaining uniformity of discharge, and that For some reason, it is preferable that the screw holes for screwing do not pass through. A substrate 5 is attached to the substrate holder 1 formed in this manner, and is used while being covered with a substrate cover 6 that is substantially similar to the conventional example. When forming a thin film using the substrate holder 1 formed as described above, taking advantage of the fact that the front and back sides are formed symmetrically, the substrate holder 1 is The part 3 is moved to the hole part 2b on the back side, the substrate holder 1 is inverted and used, and this inversion is repeated. By doing this, the stress that occurs during film formation is accumulated on the substrate holder 1 evenly on the front and back surfaces, so that the substrate holder 1 does not become bent or deformed, such as drooping, for a long period of time. This substrate holder 1 can be used for □. [Effects of the invention] As explained above, the upper electrode has a symmetrical shape on the front and back,
By attaching a substrate holder to either side of the upper electrode so that it can be used with the front and back sides reversed, the substrate holder of the present invention can evenly distribute the stress during film formation that causes curvature on both the front and back sides. This makes it possible to accumulate the film over a long period of time without causing deformation, and has the excellent effect of making it possible to form a uniform film over a long period of time. This also has the effect of being able to accommodate substrates of different sizes and shapes.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明に係る基板ホルダの一実施例を示す断面
図、第２図は従来の基板ホルダの例を示す断面図である
。 １・・・・・・基板ホルダ ２・・・・・・上部電極FIG. 1 is a sectional view showing an embodiment of a substrate holder according to the present invention, and FIG. 2 is a sectional view showing an example of a conventional substrate holder. 1...Substrate holder 2...Top electrode

Claims (1)

【特許請求の範囲】[Claims] 平行平板式ＣＶＤ装置などに設けられ、上部電極に基板
保持部を有する基板ホルダにおいて、前記上部電極は表
面側と裏面側とが対称の形状とされ、かつ前記上部電極
と前記基板保持部とは別体に形成され、前記上部電極の
いずれの側にも前記基板保持部が着脱自在とされている
ことを特徴とする基板ホルダ。In a substrate holder that is installed in a parallel plate CVD apparatus or the like and has a substrate holder on an upper electrode, the upper electrode has a symmetrical shape on a front side and a back side, and the upper electrode and the substrate holder are different from each other. A substrate holder characterized in that the substrate holder is formed separately and is detachably attached to either side of the upper electrode.