JPS6396297A - Insoluble anode made of lead alloy - Google Patents
Insoluble anode made of lead alloyInfo
- Publication number
- JPS6396297A JPS6396297A JP61241417A JP24141786A JPS6396297A JP S6396297 A JPS6396297 A JP S6396297A JP 61241417 A JP61241417 A JP 61241417A JP 24141786 A JP24141786 A JP 24141786A JP S6396297 A JPS6396297 A JP S6396297A
- Authority
- JP
- Japan
- Prior art keywords
- insoluble anode
- lead alloy
- alloy
- coated
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000978 Pb alloy Inorganic materials 0.000 title claims description 14
- 239000000463 material Substances 0.000 claims abstract description 26
- 238000005260 corrosion Methods 0.000 claims abstract description 23
- 230000007797 corrosion Effects 0.000 claims abstract description 23
- 229910052716 thallium Inorganic materials 0.000 claims abstract 3
- 239000012535 impurity Substances 0.000 claims 2
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000007747 plating Methods 0.000 abstract description 8
- 239000000203 mixture Substances 0.000 abstract description 5
- 229910001128 Sn alloy Inorganic materials 0.000 abstract description 4
- 238000009713 electroplating Methods 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 229910052718 tin Inorganic materials 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 229910052758 niobium Inorganic materials 0.000 abstract description 2
- 229910052715 tantalum Inorganic materials 0.000 abstract description 2
- 229910052719 titanium Inorganic materials 0.000 abstract description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 4
- 239000011889 copper foil Substances 0.000 abstract 2
- 239000003792 electrolyte Substances 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 239000007769 metal material Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 239000011888 foil Substances 0.000 description 7
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 5
- 230000004580 weight loss Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 239000010953 base metal Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000010802 sludge Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000799 K alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000010446 mirabilite Substances 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- RSIJVJUOQBWMIM-UHFFFAOYSA-L sodium sulfate decahydrate Chemical compound O.O.O.O.O.O.O.O.O.O.[Na+].[Na+].[O-]S([O-])(=O)=O RSIJVJUOQBWMIM-UHFFFAOYSA-L 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/68—Selection of materials for use in lead-acid accumulators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
Description
【発明の詳細な説明】
不溶性陽極は、
（イ）機能面から見ると１
ｔ 高電流密度に対応しうるので、メッキや箔製造ライ
ン速度の上昇（製造ラインの短縮）及びメッキ膜及び箔
形成のスピードアップを図ることが出来、厚メッキや電
解鋼箔製造にきわめて適応性を示すこと。[Detailed Description of the Invention] Insoluble anodes are: (a) From a functional standpoint, they can handle a high current density of 1 t, which increases the speed of plating and foil production lines (shortens the production line) and facilitates the formation of plating films and foils. It is possible to speed up the process, and is highly adaptable to thick plating and electrolytic steel foil production.
２、 合金メッキの同時析出に適すること、エ メッキ
膜及び箔の均質、均一化を為しりること、
４、 浴中への溶出速度量を減少しうること（ロ） 操
業面から見ると、
（１）極間ピッチがほとんど変らないので保守が容易で
あること、
（２）浴組成管理が簡易化するとと
（３） スラッジ沈降剤等の添加量を減少しうろこと
の点で電気メッキ用或いは箔製造用等の冗解操業用＠極
として優れたものであ夛、これによシメッキ製品品質の
向上とコストダウンが可能となる。2. Suitable for simultaneous deposition of alloy plating, achieving homogeneity and uniformity of the plated film and foil; 4. Capable of reducing the rate of elution into the bath (b) From an operational perspective, (1) It is easy to maintain because the pitch between the electrodes hardly changes, (2) It simplifies bath composition management, and (3) It is suitable for electroplating because it reduces the amount of additives such as sludge settling agents. Alternatively, it is excellent as an electrode for redundant operations such as foil manufacturing, thereby making it possible to improve the quality of plated products and reduce costs.
不溶性陽極の耐食性が増大する程こりしたメリットは増
々増大する。As the corrosion resistance of the insoluble anode increases, the advantages of stiffness increase more and more.
