JPS6376895A - Formation of porous layer on metal surface - Google Patents
Formation of porous layer on metal surfaceInfo
- Publication number
- JPS6376895A JPS6376895A JP61221065A JP22106586A JPS6376895A JP S6376895 A JPS6376895 A JP S6376895A JP 61221065 A JP61221065 A JP 61221065A JP 22106586 A JP22106586 A JP 22106586A JP S6376895 A JPS6376895 A JP S6376895A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- pipe
- plating solution
- porous layer
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 58
- 239000002184 metal Substances 0.000 title claims description 58
- 230000015572 biosynthetic process Effects 0.000 title 1
- 238000007747 plating Methods 0.000 claims abstract description 53
- 229910000365 copper sulfate Inorganic materials 0.000 claims abstract description 11
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims abstract description 11
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 11
- 229940116318 copper carbonate Drugs 0.000 claims abstract description 10
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical group [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 239000010949 copper Substances 0.000 claims abstract description 9
- 239000010409 thin film Substances 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 22
- 238000009713 electroplating Methods 0.000 claims description 8
- 238000005187 foaming Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 4
- 229910001431 copper ion Inorganic materials 0.000 abstract description 4
- 238000000354 decomposition reaction Methods 0.000 abstract description 2
- 239000003973 paint Substances 0.000 abstract description 2
- 238000003860 storage Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000011148 porous material Substances 0.000 description 8
- 239000012530 fluid Substances 0.000 description 7
- 239000003507 refrigerant Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 238000009835 boiling Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 206010011224 Cough Diseases 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/623—Porosity of the layers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2200/00—Prediction; Simulation; Testing
- F28F2200/005—Testing heat pipes
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は、金属表面における多孔質層の形成方法に係わ
り、特に、熱交換器の伝熱面やヒートバイブのウィック
を形成する際に用いて好適な金属表面における多孔質層
の形成方法に関するものである。Detailed Description of the Invention "Industrial Application Field" The present invention relates to a method for forming a porous layer on a metal surface, and in particular to a method for forming a porous layer on a metal surface. The present invention relates to a method for forming a porous layer on a metal surface, which is suitable for use in metal surfaces.
「従来の技術ｊ
一般に、熱交換器等においては、加熱流体と被加熱流体
とを金属壁によって分離し、加熱流体の熱を前記金属壁
を介して被加熱流体へ伝達するようにしている。BACKGROUND ART Generally, in a heat exchanger or the like, a heating fluid and a heated fluid are separated by a metal wall, and the heat of the heating fluid is transferred to the heated fluid via the metal wall.
一方、このような熱交換を行う場合に、その熱交換効率
を高めるための有効な手段として、以下に示す方法か挙
げられている。On the other hand, when performing such heat exchange, the following method is cited as an effective means for increasing the heat exchange efficiency.
（１）壁の伝熱面積を大きくする。(1) Increase the heat transfer area of the wall.
（２）流体の核沸騰を起こしやすくする。(2) Make it easier to cause nucleate boiling of the fluid.
（３）流体に乱流を発生させやすいようにする。(3) Make it easier to generate turbulence in the fluid.
そして、これらの方法のうち、前記（２）の核沸騰を積
極的に利用することが最も効果的であるとされている。Of these methods, actively utilizing the nucleate boiling described in (2) above is said to be the most effective.
そこで従来では、核沸騰の核を生成しやすくするために
、前記壁の表面、特に、加熱流体が接触させられる側の
面に、焼結あるいは鑞付は等により多孔質層を形成する
ことが行われている。Conventionally, in order to facilitate the generation of nucleate boiling nuclei, a porous layer is formed on the surface of the wall, particularly on the side that is brought into contact with the heated fluid, by sintering, brazing, etc. It is being done.
「発明が解決しようとする問題点」
本発明は、前述した従来の技術における次のような問題
点を解決仕んとするものである。"Problems to be Solved by the Invention" The present invention aims to solve the following problems in the conventional technology described above.
すなわち、金属壁の表面に、鑞付けや焼結によって多孔
質層を形成するに際して、前記金属壁の表面が平面であ
る場合には比較的容易に実施可能であるが、例えば、伝
熱管の内面のように小径な管状物の内面への適用が困難
であり、したがって、適用可能な範囲が制限されてしま
うといった問題点である。That is, when forming a porous layer on the surface of a metal wall by brazing or sintering, it is relatively easy to form a porous layer when the surface of the metal wall is flat. The problem is that it is difficult to apply it to the inner surface of a small-diameter tubular object such as, and therefore, the range of applicability is limited.
