JPS6391844A - Production of optical disk - Google Patents
Production of optical diskInfo
- Publication number
- JPS6391844A JPS6391844A JP23772886A JP23772886A JPS6391844A JP S6391844 A JPS6391844 A JP S6391844A JP 23772886 A JP23772886 A JP 23772886A JP 23772886 A JP23772886 A JP 23772886A JP S6391844 A JPS6391844 A JP S6391844A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- support
- thin film
- circumferential direction
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims abstract description 93
- 239000010409 thin film Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims description 10
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 abstract description 11
- 238000004544 sputter deposition Methods 0.000 abstract description 9
- 230000002950 deficient Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 229920000307 polymer substrate Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005477 sputtering target Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は大容量データファイルや画像記録等に用いられ
る光ディスクの＠Ｉ造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing optical discs used for recording large-capacity data files, images, and the like.
（従来の技術）
一般に光ディスクは円形の透明高分子基板上に光記録用
１１１！！あるいは再生光反射薄膜を形成して製造され
る。(Prior Art) Generally, an optical disk is made of a circular transparent polymer substrate for optical recording. ! Alternatively, it is manufactured by forming a reproduction light reflecting thin film.
このような薄膜を形成する際には、基板支持具により基
板を支持し、基板の外周部あるいは内周部をこの支持具
に固定してスパッタリングあるいは蒸着を行なう。When forming such a thin film, the substrate is supported by a substrate support, and sputtering or vapor deposition is performed with the outer or inner circumference of the substrate fixed to the support.
（発明が解決しようとする問題点）
基板の外周部あるいは内周部を支持具に固定する際、例
えば外周部の複数点において基板を支持具に押圧して固
定する場合には、各点における押圧力が不均一であった
り、押圧か所が少数であったりすると基板全体に不均一
な内部応力が発生する。そして基板の内部応力が不均一
な状態で薄膜形成を行なうとスパッタリングや蒸着に伴
なう基板の熱膨張による残留熱ひずみが発生し、基板冷
却後において薄膜の内部応力も不均一となる。これによ
り基板と薄膜の密着性が不良となり、薄膜のクラックも
発生しやすくなる。とくに基板の円周方、向において上
記密着性が不良になったり、クラックが発生したりする
と記録情報の信頼性が大きく低下するという問題がある
。(Problems to be Solved by the Invention) When fixing the outer or inner circumference of a substrate to a support, for example, when fixing the substrate to the support by pressing it at multiple points on the outer circumference, If the pressing force is not uniform or if there are only a few places where the pressure is applied, non-uniform internal stress will occur over the entire substrate. If a thin film is formed while the internal stress of the substrate is non-uniform, residual thermal strain will occur due to thermal expansion of the substrate during sputtering or vapor deposition, and the internal stress of the thin film will also become non-uniform after the substrate has been cooled. This results in poor adhesion between the substrate and the thin film, and cracks in the thin film are likely to occur. In particular, if the adhesion becomes poor or cracks occur in the circumferential direction of the substrate, there is a problem in that the reliability of recorded information is greatly reduced.
本発明はこのような問題を解決するためになされたもの
であり、基板を支持具に固定する際に基板にその円周方
向の内部応力が発生しないようにし、基板円周方向の基
板、薄膜間の密着性の不良化および薄膜のクラックの発
生を防止して情報記録の高信頼性が得られる光ディスク
の製造方法を提供することを目的とするものである。The present invention was made in order to solve such problems, and it is possible to prevent internal stress from occurring in the circumferential direction of the substrate when fixing the substrate to a support, and to prevent the occurrence of internal stress in the circumferential direction of the substrate and the thin film. It is an object of the present invention to provide a method for manufacturing an optical disc that can obtain high reliability in information recording by preventing poor adhesion between the discs and cracks in the thin film.
（問題点を解決するための手段）
本発明の光ディスクの製造方法は、円形透明基板上にｗ
ｉ膜を形成する際に、予め、基板支持具の基板支持面を
鏡面加工しておき、その基板支持面に基板を密接させ、
この基板支持面と基板からの反射光により形成される干
渉縞パターンが基板と同心円状となるように支持具によ
り基板を支持し、これにより基板の内部応力が基板の円
周方向に均一にした状態で７ａ膜を形成することを特徴
とするものである。(Means for Solving the Problems) The method for manufacturing an optical disc of the present invention provides a method for manufacturing an optical disc on a circular transparent substrate.
When forming the i-film, the substrate supporting surface of the substrate support is mirror-finished in advance, and the substrate is brought into close contact with the substrate supporting surface.