本発明に従えば、ｐｂにＴＪが６ ｗｌｏを越え１２Ｖ
Ｃ１０まで、好ましくは７〜１０ ｗ１０添加される。According to the invention, TJ exceeds 6 wlo and 12V on pb.
Up to C10, preferably 7 to 10 w10 is added.
高電流密度化では、後に実施例に示すように、Ｔ７含有
ｆｆｉが５％を越えると耐食性は急激に向上し、１２％
まで良好な耐食性を示す。１２％を越えると耐食性は急
激に悪化する。そとで上限を１２％と定めた。他方、下
限については、５％を越えると耐食性は良好となるが、
もう少し高目の方が安定性を有し、鉛の溶出量も減少す
るので、本発明においては６％金越えるものとして下限
を設定した。When increasing the current density, as shown in the examples later, when T7 content ffi exceeds 5%, the corrosion resistance improves rapidly, and the corrosion resistance increases by 12%.
Shows good corrosion resistance up to When it exceeds 12%, corrosion resistance deteriorates rapidly. The upper limit was set at 12%. On the other hand, as for the lower limit, if it exceeds 5%, the corrosion resistance will be good;
A slightly higher grade has more stability and reduces the amount of lead eluted, so in the present invention, the lower limit was set as exceeding 6% gold.
本発明は更に、ｐｂ−α５〜１２ｖＶ６Ｔノーα０１〜
１０Ｗ１０１３ｎ合金製の不溶性陽極をも提供する。こ
れは、Ｐｂ−Ｔｊ−Ａｇ Ｋの合金において高価なＡ
ｇ の代シに安価でしかも融点の低いＳｎ が一層
効果的であることによる。これによ、Ｔ５、Ｔ７及びｓ
ｎというＰｂよシ低融点の金属のみの添加によシ優れた
耐食性が得られる。低融点材から成る不溶性陽極は、合
金の製造を容易ならしめ、母材被Ｎ型陽極の場合母材へ
の溶接、肉盛シ等による母材の変形を防止し、回収後の
再溶解における酸化損失を減少し、圧延等の加工を容易
とする等の点で非常に大きなメリットを与える。The present invention further provides pb-α5~12vV6T no α01~
An insoluble anode made of 10W1013n alloy is also provided. This is because expensive A is used in the Pb-Tj-Ag K alloy.
This is because Sn, which is cheaper and has a lower melting point, is more effective in place of g. With this, T5, T7 and s
Excellent corrosion resistance can be obtained by adding only a metal having a lower melting point than Pb. An insoluble anode made of a low melting point material facilitates the manufacture of alloys, prevents deformation of the base material due to welding to the base metal, overlaying, etc. in the case of N-type anodes that are attached to the base metal, and prevents deformation of the base metal during remelting after recovery. It offers great advantages in terms of reducing oxidation loss and facilitating processing such as rolling.
ＴＩとＳｎとは相互的に耐食性に影響を与え、Ｔ１０５
％未満の場合及び１２％を越える場合には８ｎ量をいか
に調整しても良好な耐食性は得られない。TI and Sn mutually influence corrosion resistance, and T105
% or more than 12%, good corrosion resistance cannot be obtained no matter how the amount of 8n is adjusted.
ＴＪα５〜１２％の範囲においてＳｎ ｆ ｌ Ｏ１〜
１０％の範囲で選択することによＴ２、Ｐｂ−Ｔ７合金
よシも優れた耐食性が得られる。好ましい範囲は、Ｐｂ
−５〜１０ｗ１０ Ｔｊ−（Ｌ２〜１０％Ｓｎ である
。Sn fl O1~ in the range of TJα5~12%
By selecting it within the range of 10%, excellent corrosion resistance can be obtained for T2 and Pb-T7 alloys as well. The preferred range is Pb
-5~10w10Tj-(L2~10%Sn).