このような問題点に鑑み、本願出願人は、金属製基体の
表面に疎水性の薄膜を形成し、該金属製基体を鍍金液中
に浸すとと乙に、該金属製基体を陰極として、前記鍍金
液中に配設された不溶性金属からなる陽極とのｕＭで電
気鍍金を行うことにより、前記金属製基体の表面に多孔
質層を形成する方法を既に提案した。In view of these problems, the applicant of this application formed a hydrophobic thin film on the surface of a metal substrate, immersed the metal substrate in a plating solution, and used the metal substrate as a cathode. A method has already been proposed in which a porous layer is formed on the surface of the metal substrate by performing electroplating using uM with an anode made of an insoluble metal disposed in the plating solution.
この技術は、面述した条件のもとに電気鍍金を行うこと
により、鍍金液中の水分を分解して酸素の微細気泡を生
成するとともに、該微細気泡を金属製基体の表面に付着
さ仕、該微細気泡を包み込むように鍍金液中の析出金属
を金属製基体の表面に成長させることにより、前記金属
製基体の表面に、微小径の空孔を有する多孔質層を形成
するようにしたものである。This technology decomposes water in the plating solution to produce microscopic oxygen bubbles by electroplating under the conditions described above, and the microscopic bubbles are attached to the surface of the metal substrate. By growing the precipitated metal in the plating solution on the surface of the metal substrate so as to enclose the microbubbles, a porous layer having microscopic pores is formed on the surface of the metal substrate. It is something.
これによって、小径管の内面といった狭隘部へ多孔質層
を容易に形成することができ、かつ、高い伝熱効率を得
ることができるようになったが、さらなる伝熱効率の向
上が要望されている。Although this has made it possible to easily form a porous layer in a narrow part such as the inner surface of a small diameter pipe and to obtain high heat transfer efficiency, there is a demand for further improvement in heat transfer efficiency.
「問題点を解決するための手段」
本発明は、面述した要望のらとになされたらので、特に
、疎水性を有する薄膜が形成された金属製基体の表面を
鍍金液中に浸し、該鍍金液中に発泡物質を混入して微細
気泡を生成するとともに、該微細気泡を前記金属製基体
の表面近傍に供給し５、 つつ、該金属製基体を陰極
として、前記鍍金液中に配設した陽極との間で電気鍍金
を行うことを特徴とする。"Means for Solving the Problems" The present invention has been made in accordance with the above-mentioned needs, and in particular, the surface of a metal substrate on which a hydrophobic thin film is formed is immersed in a plating solution. Mixing a foaming substance into the plating solution to generate microbubbles, and supplying the microbubbles near the surface of the metal substrate 5, while disposing the metal substrate in the plating solution as a cathode. It is characterized by performing electroplating between the anode and the anode.
「作用」
本発明に係わる方法によって金属表面に多孔質層が形成
される機構は、次のように考えられる。"Operation" The mechanism by which a porous layer is formed on a metal surface by the method according to the present invention is thought to be as follows.
金属製基体は、その表面に形成された疎水性のることか
ら、該金属製基体の近傍に供給された微細気泡が金属製
基体の表面に付着する。そして、電気鍍金の進行に伴っ
て、金属製基体の表面に電析金属が成長するが、前述し
たように金属製基体の表面に気泡が付性しているために
、前記電析金属は気泡を包み込むように成長し、これに
よって金属製基体の表面に微細な狭口空孔が形成される
。Since the metal substrate has hydrophobicity formed on its surface, microbubbles supplied near the metal substrate adhere to the surface of the metal substrate. Then, as the electroplating progresses, the deposited metal grows on the surface of the metal substrate, but as mentioned above, since air bubbles are attached to the surface of the metal substrate, the electrodeposited metal grows with air bubbles. The metal substrate grows to envelop it, and as a result, fine narrow pores are formed on the surface of the metal substrate.
また、前記微細気泡が発泡物質によって生成されること
から、高密度の微細気泡が金属製基体の表面に供給され
て、面述した狭口空孔が効率よく形成される。Furthermore, since the microbubbles are generated by the foaming material, high-density microbubbles are supplied to the surface of the metal base, and the narrow pores described above are efficiently formed.