The substrate is supported by a support so that the interference fringe pattern formed by the substrate support surface and the reflected light from the substrate is concentric with the substrate, thereby making the internal stress of the substrate uniform in the circumferential direction of the substrate. It is characterized by forming a 7a film in this state.
ここに、「光ディスク」は再生専用ディスクおよび光記
録用ディスク（ＤＲＡＷ）を含み、さらに光記録用ディ
スクの中には光磁気ディスク等の消去再記録可能なもの
も含むものとする。Here, the term "optical disk" includes read-only disks and optical recording disks (DRAW), and optical recording disks also include erasable and re-recordable disks such as magneto-optical disks.
また、「円形透明基板」とは円板状で：４膜形成し得る
材質で光に対して透明のものであれば何でもよいが、一
般には非磁性透明高分子の基板である。Further, the "circular transparent substrate" may be any material as long as it is disk-shaped, can form a 4-layer film, and is transparent to light, but is generally a non-magnetic transparent polymer substrate.
また、「薄膜」とはスパッタリングあるいは蒸着により
形成される光記録のための薄膜をいうが、記録光あるい
は再生光の反射膜、さらには例えば光磁気記録膜に隣接
して設けられる誘電体保護膜等も含むものとする。Furthermore, the term "thin film" refers to a thin film for optical recording formed by sputtering or vapor deposition, but it also includes a reflective film for recording light or reproduction light, and a dielectric protective film provided adjacent to a magneto-optical recording film, for example. etc. shall also be included.
また、「基板支持具」とは基板上に薄膜を形成する際に
基板の外周部または内周部の位置を規制して支持し、基
板上に所定の厚さの薄膜を形・成するためのものである
。In addition, "substrate support" is used to regulate and support the position of the outer or inner circumference of the substrate when forming a thin film on the substrate, and to form and form a thin film of a predetermined thickness on the substrate. belongs to.
また、「密接させ」とは上記干渉縞が生じる程度の間隔
をおいてということである。Furthermore, "closely placed" means to be spaced apart enough to produce the above-mentioned interference fringes.
（発明の効果）
本発明の光ディスクの製造方法によれば、基板の内部応
力を基板の円周方向に均一にした状態で薄膜を形成する
ようにしており、基板の熱膨張による基板の残留熱ひず
みを円周方向で均一にした状態で薄膜を形成できるので
、基板冷却後において薄膜の内部応力がその円周方向に
不均一とならないようにすることができる。(Effects of the Invention) According to the optical disk manufacturing method of the present invention, a thin film is formed with the internal stress of the substrate made uniform in the circumferential direction of the substrate, and the residual stress of the substrate due to thermal expansion of the substrate Since the thin film can be formed with uniform strain in the circumferential direction, it is possible to prevent the internal stress of the thin film from becoming non-uniform in the circumferential direction after cooling the substrate.
これにより形成された薄膜と基板間において基板円周方
向の密着性の不良化およびその方向のクラック発生を防
止することができ、記録情報の高信頼性を長期に亘って
有する光ディスクを形成することができる。As a result, it is possible to prevent poor adhesion in the circumferential direction of the substrate and cracks in that direction between the formed thin film and the substrate, and to form an optical disk that has high reliability of recorded information over a long period of time. Can be done.
（実 施 例） 以下本発明の実施例について図面を用いて説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.
第１図は本発明に係る光ディスクの製造方法を実施する
ための装置の一例を示すものである。FIG. 1 shows an example of an apparatus for carrying out the method of manufacturing an optical disc according to the present invention.
この装置はアルゴンガスを１０゛３〜１０（Ｔｏｒｎ程
度封入した真空槽内に配され、円板状高分子透明基板（
ＰＣ，ＰＭＭＡ、アクリル等）１を支持する支持具２と
スパッタ装置からなるものである。支持具２は基板１が
密接される円形の基板支持面３を有する支持台４、支持
台４との間に基板１の外周部を全面に戸って保持するた
めの外周支持マスク５、およびテフロン等の弾性変形体
６を介して外周支持マスク５と対向して配され、ボルト
７を用いて外周支持マスク５と支持台４を一体的に固定
し、このマスク５と支持台４の間に基板１の外周部を挟
持しその位置を規制するためのマスク押え８からなる。This device is placed in a vacuum chamber filled with argon gas of about 10 to 10 Torn, and is placed on a disc-shaped polymeric transparent substrate (
It consists of a support 2 that supports a material (PC, PMMA, acrylic, etc.) 1 and a sputtering device. The support 2 includes a support pedestal 4 having a circular substrate support surface 3 to which the substrate 1 is brought into close contact, a peripheral support mask 5 for holding the periphery of the substrate 1 by closing the entire surface between the support pedestal 4 and the support pedestal 4; It is arranged to face the outer peripheral support mask 5 via an elastically deformable body 6 such as Teflon, and the outer peripheral support mask 5 and the support base 4 are integrally fixed using bolts 7, and between the mask 5 and the support base 4. The mask holder 8 includes a mask holder 8 for holding the outer peripheral portion of the substrate 1 and regulating its position.
