JPS638434B2 - - Google Patents
Info
- Publication number
- JPS638434B2 JPS638434B2 JP57148518A JP14851882A JPS638434B2 JP S638434 B2 JPS638434 B2 JP S638434B2 JP 57148518 A JP57148518 A JP 57148518A JP 14851882 A JP14851882 A JP 14851882A JP S638434 B2 JPS638434 B2 JP S638434B2
- Authority
- JP
- Japan
- Prior art keywords
- pin
- board
- performance board
- guide
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000013011 mating Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000002513 implantation Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Description
【発明の詳細な説明】
本発明はICテスタのテストヘツド内の、ピン
ボード側コンタクトピン端部とIC接続部を有す
るパフオーマンスボード側コンタクトパツド間で
接触不良が生じないようにしたピン接続機構に関
する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pin connection mechanism in a test head of an IC tester that prevents contact failure between the contact pin ends on the pin board side and the contact pads on the performance board side having an IC connection part. .
ICテスタは本体部分と、インタフエースとな
るテストヘツドとに分れ、テストヘツドは、イン
タフエース回路を搭載したピンボードを内部に収
納し、また試験すべきICを接続するソケツトを
表面に取付けたパフオーマンスボードを上部に有
する。ピンボードとパフオーマンスボードとは、
ピンボードのエツジに取付けたピンコネクタに弾
性的に植設された多数本のコンタクトピン端部
と、パフオーマンスボード裏面に対応して配設し
た多数個所のコンタクトパツドとの接触によつ
て、電気的に接続される。１つのテストヘツド内
に収納されるピンボードの枚数は数十枚に達する
こともあり、コンタクトピンとコンタクトパツド
とによる接続個所は非常に多数となる。そのため
個々の接触部における接触圧力は小さくても全接
触部における接触圧力を合計すると例えば20Kgに
も達し、テストヘツド底部でピンボードをエツジ
カード方式の接続部を介して支持するボードが凹
面に変形したり、パフオーマンスボード自体に多
少そりが生じている場合もあつて、上記ピンとパ
ツドとによる接続部分で接触不良が生じ易かつ
た。しかし、パフオーマンスボードは被試験IC
の品種に応じて交換する必要があるため、コンタ
クトピンとコンタクトパツドによる接続方式には
捨て難い長所がある。 The IC tester is divided into a main body and a test head that serves as an interface.The test head is a performance board that houses a pin board with an interface circuit inside and has a socket attached to the surface to connect the IC to be tested. at the top. What are pinboards and performance boards?
Electricity is generated by contact between the ends of multiple contact pins that are elastically implanted in the pin connector attached to the edges of the pin board and the contact pads located at multiple locations corresponding to the back surface of the performance board. connected. The number of pin boards housed in one test head can reach several tens, and the number of connection points between contact pins and contact pads is extremely large. Therefore, even if the contact pressure at each contact point is small, the total contact pressure at all contact points can reach, for example, 20 kg, causing the board that supports the pin board at the bottom of the test head via the edge card type connection to deform into a concave surface. In some cases, the performance board itself is warped to some extent, and poor contact is likely to occur at the connection between the pins and pads. However, the performance board is the IC under test.
The connection method using contact pins and contact pads has advantages that are difficult to abandon, as it is necessary to replace them depending on the product type.
本発明の目的はコンタクトピンとコンタクトパ
ツドによる接続方式を採用しながら接触不良が生
じないようにしたICテスタのピン接続機構を提
供することにある。 An object of the present invention is to provide a pin connection mechanism for an IC tester that employs a connection method using contact pins and contact pads, but prevents contact failure from occurring.