「実施例」
以下、本発明を伝熱管に適用した一実施例に基づき説明
する。"Example" Hereinafter, the present invention will be described based on an example in which the present invention is applied to a heat exchanger tube.
まず、本発明を実施するための装置について説明する。First, an apparatus for implementing the present invention will be described.
該装置は、第１図に示すように、鍍金液貯蔵容器Ｉと、
伝熱管２の両端部に液密状態で取り付けられるとともに
、該伝熱管２の内部に連通させられたチセンバ３・４と
、Ｔｕ 山チセンバ３・４）−前記鍍金液貯蔵容器１と
を連絡する鍍金液供給管５および鍍金液回収管６と、前
記鍍金液供給管５に取り付けられた圧送ポンプ７と、該
圧送ポンプ７の下流側に設けられたフローメータ８と、
前記伝熱管２の内部に配設された電極棒９と、該電極棒
９と伝熱管２とに電気的に接続された直流電源１０と、
前記鍍金液貯蔵容器１に連設され、該鍍金液貯蔵容器ｌ
内の鍍金液中に発泡物質を添加するホッパ１１と、前記
鍍金液回収管６の途中に設けられたフィルタ１２と、鍍
金液貯蔵容器１に取り付けられて、その内部の鍍金液を
攪拌する攪拌装置１３とを備えている。As shown in FIG. 1, the apparatus includes a plating solution storage container I;
The heat exchanger tubes 3 and 4 are attached to both ends of the heat exchanger tube 2 in a liquid-tight manner and are communicated with the inside of the heat exchanger tube 2, and the metal tubes 3 and 4) communicate with the plating solution storage container 1. A plating solution supply pipe 5, a plating solution recovery pipe 6, a pressure pump 7 attached to the plating solution supply pipe 5, a flow meter 8 provided on the downstream side of the pressure pump 7,
an electrode rod 9 disposed inside the heat exchanger tube 2; a DC power source 10 electrically connected to the electrode rod 9 and the heat exchanger tube 2;
The plating solution storage container L is connected to the plating solution storage container 1.
a hopper 11 for adding foaming material into the plating solution inside; a filter 12 provided in the middle of the plating solution recovery pipe 6; and an agitator attached to the plating solution storage container 1 for stirring the plating solution inside. A device 13 is provided.
前記伝熱管２は、本実施例では鋼管が用いられ、また、
鍍金液として硫酸銅溶液、さらに、発泡物質として炭酸
銅が用いられている。In this embodiment, a steel pipe is used as the heat exchanger tube 2, and
A copper sulfate solution is used as the plating solution, and copper carbonate is used as the foaming material.
前記電極棒９は、本実施例ではＴｉ表面に白金被覆加工
した不溶性電極が用いられており、図示してないが、伝
熱管２の内面に介装される電気絶縁材料によって形成さ
れたスペーサにより、あるいは、両端部に張力が加えら
れることにより、前記伝熱管２の中心軸線上に保持され
ている。In this embodiment, the electrode rod 9 is an insoluble electrode whose Ti surface is coated with platinum. Although not shown, the electrode rod 9 is formed by a spacer formed of an electrically insulating material interposed on the inner surface of the heat exchanger tube 2. Alternatively, the heat exchanger tube 2 is held on the central axis by applying tension to both ends.
前記直流電源１０は、前記伝熱管２を陰極とし、かつ１
．前記電極棒９を陽極とするように電流を供給するよう
になっており、この電流は、単純な直流電流、断続電流
、通常のパルス電流、ＰＲ電流等が用いられる。The DC power supply 10 has the heat exchanger tube 2 as a cathode and 1
．． A current is supplied so that the electrode rod 9 serves as an anode, and this current may be a simple direct current, an intermittent current, a normal pulse current, a PR current, or the like.
次いで、前述した構成を有する装置の作用とともに、本
発明方法を説明する。Next, the method of the present invention will be explained along with the operation of the apparatus having the above-described configuration.
