JPS6379636U - - Google Patents
Info
- Publication number
- JPS6379636U JPS6379636U JP17522486U JP17522486U JPS6379636U JP S6379636 U JPS6379636 U JP S6379636U JP 17522486 U JP17522486 U JP 17522486U JP 17522486 U JP17522486 U JP 17522486U JP S6379636 U JPS6379636 U JP S6379636U
- Authority
- JP
- Japan
- Prior art keywords
- processed
- substrate
- heating temperature
- predetermined heating
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Drying Of Solid Materials (AREA)
Description
第１図は本考案にかかる加熱器の断面図、第２
図は間隙に対する加熱温度と時間の図表、第３図
は従来の加熱器を示す図である。
図において、１はホツトプレート、２は温度制
御系、３はウエハー、４はスタツド、５はプレー
ド台、６はステツピングモータを示している。
Figure 1 is a sectional view of the heater according to the present invention, Figure 2 is a sectional view of the heater according to the present invention;
The figure is a chart of heating temperature and time for the gap, and FIG. 3 is a diagram showing a conventional heater. In the figure, 1 is a hot plate, 2 is a temperature control system, 3 is a wafer, 4 is a stud, 5 is a plate stand, and 6 is a stepping motor.
Claims (1)
する構造として、被処理基板の所定加熱温度また
は被処理基板が所定加熱温度にまで達する時間を
調節するようにしたことを特徴とする加熱器。 1. A heater characterized in that the gap between the hot plate and the substrate to be processed is made variable so as to adjust the predetermined heating temperature of the substrate to be processed or the time required for the substrate to be processed to reach a predetermined heating temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17522486U JPS6379636U (en) | 1986-11-13 | 1986-11-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17522486U JPS6379636U (en) | 1986-11-13 | 1986-11-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6379636U true JPS6379636U (en) | 1988-05-26 |
Family
ID=31114349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17522486U Pending JPS6379636U (en) | 1986-11-13 | 1986-11-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6379636U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000243687A (en) * | 1999-02-19 | 2000-09-08 | Tokyo Electron Ltd | Apparatus and method for regulating temperature of substrate, and for processing substrate |
| JP2012231001A (en) * | 2011-04-26 | 2012-11-22 | Hitachi Kokusai Electric Inc | Substrate processing apparatus and manufacturing method of semiconductor device |
| US9236246B2 (en) | 2011-03-04 | 2016-01-12 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and a method of manufacturing a semiconductor device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737848A (en) * | 1980-08-19 | 1982-03-02 | Toshiba Corp | Heating apparatus for wafer |
| JPS61147528A (en) * | 1984-12-21 | 1986-07-05 | Toshiba Corp | Resist treating device |
-
1986
- 1986-11-13 JP JP17522486U patent/JPS6379636U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737848A (en) * | 1980-08-19 | 1982-03-02 | Toshiba Corp | Heating apparatus for wafer |
| JPS61147528A (en) * | 1984-12-21 | 1986-07-05 | Toshiba Corp | Resist treating device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000243687A (en) * | 1999-02-19 | 2000-09-08 | Tokyo Electron Ltd | Apparatus and method for regulating temperature of substrate, and for processing substrate |
| US9236246B2 (en) | 2011-03-04 | 2016-01-12 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and a method of manufacturing a semiconductor device |
| US9472424B2 (en) | 2011-03-04 | 2016-10-18 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and a method of manufacturing a semiconductor device |
| JP2012231001A (en) * | 2011-04-26 | 2012-11-22 | Hitachi Kokusai Electric Inc | Substrate processing apparatus and manufacturing method of semiconductor device |