支持台４は基板１の支持に際しその剛性を失わない程度
の厚さ、材質に・より形成されており、基板１よりも外
径が人となるように形成されている。この支持台４の中
央部には基板１と同一半径の段部９が形成されておりそ
の表面は鏡面加工仕上された基板支持面３として形成さ
れる。なお、基板支持面３の表面あらさＲａは０．６μ
ｍ以下、好ましくは０．１５μｍ以下である。ここで表
面あらさＲａはＪ Ｉ Ｓ １３０６０？に準じカット
オフ０．２５ ｍでの測定値である。また、支持台４の
、段部９の他の部分は支持台４の全周に亘って外周支持
マスク５の段部１０がはまり込むことができるような形
状に形成され、円周方向に略等間隔に例えば、４ケ所あ
るいは８ケ所のメネジ部１１が設けられている。次に、
外周支持マスク５は支持台４と同一外径で、基板１の外
径よりもやや大きい内径を有するリング状に形成され、
内周部以外には支持台４の段部９の高さと基板１の厚さ
の和に略等しい高さを有する段部１０が形成されており
、支持台４との間に基板１を挾持したときこの段部１０
の上面が支持台４に面接触するようになっている。なお
、このマスク５の段部１０には支持台４のメネジ部１１
と対向する位置にこの段部１０を貫通するメネジ部１２
が形成されている。なお、マスク５の押え部分１５は薄
膜の記録領域にかからない程度の長さに形成されている
。次に、マスク押え８は支持台４と同程度の外径を有す
るリング状に形成され、その中周部において外周支持マ
スク５のメネジ部１２と対向する位置にこのマスク押え
８を貫通するメネジ部１３が形成されており、このメネ
ジ部１３から各々外周方向と内周方向の略等間隔の位置
であってマスク５と対向する面に全周に亘って弾性変形
体もがはまるＵ字溝１４が形成されている。The support stand 4 is made of a material and has a thickness that does not lose its rigidity when supporting the substrate 1, and is formed so that its outer diameter is larger than that of the substrate 1. A stepped portion 9 having the same radius as the substrate 1 is formed in the center of the support base 4, and the surface thereof is formed as a mirror-finished substrate supporting surface 3. Note that the surface roughness Ra of the substrate support surface 3 is 0.6μ.
m or less, preferably 0.15 μm or less. Here, the surface roughness Ra is JIS 13060? These are the measured values at a cutoff of 0.25 m according to the above. Further, the other part of the step 9 of the support base 4 is formed in such a shape that the step 10 of the outer periphery support mask 5 can be fitted over the entire circumference of the support base 4, and is approximately circumferentially For example, four or eight female threaded portions 11 are provided at equal intervals. next,
The outer peripheral support mask 5 is formed into a ring shape having the same outer diameter as the support base 4 and an inner diameter slightly larger than the outer diameter of the substrate 1.
A stepped portion 10 having a height approximately equal to the sum of the height of the stepped portion 9 of the support base 4 and the thickness of the substrate 1 is formed in areas other than the inner peripheral portion, and the step portion 10 is formed to sandwich the substrate 1 between the support base 4 and the thickness of the substrate 1. When this step 10
The upper surface of the support base 4 is in surface contact with the support base 4. Note that the stepped portion 10 of this mask 5 has a female screw portion 11 of the support base 4.
A female threaded portion 12 passing through this stepped portion 10 is located at a position facing the
is formed. Note that the holding portion 15 of the mask 5 is formed to have a length that does not cover the recording area of the thin film. Next, the mask holder 8 is formed into a ring shape having an outer diameter comparable to that of the support base 4, and has a female screw thread passing through the mask holder 8 at a position facing the female thread part 12 of the outer periphery support mask 5 at its middle circumference. A U-shaped groove into which the elastically deformable body is fitted is formed on the surface facing the mask 5 at approximately equal intervals in the outer circumferential direction and the inner circumferential direction from the female threaded portion 13 over the entire circumference. 14 is formed.