まず、油、塗料等の疎水性物質を溶媒に分散あるいは溶
解させて形成した溶液を、伝熱管２の内面全面に付着さ
せて疎水性の薄膜を形成したのちに、該伝熱管２の内部
に電極棒９を挿入位置決めし、また、伝熱管２の両端部
に、鍍金液供給管５および鍍金液回収管６が取り付けら
れたチャンバ３・４を取り付け、さらに、伝熱管２と電
極棒９との間に直流電源■０を接続する。First, a solution formed by dispersing or dissolving a hydrophobic substance such as oil or paint in a solvent is applied to the entire inner surface of the heat exchanger tube 2 to form a hydrophobic thin film. The electrode rod 9 is inserted and positioned, and the chambers 3 and 4 to which the plating solution supply pipe 5 and the plating solution recovery pipe 6 are attached are attached to both ends of the heat exchanger tube 2, and the heat exchanger tube 2 and the electrode rod 9 are Connect DC power supply ■0 between.
前記疎水性の薄膜の厚さは、疎水性物質の種類によって
も異なるが、好適な範囲は０．１μｍ〜５μｍである。The thickness of the hydrophobic thin film varies depending on the type of hydrophobic substance, but a suitable range is 0.1 μm to 5 μm.
この範囲以下であると後述する空孔の生成率が低下し、
以上であると絶縁性が高くなって均一な鍍金層が得られ
なくなるおそれがある。Below this range, the generation rate of pores, which will be described later, will decrease,
If it is more than that, there is a possibility that the insulation becomes high and it becomes impossible to obtain a uniform plating layer.
これより、鍍金液貯蔵容器ｌ内の鍍金液を攪拌装置１３
によって均一に攪拌したのちに、該鍍金液を圧送ポンプ
７によって一方のチャンバ３へ向けて送り出して、第１
図に矢印（イ）で示すように、鍍金液を、鍍金液貯蔵容
器１から、鍍金供給管５、一方のチャンバ３、伝熱管２
内部、他方のチャンバ４、鍍金液回収管６を経て、再度
鍍金液貯蔵容器Ｉに戻るように循環させる。From this, the plating solution in the plating solution storage container l is stirred by the stirring device 13.
After stirring the plating solution uniformly, the plating solution is sent to one chamber 3 by a pressure pump 7, and
As shown by the arrow (A) in the figure, the plating solution is transferred from the plating solution storage container 1 to the plating supply pipe 5, one chamber 3, and the heat transfer tube 2.
The liquid is circulated inside, through the other chamber 4, through the plating liquid recovery pipe 6, and back to the plating liquid storage container I again.
この操作とともに、鍍金液貯蔵容器１において、ホッパ
１１から、発泡物質である炭酸銅を鍍金液としての硫酸
銅溶液中に混入して攪拌するとともに、硫酸銅溶液とと
もに循環させる。Along with this operation, in the plating solution storage container 1, copper carbonate as a foaming substance is mixed into the copper sulfate solution as the plating solution from the hopper 11, stirred, and circulated together with the copper sulfate solution.
このようにして硫酸銅溶液中に炭酸銅が混入されると、
該炭酸銅が硫酸銅溶液中において溶解する際に、銅イオ
ンが形成されるとともに、炭酸ガスによる微細気泡が生
成され、前記銅イオンは、硫酸銅溶液中の銅イオンの補
充に供され、また、前記微細気泡は、伝熱管２の内部に
運ばれるか、玉■］筈９のｒｊ：１面＋ｊ Ｊ↓十社の
１謹＾く邦箭六ハアｈることから、該内面に均一に付着
する。When copper carbonate is mixed into the copper sulfate solution in this way,
When the copper carbonate is dissolved in the copper sulfate solution, copper ions are formed, and microbubbles are generated by carbon dioxide gas, and the copper ions are used to replenish the copper ions in the copper sulfate solution, and , the microbubbles are carried into the inside of the heat transfer tube 2, or the bubbles are uniformly distributed on the inner surface. adhere to.
こののちに、前記直流電源１２により伝熱管２を陰極と
して電極棒９との間に電流を印加する。Thereafter, a current is applied between the heat exchanger tube 2 and the electrode rod 9 by using the DC power source 12 as a cathode.
この印加電流は、陰極電流密度が１．５Ａ／ｄｍ”以上
に設定することが好ましく、また、単純な直流電流より
も、断続電流、通常のパルス電流、さらに、ＰＲ電流を
用いることが好ましい。The applied current is preferably set to a cathode current density of 1.5 A/dm'' or more, and it is preferable to use an intermittent current, a normal pulsed current, or a PR current rather than a simple direct current.