本発明陽極は、所定の成分の鉛合金を溶解し、それを鋳
造・圧延等によシミ極に仕上げた陽極全体が当該鉛合金
から成るもの、表面をチタン、ニオブ、タンタル等の高
耐食性を持つ金属を被覆したクラツド材（芯材は鉄、銅
等で良い）又は耐食性材料単体から成る母材の片面或い
は両面に当該鉛合金を被覆したもの等を含み、被覆する
方法についてはＴＩＧ方式等で直接母材に溶着するか、
母材表面にハンダ付け、電気メツキ等表面処理をした後
鉛を溶着肉盛シするその他を包括する。The anode of the present invention is made by melting a lead alloy with predetermined components and finishing it into a smeared electrode by casting, rolling, etc. The entire anode is made of the lead alloy, and the surface is coated with highly corrosion-resistant material such as titanium, niobium, tantalum, etc. The lead alloy may be coated on one or both sides of a base material made of a single corrosion-resistant material, or a clad material coated with metal (the core material may be iron, copper, etc.), and the coating method may be the TIG method, etc. Weld directly to the base material with
It includes other processes in which lead is welded and overlaid after surface treatment such as soldering and electroplating on the surface of the base material.
要は電極の放電部が本発明合金で作製されれば良いＯ
通常の溶解法にて表１に示される成分組成を有する鉛合
金溶湯を調製し、鋳造後圧延にて厚さ３簡の板材とした
。この板材から厚さ３１８１１ Ｘ巾１０鵡×長さ１５
０１ＩＩｌｌＩＯ寸法を持つ試験材を切出し、これを陽
極とした。電解面積はｔｓｉである。一方、陰極として
は純鉛展の厚さ５１ｗ×巾６０簡×長さ１５０鴎の板を
使用し、陰極２枚を陽極を挾すより対峙させた。In short, it is only necessary that the discharge part of the electrode be made of the alloy of the present invention.A molten lead alloy having the composition shown in Table 1 is prepared by a normal melting method, and after casting and rolling, a plate of 3 strips in thickness is prepared. And so. From this board, thickness 31811 x width 10 x length 15
A test material having dimensions of 01IIllIO was cut out and used as an anode. The electrolytic area is tsi. On the other hand, as the cathode, a plate made of pure lead with a thickness of 51w x width of 60cm x length of 150mm was used, and the two cathodes were placed facing each other rather than sandwiching the anode.
耐食性試験は次のようにして行った：陽極及び陰極を、
ＮａｚＳＯ４ｔ ７１ＪＦ／ノの割合で溶解し更に硫９
（１＋ｊ）を加えることによシ調製した硫醗削性芒硝溶
液（声−１１）中に浸漬し、浴温−４０〜６０℃、印加
電流−３Ａ、電流密度２００Ａ／ｄｍ２、通電時間＝１
００時間の条件下で電解試験を行った。試験後陽極を乾
燥炉に入れて乾燥し、試験片の重量減を計測した。計測
した試験片の重量減から単位電位量当シの重量減金算出
した。結果を表１に併せて示す。第１図はそのグラフ表
示である０表 １
成分組成（ｗ’ｒ％） 重量減
試験ム
ＴＩ ｐｂ （〜／人・Ｈｒ）
１ − − 残 ＩＩＬ５２
α５ − ＪＦ ９．７３
１ − ＃ １５．６
４ ３ − ＪＦ
６．Ｑ５ ５ −
ｚ ４，０６ ６
− ｔ ｒ：Ｌ５６７
７ − １ （Ｌ６０
８ ８ − ＃
（ＬａＯ２９−！ α９０
１１ １１ − ＃
ｔ９１２ １２ −
＃ ２．３実施例２及び比較例
（Ｐｂ−Ｔｊ−Ｓｎ系）表２に示すような様々の組成の
Ｐｂ−Ｔノーａｎ 合金を実施例１と同様にして電解
試験し、重量減を調べた。結果を表２及び第２図に示す
。The corrosion resistance test was carried out as follows: the anode and cathode were
Dissolve NazSO4t at a rate of 71JF/no and further add sulfur 9
Immerse it in a sulfur-cutting Glauber's salt solution (Voice-11) prepared by adding (1+j), bath temperature -40 to 60°C, applied current -3A, current density 200A/dm2, current application time = 1
An electrolytic test was conducted under conditions of 00 hours. After the test, the anode was placed in a drying oven and dried, and the weight loss of the test piece was measured. The weight loss per unit electric potential was calculated from the measured weight loss of the test piece. The results are also shown in Table 1. Figure 1 is a graphical representation of this.