また、この弾性変形体６は前述したようにテフロン等の
弾性変形材料からなり、リング状に形成されている。な
お、この変形体６はメネジ部１３よりもやや内周部と外
周部に各々１つづつ配されるのでリング径もそれに応じ
たものとされている。ボルト７は通常市販されているも
のを使用すればよいが、完全ネジ部が、マスク押え８、
外周支持マスク５および支持台４を一体的に固定して基
板１の外周部を確実に保持し得る程度の長さを有してい
るものを用いる。なお、メネジ部１１．１２．１３は当
然に各々の内径が等しくなるように形成されている。支
持具２は真空槽に対して基板１が下方となるように配さ
れ、スパッタリングが開始される前に支持具全体が矢印
六方向に安定回転するように設定されている。またスパ
ッタリング用ターゲット１６は所定の薄膜を形成し得る
物質で構成され、この薄膜が基板１の全面に亘って均一
の厚さで形成されるようにこの基板１の略直下に所定の
形状にて配設される。本発明により得られた薄膜は、従
来品より密着性が高く、かつＨＣの均一性の高いもので
ある。Further, as described above, the elastically deformable body 6 is made of an elastically deformable material such as Teflon, and is formed into a ring shape. Incidentally, since one deformable body 6 is disposed at a slightly inner circumferential portion and one at a slightly outer circumferential portion of the female threaded portion 13, the ring diameter is also set accordingly. The bolt 7 can be a commercially available one, but the completely threaded part is the mask holder 8,
The outer peripheral support mask 5 and the support base 4 are integrally fixed to each other and have a length sufficient to reliably hold the outer peripheral portion of the substrate 1. Incidentally, the female threaded portions 11, 12, and 13 are naturally formed to have the same inner diameter. The support 2 is arranged with the substrate 1 facing downward with respect to the vacuum chamber, and is set so that the entire support 2 rotates stably in the six directions of arrows before sputtering is started. The sputtering target 16 is made of a substance capable of forming a predetermined thin film, and is placed approximately directly under the substrate 1 in a predetermined shape so that the thin film is formed with a uniform thickness over the entire surface of the substrate 1. will be placed. The thin film obtained by the present invention has higher adhesion and higher HC uniformity than conventional products.
次に上述した装置を用いて光ディスクを製造する方法に
ついて説明する。まず、支持台４と外周支持マスク５の
間に基板１を挾み、この状態でマスク押え８の全てのメ
ネジ部１３にボルト７を螺入する。この後、さらにこれ
らのボルト７を螺入していき、外周支持マスク５および
支持台４が一体的に結合されて基板１がマスク５と支持
台４により完全に挾持されるようにする。このとき基板
１に対して下方から光（自然光でもよい）を照射し、支
持台４の基板支持面３および基板１からの反射光により
生じる干渉縞パターンを観察し、この干渉縞パターンが
第２図に示すように同心円状になるまでボルト７の螺入
調整を行なう。このような同心円状の干渉縞パターンが
生じることは支持台４の基板支持面３からの反射光と基
板１からの反射光との光路差すなわち支持面３と基板１
との空隙が基板円周方向に等しいことを意味する。この
ような状態の基板１はその内部応力が基板円周方向に均
一であり、このままの状態でスパッタリングを行なえば
内部応力が基板円周方向に均一な薄膜を形成することが
できる。Next, a method for manufacturing an optical disc using the above-described apparatus will be explained. First, the substrate 1 is sandwiched between the support base 4 and the outer peripheral support mask 5, and in this state, the bolts 7 are screwed into all the female threads 13 of the mask holder 8. Thereafter, these bolts 7 are further screwed in, so that the outer peripheral support mask 5 and the support base 4 are integrally connected, and the substrate 1 is completely held between the mask 5 and the support base 4. At this time, the substrate 1 is irradiated with light (natural light may be used) from below, and the interference fringe pattern generated by the reflected light from the substrate support surface 3 of the support stand 4 and the substrate 1 is observed. Adjust the screws of the bolts 7 until they form concentric circles as shown in the figure. The occurrence of such a concentric interference fringe pattern is due to the optical path difference between the light reflected from the substrate support surface 3 of the support base 4 and the light reflected from the substrate 1, that is, between the support surface 3 and the substrate 1.
This means that the gap between the two is equal in the circumferential direction of the substrate. The internal stress of the substrate 1 in this state is uniform in the circumferential direction of the substrate, and if sputtering is performed in this state, a thin film with uniform internal stress in the circumferential direction of the substrate can be formed.