このＰＲ電流は、伝熱管２を陰極とする正電流と、伝熱
管２を陽極とする逆電流とを交互に印加するしのである
か、正電流の印加時間を逆電流のそれに比して大きくし
て、全体として伝熱管２を陰極に保持するような７１Ｘ
流である。This PR current is generated by alternately applying a positive current with the heat exchanger tube 2 as the cathode and a reverse current with the heat exchanger tube 2 as the anode, or the application time of the positive current is longer than that of the reverse current. 71X that holds the heat exchanger tube 2 as a cathode as a whole.
It is a flow.
そして、断続ＩＩ流やパルス電流を用いると、単純な直
流電流に比して、伝熱管２の内面に形成される空孔内へ
の金属イオンの搬送を容易なものとすることができ、こ
れによって、ＴＬ析速度を大きくすることが期待できる
とともに、局部的な析出を抑制して均一な電析膜の形成
を可能にする。また、ＰＲ電流を用いると逆電流が周期
的に印加されることによって、前述した電析膜の均一化
が促進される。When using an intermittent II current or a pulsed current, metal ions can be easily transported into the pores formed on the inner surface of the heat exchanger tube 2, compared to a simple direct current. By doing so, it is expected that the TL deposition rate will be increased, and localized deposition will be suppressed, making it possible to form a uniform electrodeposited film. Further, when a PR current is used, a reverse current is periodically applied, thereby promoting the uniformity of the deposited film as described above.
このように、電流が印加されると、前記伝熱管２の内面
でｒｉ折金金属成長させられるが、前述したように、伝
熱管２の内面には微細気泡が付着していることから、電
析金属の成長が前記微細気泡を包み込むように行われ、
この結果、伝熱管２の内面に、狭口空孔が形成されて、
多孔質層が形成される。In this way, when an electric current is applied, ri-bond metal is grown on the inner surface of the heat exchanger tube 2, but as mentioned above, since microbubbles are attached to the inner surface of the heat exchanger tube 2, the electric current The growth of the deposited metal is carried out so as to envelop the microbubbles,
As a result, narrow holes are formed on the inner surface of the heat exchanger tube 2,
A porous layer is formed.
また、本実施例では、陽極として、不溶性陽極を用いて
いることから、鍍金液中の水分が電気分解されて酸素ガ
スが陽極において発生させられ、該酸素ガスの一部が、
気泡を形成して、前述したように供給される炭酸ガスの
気泡とともに伝熱管２の内面に付着さけられるから、鍍
金液中の気泡密度が高められて、狭口空孔が一層容易に
形成される。Further, in this example, since an insoluble anode is used as the anode, water in the plating solution is electrolyzed and oxygen gas is generated at the anode, and a part of the oxygen gas is
Since bubbles are formed and are prevented from adhering to the inner surface of the heat transfer tube 2 together with the bubbles of the carbon dioxide gas supplied as described above, the density of the bubbles in the plating solution is increased and narrow holes are formed more easily. Ru.
次いで、以下に具体例を示す。Next, specific examples will be shown below.
（具体例）
外径９．５２ｍｍ、肉厚０．３５ｍｍ１長さ１０００ｍ
ｍの銅管を抽伸により形成して伝熱管２とし、該伝熱管
２にトリクレン洗浄を施して内面を清浄化し、シリコン
オイルをエタノールで３倍に希釈した溶液を鋼管の内部
に通したのちに、エタノールを蒸発させて除去こて、伝
熱管２の内面に疎水性薄膜を形成し、さらに、該伝熱管
２の内部に、樹脂製のスペーサを取り付けるとともに、
該スペーサによって、前記伝熱管２の内部に白金被覆加
工されたＴｉワイヤからなる電極棒９を位置決めして陽
極を取り付ける。(Specific example) Outer diameter 9.52mm, wall thickness 0.35mm, length 1000m
A heat transfer tube 2 is formed by drawing a copper tube of 500 m in diameter, the inner surface of the heat transfer tube 2 is cleaned by trichlene cleaning, and a solution of silicone oil diluted 3 times with ethanol is passed through the inside of the steel tube. , evaporate and remove ethanol, form a hydrophobic thin film on the inner surface of the heat exchanger tube 2, and further attach a resin spacer inside the heat exchanger tube 2,
An electrode rod 9 made of a platinum-coated Ti wire is positioned inside the heat exchanger tube 2 using the spacer, and an anode is attached thereto.
