JPS6384099A - Manufacture of hybrid integrated circuit - Google Patents
Manufacture of hybrid integrated circuitInfo
- Publication number
- JPS6384099A JPS6384099A JP22774886A JP22774886A JPS6384099A JP S6384099 A JPS6384099 A JP S6384099A JP 22774886 A JP22774886 A JP 22774886A JP 22774886 A JP22774886 A JP 22774886A JP S6384099 A JPS6384099 A JP S6384099A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- liquid resin
- case
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000011347 resin Substances 0.000 claims description 25
- 229920005989 resin Polymers 0.000 claims description 25
- 239000007788 liquid Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 2
- 239000007787 solid Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は混成集積回路の製造方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method of manufacturing a hybrid integrated circuit.
［従来の技術］
従来、この種の混成集積回路は第２図に示すようにプラ
スチック製ケース１１に充填された樹脂５中に、厚膜基
板１に搭載された電子部品２を埋設した構造となってい
る。[Prior Art] Conventionally, this type of hybrid integrated circuit has a structure in which electronic components 2 mounted on a thick film substrate 1 are embedded in a resin 5 filled in a plastic case 11, as shown in FIG. It has become.
［発明が解決しようとする問題点］
上述した従来の混成集積回路によれば、液状樹脂５がケ
ース１１内に充填されているため、重量が重くなり、混
成集積回路の軽量化が図れず、おるいは、資材費が高価
になる等の欠点を有する。[Problems to be Solved by the Invention] According to the conventional hybrid integrated circuit described above, since the liquid resin 5 is filled in the case 11, the weight becomes heavy, and it is difficult to reduce the weight of the hybrid integrated circuit. However, there are disadvantages such as high material costs.
本発明の目的は軽量化を実現する混成集積回路の製造方
法を提供することにおる。An object of the present invention is to provide a method for manufacturing a hybrid integrated circuit that achieves weight reduction.
［問題点を解決するための手段］
本発明は厚膜基板に電子部品を搭載した混成集積回路を
ケース内に挿入し、ケース内に液状樹脂を充填して混成
集積回路を液状樹脂中に浸漬させ、次いで液状樹脂を排
除し、混成集積回路の表面に付着した液状樹脂を固化さ
せることを特徴とする混成集積回路の製造方法である。[Means for Solving the Problems] The present invention involves inserting a hybrid integrated circuit in which electronic components are mounted on a thick film substrate into a case, filling the case with liquid resin, and immersing the hybrid integrated circuit in the liquid resin. This method of manufacturing a hybrid integrated circuit is characterized in that the liquid resin is removed, and the liquid resin adhering to the surface of the hybrid integrated circuit is solidified.
［実施例］ 以下、本発明の一実施例を図により説明する。[Example] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図（ｂ）に示すように、厚膜基板１と電子部品２と
クリップ端子３とからなる混成集積回路を孔付きプラス
チック製ケース４に挿入し、その後ピン６をケース４の
孔部４ａに差し込み蓋をする。As shown in FIG. 1(b), a hybrid integrated circuit consisting of a thick film substrate 1, an electronic component 2, and a clip terminal 3 is inserted into a plastic case 4 with a hole, and then a pin 6 is inserted into the hole 4a of the case 4. Insert it into the container and close the lid.
そして容器７から液状樹脂５ａをケース４に注入する。Then, liquid resin 5a is injected into case 4 from container 7.
次に第１図（Ｃ）に示すように液状樹脂５を所定の位置
まで入れた後、ピン６を下方に仮いて、液状樹脂５をケ
ース４の孔部４ａよりケース４の外に設置された容器９
に排出する。このとき、ガイド板８等を設置してあけば
、液状樹脂５はスムーズに外部に排出される。液状樹脂
５が外部に排出された後、混成集積回路の表面に付着し
ている残留液状樹脂５を加熱硬化し、第１図（ｄ）に示
すようにケース４の孔部４ａに熱硬化性固形樹脂１０を
挿入し、乾燥炉等にて加熱硬化し、第１図（ａ）に示す
ようにケース４の孔部４ａを熱硬化性固形樹脂１０で蓋
をする。このとき、液状樹脂５と熱硬化性固形樹脂１０
とを同時に加熱硬化を行なってもよい。Next, as shown in FIG. 1(C), after filling the liquid resin 5 to a predetermined position, the pin 6 is held downward, and the liquid resin 5 is placed outside the case 4 through the hole 4a of the case 4. Container 9
to be discharged. At this time, if a guide plate 8 or the like is installed, the liquid resin 5 can be smoothly discharged to the outside. After the liquid resin 5 is discharged to the outside, the residual liquid resin 5 adhering to the surface of the hybrid integrated circuit is heated and hardened, and a thermosetting resin is applied to the hole 4a of the case 4 as shown in FIG. 1(d). The solid resin 10 is inserted and cured by heating in a drying oven or the like, and the hole 4a of the case 4 is covered with the thermosetting solid resin 10, as shown in FIG. 1(a). At this time, liquid resin 5 and thermosetting solid resin 10
Heat curing may be performed at the same time.
これにより、第１図（ａ）に示すように厚膜基板１に搭
載された電子部品２の表面がその形状を象った必要最小
限の膜厚の樹脂コートにより封止され、保護ケース４内
に組込まれた混成集積回路が完成する。As a result, as shown in FIG. 1(a), the surface of the electronic component 2 mounted on the thick-film substrate 1 is sealed with a resin coat of the minimum thickness necessary in the shape of the electronic component 2, and the protective case 4 is sealed. The hybrid integrated circuit incorporated within is completed.
［発明の効果］
以上説明したように本発明はケースの空間全体に樹脂を
充填せず、電子部品の表面の樹脂コートにより樹脂封止
を行うので、軽量化を実現できるとともにコストダウン
を図ることができる効果を有するものである。[Effects of the Invention] As explained above, the present invention does not fill the entire space of the case with resin, but seals the electronic components with a resin coating on the surface of the electronic components, thereby realizing weight reduction and cost reduction. This has the effect of making it possible.
第１図（ａ）は本発明の一実施例を示す断面図、第１図
（ｂ）、 （ｃＬ （ｄ）は製造工程を示す断面図、第
２図は従来例を示す横断面図である。FIG. 1(a) is a cross-sectional view showing an embodiment of the present invention, FIG. 1(b) and (d) are cross-sectional views showing the manufacturing process, and FIG. 2 is a cross-sectional view showing a conventional example. be.
Claims (1)
ース内に挿入し、ケース内に液状樹脂を充填して混成集
積回路を液状樹脂中に浸漬させ、次いで液状樹脂を排除
し、混成集積回路の表面に付着した液状樹脂を固化させ
ることを特徴とする混成集積回路の製造方法。(1) A hybrid integrated circuit with electronic components mounted on a thick film substrate is inserted into a case, the case is filled with liquid resin, the hybrid integrated circuit is immersed in the liquid resin, the liquid resin is removed, and the hybrid integrated circuit is immersed in the liquid resin. A method for manufacturing a hybrid integrated circuit, comprising solidifying liquid resin attached to the surface of the integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22774886A JPS6384099A (en) | 1986-09-26 | 1986-09-26 | Manufacture of hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22774886A JPS6384099A (en) | 1986-09-26 | 1986-09-26 | Manufacture of hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6384099A true JPS6384099A (en) | 1988-04-14 |
Family
ID=16865752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22774886A Pending JPS6384099A (en) | 1986-09-26 | 1986-09-26 | Manufacture of hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6384099A (en) |
-
1986
- 1986-09-26 JP JP22774886A patent/JPS6384099A/en active Pending
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