JPS6388808U - - Google Patents

Info

Publication number
JPS6388808U
JPS6388808U JP1986182594U JP18259486U JPS6388808U JP S6388808 U JPS6388808 U JP S6388808U JP 1986182594 U JP1986182594 U JP 1986182594U JP 18259486 U JP18259486 U JP 18259486U JP S6388808 U JPS6388808 U JP S6388808U
Authority
JP
Japan
Prior art keywords
fiber bundle
led array
light
array head
curved surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986182594U
Other languages
English (en)
Other versions
JPH059697Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986182594U priority Critical patent/JPH059697Y2/ja
Priority to US07/098,782 priority patent/US4805983A/en
Publication of JPS6388808U publication Critical patent/JPS6388808U/ja
Application granted granted Critical
Publication of JPH059697Y2 publication Critical patent/JPH059697Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73215—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Laser Beam Printer (AREA)
  • Led Device Packages (AREA)
  • Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の側面図、第２図は
フアイバーアレイプレートの斜視図、第３図はフ
アイバーアレイプレートの部分断面図、第４図は
光フアイバーの断面図、第５図は本考案の他の実
施例の側面図、第６図は従来例の側面図である。 １２……ＬＥＤチツプ、１２ａ……発光部、１
５……フアイバー束、１６……ベース部材、１７
……フアイバーアレイプレート、２１……光フア
イバー。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) ＬＥＤアレイの発光部を選択的に発光させ
    ることにより被露光物を露光するＬＥＤアレイヘ
    ツドにおいて、複数の光フアイバーよりなるフア
    イバー束をその一端部が前記発光部に近接するよ
    うに配設すると共に、前記フアイバー束の他端部
    を曲面に形成したことを特徴とするＬＥＤアレイ
    ヘツド。 (2) 前記被露光物が前記フアイバー束の他端部
    の曲面と接触することを特徴とする実用新案登録
    請求の範囲第(1)項記載のＬＥＤアレイヘツド。
JP1986182594U 1986-11-27 1986-11-27 Expired - Lifetime JPH059697Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1986182594U JPH059697Y2 (ja) 1986-11-27 1986-11-27
US07/098,782 US4805983A (en) 1986-11-27 1987-09-21 Led array head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986182594U JPH059697Y2 (ja) 1986-11-27 1986-11-27

Publications (2)

Publication Number Publication Date
JPS6388808U true JPS6388808U (ja) 1988-06-09
JPH059697Y2 JPH059697Y2 (ja) 1993-03-10

Family

ID=16121011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986182594U Expired - Lifetime JPH059697Y2 (ja) 1986-11-27 1986-11-27

Country Status (2)

Country Link
US (1) US4805983A (ja)
JP (1) JPH059697Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000001984A1 (fr) * 1998-07-02 2000-01-13 Ccs Inc. Dispositif d'illumination utilise pour l'inspection de surfaces

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5630001A (en) * 1995-05-22 1997-05-13 Motorola Image generator for use in image manifestation apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598074A (ja) * 1982-07-05 1984-01-17 Nippon Telegr & Teleph Corp <Ntt> 画像処理方式
JPS60143982A (ja) * 1983-12-29 1985-07-30 Sanyo Electric Co Ltd 発光ダイオ−ドヘツド
JPS6162016A (ja) * 1984-09-03 1986-03-29 Nhk Spring Co Ltd Ｌｅｄプリンタヘツド

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3630612A (en) * 1970-09-23 1971-12-28 Kurt Lehovec Optical aid for book reproduction
JPS5714058A (en) * 1980-06-28 1982-01-25 Ricoh Co Ltd Printer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598074A (ja) * 1982-07-05 1984-01-17 Nippon Telegr & Teleph Corp <Ntt> 画像処理方式
JPS60143982A (ja) * 1983-12-29 1985-07-30 Sanyo Electric Co Ltd 発光ダイオ−ドヘツド
JPS6162016A (ja) * 1984-09-03 1986-03-29 Nhk Spring Co Ltd Ｌｅｄプリンタヘツド

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000001984A1 (fr) * 1998-07-02 2000-01-13 Ccs Inc. Dispositif d'illumination utilise pour l'inspection de surfaces

Also Published As

Publication number Publication date
US4805983A (en) 1989-02-21
JPH059697Y2 (ja) 1993-03-10

Similar Documents

Publication Publication Date Title
JPS6388809U (ja)
JPS6388808U (ja)
JPS6388810U (ja)
JPS6326803U (ja)
JPH01104342U (ja)
JPS6343464U (ja)
JPH0347141U (ja)
JPS63107066U (ja)
JPS61126206U (ja)
JPS63111061U (ja)
JPH0316168U (ja)
JPS58105513U (ja) レ−ザダイオ−ドアレイ結合構造
JPS58178249U (ja) 拡散型光フアイバ光電スイツチの先端形状
JPS63177803U (ja)
JPS6292663U (ja)
JPH0233466U (ja)
JPS6368441U (ja)
JPS6291459U (ja)
JPS6338109U (ja)
JPH02127049U (ja)
JPS61126549U (ja)
JPS62118201U (ja)
JPS6398508U (ja)
JPH0358641U (ja)
JPS62178155U (ja)