そして、硫酸銅２００ｇ／１２、硫酸５０ｇ／（２の割
合で混入された硫酸銅溶液を流速 ２ ｍ／ｓにて強制
循環させ、この硫酸銅溶液中に、炭酸銅を６ ｇ／ｍｉ
ｎの割合で混入し、前記伝熱管２を陰極として、陰極電
流密度５０人／ｄｍ”の条件で、約１０分間電気鍍金を
施した。Then, a copper sulfate solution mixed at a ratio of 200 g/12 copper sulfate and 50 g/2 sulfuric acid was forced to circulate at a flow rate of 2 m/s, and 6 g/mi of copper carbonate was added to the copper sulfate solution.
Using the heat exchanger tube 2 as a cathode, electroplating was performed for about 10 minutes at a cathode current density of 50 people/dm''.
この結果、孔径１００μ〜１５０μの均質な空孔が、空
孔率で２８％形成された、厚さ１５０μの多孔質層が得
られた。As a result, a porous layer with a thickness of 150 microns was obtained, in which homogeneous pores with a pore diameter of 100 microns to 150 microns were formed at a porosity of 28%.
そして、前記多孔質層の比表面積率を画像解析により測
定し、陰極電流密度との関係を見てみたところ、第２図
にａで示すような結果が得られた。Then, when the specific surface area ratio of the porous layer was measured by image analysis and the relationship with the cathode current density was examined, the results shown by a in FIG. 2 were obtained.
一方、比較のために、前述した鍍金処理過程において発
泡物質である炭酸銅の供給を停止した状態で、鍍金液中
の水分の分解によって形成される気泡のみにより多孔質
層を形成した場合の比表面積率を測定したところ、第２
図にｂで示す結果が得られた。On the other hand, for comparison, when the supply of copper carbonate, which is a foaming substance, is stopped in the plating process described above, a porous layer is formed only by air bubbles formed by decomposition of water in the plating solution. When the surface area ratio was measured, the second
The results indicated by b in the figure were obtained.
この結果から明らかなように、本実施例に示す方法によ
って形成された多孔質層は、比表面積率において、例え
ば、陰極電流密度５０Ａ／ｄｍ”で、比較例に対し３０
％以上の向上が図られる。As is clear from this result, the porous layer formed by the method shown in this example has a specific surface area ratio of 30% compared to the comparative example at a cathode current density of 50 A/dm''.
This will result in an improvement of more than %.
さらに、前述したように製作した伝熱管２について、第
３図に示す熱特性試験装置により、熱特性を測定した。Furthermore, the thermal characteristics of the heat exchanger tube 2 manufactured as described above were measured using the thermal characteristics testing apparatus shown in FIG.
第３図中、Ｔは温度センサ、Ｐは圧力計、ＰＤは差圧計
、１４はポンプ、１５はパルプ、１６は流量計、１７は
膨張弁、１８はコンプレッサ、１９はサブコンデンサ、
２０はサブエバポレータ、２１は恒温水槽であり、２２
か試供管としての鋼管である。In Fig. 3, T is a temperature sensor, P is a pressure gauge, PD is a differential pressure gauge, 14 is a pump, 15 is a pulp, 16 is a flow meter, 17 is an expansion valve, 18 is a compressor, 19 is a sub-condenser,
20 is a sub-evaporator, 21 is a constant temperature water tank, 22
Or a steel pipe as a sample pipe.
汰Ｍ４り混トｔｔ６灸七ζコフ？−七々１）プ訃士偏苧
ン９９ｔｎｒｊｓ窪ｒ（１，−コンプレッサ１８から供
給される冷媒が流され、外部には恒温水槽２１からの温
水が、前記冷媒に対向して流されるようになっている。汰M4 りmixed tt6 moxibustion 7ζ cough? - Nanana 1) Pump 99tnrjs hollow (1, - Refrigerant supplied from the compressor 18 is flowed, and hot water from the constant temperature water tank 21 is flowed outside opposite to the refrigerant. It has become.
また、恒温水の温度は、各冷媒流量に対応して、冷媒系
が安定するように制御されている。Further, the temperature of the constant temperature water is controlled in accordance with each refrigerant flow rate so that the refrigerant system is stabilized.