1 - - Remaining IIL52
α5-JF 9.73
1 - #15.6
4 3-JF
6. Q5 5 -
z 4,06 6
-tr:L567
7-1 (L60
8 8 - #
(LaO29-! α90 11 11 - #
t912 12 -
#2.3 Example 2 and Comparative Example (Pb-Tj-Sn system) Pb-T alloys with various compositions as shown in Table 2 were electrolytically tested in the same manner as in Example 1, and weight loss was investigated. Ta. The results are shown in Table 2 and Figure 2.
表 ２
表 ２ （続き）
発明の効果
高電流密度対応の高耐食性・低融点合金製不溶性陽極の
提供によシ、高い生産性の下でしかも浴の保守管理を容
易にして高品質のメッキ及び箔製品の製造を可能ならし
める。これらは次のようにまとめることが出来る：
ｔ 腐食量の減少による電極痔命の延長（コストダウン
）
λ 腐食量の減少による極間調整日数の減少五
ｒ 浴組成管理の簡易化４、 スラッジ沈降剤
等の添加量の減少（コストダウン）
５、製品品質の向上
＆ 合金製造の容易化・コストダウン
Ｚ 母材への溶接・肉盛シに際しての母材の変形防止
＆ 回収再溶解において酸化による損失減、少９ 圧延
、押出、切断、溶接等の加工の容易化ＩＣＬ 腐食量
の減少による薄肉軽量化の実現とれらメリットの下で、
均質な厚メッキや箔製造が可能となる。Table 2 Table 2 (Continued) Effects of the invention By providing an insoluble anode made of a highly corrosion-resistant and low-melting point alloy that can handle high current densities, it is possible to achieve high quality plating and plating with high productivity and easy bath maintenance management. Making it possible to manufacture foil products. These can be summarized as follows: t Extension of electrode life (cost reduction) due to reduction in corrosion amount λ Reduction in electrode spacing adjustment days due to reduction in corrosion amount
r Simplification of bath composition management 4. Reduction in the amount of sludge settling agents added (cost reduction) 5. Improvement of product quality & easier alloy manufacturing/cost reduction Z. Preventing material deformation & reducing losses due to oxidation during recovery and remelting 9. Easier processing such as rolling, extrusion, cutting, welding, etc. ICL Realization of thinner and lighter walls due to less corrosion.With these advantages,
It becomes possible to manufacture uniformly thick plating and foil.
第１図はＰｂ −Ｔ７合金製不溶性陽極について重ｆｆ
ｉ減（１！９／人・Ｈｒ）とＴノ含有ｆｆ１（重ｆｆｉ
％）との関係を示すグラフであシ、そして第２図はＰｂ
−Ｔ７−Ｓｎ合金製不溶性陽極について規程かのＴ！含
量について重量減とＳｎ含有ｆＩｋ（重量イ）の関係上
水すグ：７７である。
手続補正書
昭和６２年６月１日
特許庁長官 黒 １）明 雄 殿
事件の表示 昭和６１年 特願第２４１４１７ 号発
明の名称 鉛合金製不溶性陽極
補正をする者
事件との関係 特許出願人名 称
芳沢機工東部株式会社Figure 1 shows heavy ff for an insoluble anode made of Pb-T7 alloy.
i reduction (1!9/person/Hr) and T-containing ff1 (heavy ffi
%), and Figure 2 is a graph showing the relationship between Pb
-T7-Regulations regarding insoluble anodes made of Sn alloys! Regarding the content, the relationship between weight loss and Sn content fIk (weight I) is 77. Procedural amendment June 1, 1988 Commissioner of the Japan Patent Office Black 1) Indication of the case of Yu Akira 1988 Japanese Patent Application No. 241417 Title of the invention Relationship to the case of person who corrects lead alloy insoluble anode Patent applicant name Title
Yoshizawa Kiko Tobu Co., Ltd.