ところで従来はこのような基板支持を行なう場合に、単
に外周支持マスクと支持台を外周の数点においてネジ止
めするだけであった。したがってネジ止めの精密調整を
行なっても基板全周に亘って均一な加重を加えることが
困難で干渉縞パターンは第３図に示すようなものになっ
ていた。しかし上述した装置においてはリング状の弾性
変形体６およびマスク押え８を用いてボルト７による加
重を外周全周に亘って分散せしめているので基板１の円
周方向に内部応力を均一にしやすく略第２図に示すよう
な干渉パターンを得ることができる。Conventionally, when supporting the substrate in this manner, the outer periphery support mask and the support stand were simply screwed together at several points on the outer periphery. Therefore, even if the screw fixing was precisely adjusted, it was difficult to apply a uniform load over the entire circumference of the board, resulting in an interference fringe pattern as shown in FIG. However, in the above-described device, the ring-shaped elastic deformable body 6 and the mask holder 8 are used to distribute the load applied by the bolt 7 over the entire outer circumference, making it easier to uniformize the internal stress in the circumferential direction of the substrate 1. An interference pattern as shown in FIG. 2 can be obtained.
なお、上述した装置においては基板１の外周部を支持す
る支持具を用いているが、その内周部を支持する支持具
あるいは外周部と内周部の相方を支持する支持具を用い
てもよい。Note that although the above-described device uses a support that supports the outer circumference of the substrate 1, a support that supports the inner circumference or a support that supports the outer and inner circumference may also be used. good.
なお、上述した装置においては薄膜形成手段としてスパ
ッタリングを用いているがこれに代えて 。Note that in the above-mentioned apparatus, sputtering is used as a thin film forming means, but this is replaced by sputtering.
ＷＳ着を用いてもよく、この場合には第１図に示すスパ
ッタリング用ターゲット１６が配設されている位置に蒸
着源を配設する。WS deposition may be used, and in this case, a vapor deposition source is provided at the location where the sputtering target 16 shown in FIG. 1 is provided.
さらに、本発明の方法としては第１図に示す装置を用い
た方法に限られるものではなく、その他種々の態様によ
り本発明の目的を達成することができる。Furthermore, the method of the present invention is not limited to the method using the apparatus shown in FIG. 1, and the objects of the present invention can be achieved by various other embodiments.
第１図は、本発明に係る光ディスクの装置方法を実施す
るための装置の一例を示す側断面図、第２図および第３
図は、それぞれ、本発明および従来技術を用いて得られ
る干渉縞パターンの様子を示す概略図である。
１・・・円板状高分子透明基板FIG. 1 is a side sectional view showing an example of an apparatus for carrying out the optical disc apparatus method according to the present invention, and FIGS.
The figures are schematic diagrams showing interference fringe patterns obtained using the present invention and the prior art, respectively. 1...Disc-shaped polymer transparent substrate
Claims (1)
面を有する支持具により、その外周部または内周部の位
置を規制して支持し、この後該透明基板上に光記録用薄
膜を形成する光ディスクの製造方法において、 前記支持具の基板支持面を鏡面加工しておき、前記薄膜
を形成する際に、前記透明基板および前記鏡面加工され
た基板支持面からの反射光により生じる干渉縞のパター
ンが該透明基板の中心を中心とする同心円状になるよう
にこの透明基板の支持を行なうことを特徴とする光ディ
スクの製造方法。[Claims] A circular transparent substrate is supported by regulating the position of its outer circumference or inner circumference by a support having a substrate support surface in close contact with one surface of the transparent substrate, and then the circular transparent substrate is In the method for manufacturing an optical disc, in which a thin film for optical recording is formed on a substrate, the substrate supporting surface of the support is mirror-finished, and when forming the thin film, the transparent substrate and the mirror-finished substrate supporting surface are A method for manufacturing an optical disk, comprising supporting the transparent substrate so that a pattern of interference fringes caused by reflected light forms a concentric circle centered on the center of the transparent substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23772886A JPS6391844A (en) | 1986-10-06 | 1986-10-06 | Production of optical disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23772886A JPS6391844A (en) | 1986-10-06 | 1986-10-06 | Production of optical disk |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6391844A true JPS6391844A (en) | 1988-04-22 |
Family
ID=17019606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23772886A Pending JPS6391844A (en) | 1986-10-06 | 1986-10-06 | Production of optical disk |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6391844A (en) |
-
1986
- 1986-10-06 JP JP23772886A patent/JPS6391844A/en active Pending
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