上記目的を達成するために本発明においては、
各ピンボードのエツジに取付けるピンコネクタ
に、ピンに対し所定の相対位置に高い寸法精度を
持ち上端近くに切込みを有するガイドをピンと同
方向に突出させて設け、一方パフオーマンスボー
ドにもこれらガイドに正しく対応する位置に丁度
ガイドが通れる孔をあけておいて、各ガイド（ピ
ンボード枚数と同数だけある）をパフオーマンス
ボードの対応位置にあけた孔を通つてボードの表
面側に突出させ、更に、これら突出した各ガイド
に対応する位置にガイド断面に適応した形状の貫
通孔と孔の縁に沿つてガイドの切込みに係合する
傾斜面をもつくさび状部を設けたくさび板を、各
貫通孔を各ガイド突出部が通り抜けるようにパフ
オーマンスボード表面に重ね、くさび状部がガイ
ドの切込みの上端とパフオーマンスボード表面の
間のすきまにくいこむようにくさび板を摺動さ
せ、ガイドをガイド形状とくさび状部形状によつ
て定まる所定位置まで正しく引上げるようにし
た。各ピンボードは、それぞれ下方のエツジカー
ド方式接続部でテストヘツドの底面ボードと接続
し、かつ支持されてはいるが、また一方では、上
部エツジに取付けたピンコネクタのガイドを介し
てパフオーマンスボードに吊下げられ支持された
状態となる。ピンコネクタ、ガイド、それを引上
げるくさび板は、かなり高精度に作られているか
ら、コンタクトピン端部とコンタクトパツドの位
置合わせは当然自動的に行なわれ、またピンコネ
クタとパフオーマンスボードとは平行になつてコ
ンタクトピンはパフオーマンスボード裏面のコン
タクトパツドに垂直に、ほぼ一様な圧力で接触す
るから、接触不良やピン曲りは生じない。くさび
板のくさび状部の傾斜を緩く設定しておけば、く
さび板の摺動距離は長くなるが、くさび板を容易
に動かせる。結局パフオーマンスボードなどの交
換も容易になる。 In order to achieve the above object, in the present invention,
The pin connector attached to the edge of each pin board is provided with a guide that has high dimensional accuracy and a notch near the top end at a predetermined relative position to the pin, protruding in the same direction as the pin, while the performance board also has a guide that has a notch near the top end. Holes are drilled at the corresponding positions for the guides to pass through, and each guide (there are the same number as the number of pin boards) is made to protrude to the front side of the board through the holes drilled at the corresponding positions of the performance board. A wedge plate is provided at a position corresponding to each protruding guide with a through hole having a shape adapted to the cross section of the guide and a wedge-shaped portion having a sloped surface that engages with a notch in the guide along the edge of the hole. Stack the guide on the surface of the performance board so that each guide protrusion passes through, and slide the wedge plate so that the wedge-shaped part is wedged into the gap between the upper end of the notch of the guide and the surface of the performance board. It is now possible to correctly pull up to a predetermined position determined by . Each pin board is connected to and supported by the bottom board of the test head with its own lower edge card type connection, while also being suspended from the performance board through the guide of pin connectors attached to the top edge. It will be in a supported state. The pin connector, the guide, and the wedge plate that pulls it up are made with very high precision, so the alignment of the contact pin end and the contact pad is naturally done automatically, and the pin connector and performance board are closely aligned. Since the contact pins are parallel to each other and contact the contact pads on the back side of the performance board perpendicularly with almost uniform pressure, no contact failure or pin bending occurs. If the slope of the wedge-shaped portion of the wedge plate is set to be gentle, the sliding distance of the wedge plate becomes longer, but the wedge plate can be easily moved. After all, it will be easier to replace performance boards and the like.
以下本発明を図面によつて説明する。 The present invention will be explained below with reference to the drawings.
第１図は従来のピンボード１を示し、１ａはイ
ンタフエース回路、１ｂはエツジカード方式接続
部、２はピンコネクタ、３はピンコネクタに弾性
的に植設されたコンタクトピンである。 FIG. 1 shows a conventional pin board 1, in which 1a is an interface circuit, 1b is an edge card type connection part, 2 is a pin connector, and 3 is a contact pin elastically implanted in the pin connector.
第２図は本発明に係るピンボード１′を示し、
ピンコネクタ２ａにはピンと同方向に突出したガ
イド４が設けてある。 FIG. 2 shows a pinboard 1' according to the invention,
The pin connector 2a is provided with a guide 4 that projects in the same direction as the pins.
第３図は本発明に係るピンボード１′のピンコ
ネクタ２ａ近傍の拡大斜視図である。図示例で
は、プラスチツク製ピンコネクタ２ａに金属製ガ
イド４を取付けてあるが、高精度で経時的寸法狂
いが生じないように作れるならば、ピンコネクタ
２ａとガイド４を一体に成形してもよい。なお４
ａはガイドの端部の近くに設けた切込みである。 FIG. 3 is an enlarged perspective view of the vicinity of the pin connector 2a of the pin board 1' according to the present invention. In the illustrated example, the metal guide 4 is attached to the plastic pin connector 2a, but the pin connector 2a and the guide 4 may be integrally molded if it can be manufactured with high precision and without dimensional deviation over time. . Note 4
a is a notch provided near the end of the guide.
第４図は本発明に係るくさび板５の斜視図で、
６は第２，３図に示したガイド４が通り抜ける貫
通孔、７は孔の縁に沿つたくさび状部である。 FIG. 4 is a perspective view of the wedge plate 5 according to the present invention.
6 is a through hole through which the guide 4 shown in FIGS. 2 and 3 passes, and 7 is a wedge-shaped portion along the edge of the hole.