Claims (1)
％まで含有し、残部が鉛と不可避的不純物から成る鉛合
金を放電部とする高電流密度用不溶性陽極。 ２）陽極全体が前記鉛合金から成る特許請求の範囲第１
項記載の不溶性陽極。 ３）表面を耐食性材料で被覆したクラッド材を母材とし
、その少くとも片面に前記鉛合金を被覆した特許請求の
範囲第１項記載の不溶性陽極。 ４）耐食性材料製母材の少くとも片面に前記鉛合金を被
覆した特許請求の範囲第１項記載の不溶性陽極。 ５）重量算で表わして、タリウムを０．５〜１２％そし
て錫を０．０１〜１０％含有し、残部が鉛と不可避的不
純物から成る鉛合金を放電部とする高電流密度用不溶性
陽極。 ６）陽極全体が前記鉛合金から成る特許請求の範囲第５
項記載の不溶性陽極。 ７）表面を耐食性材料で被覆したクラッド材を母材とし
、その少くとも片面に前記鉛合金を被覆した特許請求の
範囲第５項記載の不溶性陽極。 ８）耐食性材料製母材の少くとも片面に前記鉛合金を被
覆した特許請求の範囲第５項記載の不溶性陽極。[Scope of Claims] 1) More than 6% thallium and 12% by weight
An insoluble anode for high current densities whose discharge part is a lead alloy containing up to 50% lead and the remainder consisting of lead and unavoidable impurities. 2) Claim 1 in which the entire anode is made of the lead alloy.
Insoluble anode as described in section. 3) The insoluble anode according to claim 1, wherein the base material is a clad material whose surface is coated with a corrosion-resistant material, and at least one side of the clad material is coated with the lead alloy. 4) The insoluble anode according to claim 1, wherein at least one side of a base material made of a corrosion-resistant material is coated with the lead alloy. 5) An insoluble anode for high current density whose discharge part is a lead alloy containing 0.5 to 12% thallium and 0.01 to 10% tin, the balance being lead and unavoidable impurities, expressed by weight. . 6) Claim 5 in which the entire anode is made of the lead alloy.
Insoluble anode as described in section. 7) The insoluble anode according to claim 5, wherein the base material is a clad material whose surface is coated with a corrosion-resistant material, and at least one side of the clad material is coated with the lead alloy. 8) The insoluble anode according to claim 5, wherein at least one side of a base material made of a corrosion-resistant material is coated with the lead alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61241417A JPS6396297A (en) | 1986-10-13 | 1986-10-13 | Insoluble anode made of lead alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61241417A JPS6396297A (en) | 1986-10-13 | 1986-10-13 | Insoluble anode made of lead alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6396297A true JPS6396297A (en) | 1988-04-27 |
Family
ID=17073982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61241417A Pending JPS6396297A (en) | 1986-10-13 | 1986-10-13 | Insoluble anode made of lead alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6396297A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009145994A1 (en) * | 2008-03-31 | 2009-12-03 | Michael Steven Georgia | Polymeric, non-corrosive cathodic protection anode |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS537375A (en) * | 1976-07-09 | 1978-01-23 | Toshiba Corp | Digital signal conversion circuit |
| JPS58199900A (en) * | 1982-05-14 | 1983-11-21 | Sumitomo Metal Ind Ltd | Electrode for plating |
-
1986
- 1986-10-13 JP JP61241417A patent/JPS6396297A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS537375A (en) * | 1976-07-09 | 1978-01-23 | Toshiba Corp | Digital signal conversion circuit |
| JPS58199900A (en) * | 1982-05-14 | 1983-11-21 | Sumitomo Metal Ind Ltd | Electrode for plating |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009145994A1 (en) * | 2008-03-31 | 2009-12-03 | Michael Steven Georgia | Polymeric, non-corrosive cathodic protection anode |
| US8329004B2 (en) | 2008-03-31 | 2012-12-11 | Aep & T, Llc | Polymeric, non-corrosive cathodic protection anode |
| AU2009251723B2 (en) * | 2008-03-31 | 2013-04-18 | Aep & T, Inc. | Polymeric, non-corrosive cathodic protection anode |
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