第５図は、ガイド４を、パフオーマンスボード
８に穿つた孔８ａを通つてボード表面側に突出さ
せ、パフオーマンスボード表面に更にくさび板５
を、貫通孔６をガイド４の突出部が通り抜けるよ
うに重ねた状態を示す図で、実際にはピンボード
１′は鉛直方向、パフオーマンスボード８等は鉛
直上方に位置する。図ａ，ｂ，ｃに示す如く、く
さび板５をパフオーマンスボード８の表面に沿つ
て摺動させると、くさび状部７が、ガイドの切込
み４ａの上端とパフオーマンスボード８表面の間
のすきまに順次くいこんでガイド４を引上げる
（この図では左方から右方へ動かす）。弾性的にピ
ンコネクタ２ａに植設したコンタクトピン３の端
部の高さは当初（図ａ）、植設作業時の誤差（公
差内）等で不揃いであるが、図ｃに示すくさび板
摺動後は、どのピンもパフオーマンスボード８裏
面に設けたコンタクトパツド（紙面に直角になつ
ているから図には現れない）に確実に接触するよ
うになる。 In FIG. 5, the guide 4 is made to protrude to the surface of the performance board 8 through a hole 8a, and a wedge plate 5 is further added to the surface of the performance board.
This is a diagram showing a state in which the protruding portions of the guides 4 are stacked one on top of the other so that the protruding portions of the guides 4 pass through the through holes 6.Actually, the pin board 1' is positioned vertically, and the performance board 8 and the like are positioned vertically above. As shown in Figures a, b, and c, when the wedge plate 5 is slid along the surface of the performance board 8, the wedge-shaped portion 7 is sequentially inserted into the gap between the upper end of the notch 4a of the guide and the surface of the performance board 8. Push in and pull up the guide 4 (move it from the left to the right in this figure). Initially (Figure a), the height of the end of the contact pin 3 elastically implanted in the pin connector 2a is uneven due to errors during the implantation work (within tolerance), but the height of the end of the contact pin 3 elastically implanted in the pin connector 2a is uneven due to errors (within tolerance) during the implantation process, but the height of the end part of the contact pin 3 that is elastically implanted in the pin connector 2a is uneven. After the movement, all the pins will surely come into contact with the contact pads (not shown in the figure because they are perpendicular to the plane of the paper) provided on the back side of the performance board 8.
第６図は本発明一実施例の実装説明図で、テス
トヘツド１０内部には、多数枚のピンボード１′
がガイド４を上にして図ｃに示す如く収納されて
おり、その上に図ｂに示すガイド用の孔９ａを設
けたふた９を取付け、その上に図ａに示すパフオ
ーマンスボード８を、テストヘツド１０内部にコ
ンタクトパツドが面し、外面にIC用ソケツトが
出るようにのせ、パフオーマンスボードの孔８ａ
を通つて突出したガイド４の端部がくさび板５の
孔６を通り抜けて更に突出するようにくさび状を
パフオーマンスボード表面に重ね、くさび板をガ
イド４を引上げるように摺動させてパフオーマン
スボードのテストヘツドへの（交換）装着を終了
する。 FIG. 6 is an explanatory diagram of the implementation of one embodiment of the present invention. Inside the test head 10, there are many pin boards 1'.
is stored as shown in Figure c with the guide 4 facing upward.A lid 9 with a guide hole 9a shown in Figure b is attached thereon, and the performance board 8 shown in Figure A is placed on top of the lid 9 as shown in Figure c. Place it so that the contact pad faces inside 10 and the IC socket comes out on the outside, and insert it into hole 8a of the performance board.
The wedge shape is stacked on the surface of the performance board so that the end of the guide 4 that protrudes through the hole 6 of the wedge plate 5 passes through the hole 6 of the wedge plate 5 and further protrudes, and the wedge plate is slid to pull up the guide 4 to form the performance board. Finish installing (replacement) on the test head.
第７図は本発明の他の実施例の実装説明図で、
図ｄに示す如くピンボード１′が放射状に配列し
てテストヘツド１０′内に収納されている以外は
第６図に示した実施例と同様で、図ｂに示すパフ
オーマンスボード８′の装着法も自明であろう。
本実施例ではくさび板５′は図ａに示す如くリン
グ状で、摺動も円周方向に回転させる。 FIG. 7 is an implementation explanatory diagram of another embodiment of the present invention,
The embodiment is the same as the embodiment shown in FIG. 6 except that the pin boards 1' are arranged radially and housed in the test head 10' as shown in FIG. d, and the mounting method of the performance board 8' shown in FIG. It should be obvious.
In this embodiment, the wedge plate 5' is ring-shaped as shown in Figure a, and the wedge plate 5' is also slidable and rotated in the circumferential direction.
以上説明したように本発明によれば、ガイドと
くさび板という簡単な手段で、ピンボードとパフ
オーマンスボード間のコンタクトピンとコンタク
トパツドの接触による電気的接続を、容易に、確
実に行うことができる。 As explained above, according to the present invention, the electrical connection between the pin board and the performance board through contact between the contact pins and the contact pads can be easily and reliably established using the simple means of the guide and the wedge plate. .
第１図は従来のピンボードの正面図、第２図は
本発明に係るピンボードの正面図、第３図は本発
明に係るピンコネクタの近傍の拡大斜視図、第４
図は本発明に係るくさび板の要部拡大斜視図、第
５図ａ，ｂ，ｃは本発明の根幹をなすくさび板と
ガイド切込み係合部の作用説明図、第６図ａ，
ｂ，ｃは本発明一実施例の実装説明図、第７図
ａ，ｂ，ｃ，ｄは本発明の他の実施例の実装説明
図である。
１′……ピンボード、２ａ……ピンコネクタ、
３……コンタクトピン、４……ガイド、４ａ……
ガイドの切込み、５……くさび板、７……くさび
状部、８……パフオーマンスボード、１０……テ
ストヘツド。
FIG. 1 is a front view of a conventional pin board, FIG. 2 is a front view of a pin board according to the present invention, FIG. 3 is an enlarged perspective view of the vicinity of a pin connector according to the present invention, and FIG.
The figure is an enlarged perspective view of the main part of the wedge plate according to the present invention, Figures 5a, b, and c are explanatory diagrams of the operation of the wedge plate and the guide cut engagement portion, which form the basis of the present invention, and Figures 6a,
7b and 7c are explanatory diagrams of implementation of one embodiment of the present invention, and FIGS. 7a, b, c, and d are explanatory diagrams of implementation of other embodiments of the present invention. 1'...Pin board, 2a...Pin connector,
3...Contact pin, 4...Guide, 4a...
Guide notch, 5... Wedge plate, 7... Wedge-shaped portion, 8... Performance board, 10... Test head.
Claims (1)
インタフエース回路を搭載した多数枚のピンボー
ドを内部に収納し、かつ被試験IC接続部を表面
に設けたパフオーマンスボードを上部に備えたテ
ストヘツドの、前記ピンボードのエツジに取付け
たピンコネクタから弾性的に突出した多数本のコ
ンタクトピンと前記パフオーマンスボード裏面に
対応配設した多数個所のコンタクトパツド間のピ
ン接続機構において、前記ピンコネクタそれぞれ
に端部の近くに切込みを有するガイドを突設し、
これらガイドに対応して前記パフオーマンスボー
ドに穿つた孔にそれぞれガイドを貫通させて表面
側に突出させ、更に、これら突出した各ガイドに
対応する貫通孔と孔の縁に沿つてガイドの切込み
に係合するくさび状部を設けたくさび板を、各貫
通孔を各ガイド突出部が通り抜けるようにパフオ
ーマンスボード表面に重ね、前記くさび状部がガ
イドの切込みにくいこむように摺動させて、パフ
オーマンスボードにガイドを介してピンボードを
担持させるようにしたことを特徴とするICテス
タのピン接続機構。1 Interposed between the IC tester body and the IC under test,
The test head houses a large number of pin boards equipped with interface circuits inside, and is equipped with a performance board on the top with connection parts for the IC under test on its surface. In a pin connection mechanism between a large number of contact pins protruding from the top and a number of contact pads correspondingly arranged on the back surface of the performance board, each of the pin connectors has a guide having a notch protruding near an end,
The guides are made to pass through holes drilled in the performance board corresponding to these guides and protrude to the surface side, and are further inserted into the through holes corresponding to these protruding guides and the notches of the guides along the edges of the holes. A wedge plate provided with a mating wedge-shaped portion is stacked on the surface of the performance board so that each guide protrusion passes through each through hole, and the wedge-shaped portion is slid so that it is not easily cut into the guide, thereby guiding the performance board to the performance board. A pin connection mechanism for an IC tester, characterized in that a pin board is supported through the pin board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57148518A JPS5938669A (en) | 1982-08-28 | 1982-08-28 | Pin connecting mechanism for ic tester |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57148518A JPS5938669A (en) | 1982-08-28 | 1982-08-28 | Pin connecting mechanism for ic tester |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5938669A JPS5938669A (en) | 1984-03-02 |
| JPS638434B2 true JPS638434B2 (en) | 1988-02-23 |
Family
ID=15454562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57148518A Granted JPS5938669A (en) | 1982-08-28 | 1982-08-28 | Pin connecting mechanism for ic tester |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5938669A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4863048B2 (en) * | 2005-10-19 | 2012-01-25 | 横河電機株式会社 | IC tester |
| JP4734187B2 (en) * | 2006-07-04 | 2011-07-27 | ルネサスエレクトロニクス株式会社 | Semiconductor inspection equipment |
-
1982
- 1982-08-28 JP JP57148518A patent/JPS5938669A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5938669A (en) | 1984-03-02 |
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