なお、第３図中、矢印Ａ、Ａ’は、それぞれ、蒸発試験
の場合の冷媒および水の流れの方向を示し、矢印Ｂ、Ｂ
’は、凝縮試験の場合の冷媒および水の流れの方向を示
している。In addition, in FIG. 3, arrows A and A' indicate the flow directions of refrigerant and water, respectively, in the case of the evaporation test, and arrows B and B
' indicates the direction of refrigerant and water flow in case of condensation test.
そして、試験条件は次表のとおりとした。The test conditions were as shown in the table below.
この試験結果、本実施例に示す方法によって多孔質層が
形成された銅管２２における陰極電流密度と沸騰熱伝達
率との関係は、第４図にＣで示す値となり、同図にｄで
示すところの、前記比較例の鋼管のそれに対し、例えば
陰極電流密度５０Ａ／ｄｍ’において、約２２％の性能
向上が見られた。As a result of this test, the relationship between the cathode current density and the boiling heat transfer coefficient in the copper tube 22 in which the porous layer was formed by the method shown in this example is the value shown by C in FIG. 4, and the value shown by d in the same figure. As shown, a performance improvement of about 22% was observed at a cathode current density of 50 A/dm', for example, compared to that of the steel pipe of the comparative example.
但し、前記試験時における冷媒循環量は、６０ｋｇ／ｈ
ｒとした。However, the refrigerant circulation amount during the above test was 60 kg/h.
It was set as r.
なお、前記実施例は一例であって、各工程における処理
条件等は、目的とする金属製基体の諸特性等に対応して
種々変更可能である。It should be noted that the above-mentioned embodiments are merely examples, and the processing conditions in each step can be changed in various ways depending on the characteristics of the intended metal substrate.
また、前記実施例において示したような管体への摘要の
みならず、平板への摘要も当然可能である。Furthermore, it is of course possible to apply not only the outline to the tubular body as shown in the above embodiment, but also the outline to the flat plate.
「発明の効果」
以上説明したように、本発明に係わる金属表面における
多孔質層の形成方法は、疎水性を有する薄膜が形成され
た金属製基体の表面を鍍金液中に浸し、該鍍金液中に発
泡物質を混入して微細気泡を生成するとともに、該微細
気泡を前記金属製基体の表面近傍に供給しつつ、該金属
製基体を陰極として、前記鍍金液中に配設した陽極との
間で電気鍍金を行うことを特徴とするもので、平板のみ
ならず、管状の金属の内面にも均一な狭口空孔を存する
多孔質層を容易に形成することができ、したがって、核
沸騰を利用した伝熱特性の良好な伝熱体を効率よく製造
することができるとともに、製造装置の繁雑化を抑制し
て、製造コストの低減を図ることができる等の優れた効
果を奏する。"Effects of the Invention" As explained above, the method of forming a porous layer on a metal surface according to the present invention involves immersing the surface of a metal substrate on which a hydrophobic thin film is formed in a plating solution. A foaming substance is mixed into the plating solution to generate microbubbles, and while the microbubbles are supplied near the surface of the metal substrate, the metal substrate is used as a cathode and the anode disposed in the plating solution is connected. This method is characterized by performing electroplating between the metal plates and the inner surface of the tubular metal, making it possible to easily form a porous layer with uniform narrow pores not only on the flat plate but also on the inner surface of the tubular metal. It is possible to efficiently manufacture a heat transfer body with good heat transfer characteristics using the method, and also has excellent effects such as suppressing the complexity of manufacturing equipment and reducing manufacturing costs.
第１図は本発明の一実施例を実施するための装置を示す
概略図、第２図は本発明の一実施例によって製造された
鋼管の比表面積率と陰極電流密度との関係を示す図、第
３図は伝熱特性の試験を行うための装置の一例を示す概
略図、第４図は本発明の一実施例によって製造された鋼
管の伝熱特性を示す沸騰熱伝達率と陰極？Ｉｔ流密度と
の関係を示す図である。
２・・・・・・伝熱管（金属製基体）、７・・・・・・
圧送ポンプ、９・・・・・・電極棒（陽極）、 １
０・・・・・・直流電源、１１・・・・・・ホッパ。FIG. 1 is a schematic diagram showing an apparatus for implementing an embodiment of the present invention, and FIG. 2 is a diagram depicting the relationship between specific surface area ratio and cathode current density of a steel pipe manufactured by an embodiment of the present invention. , FIG. 3 is a schematic diagram showing an example of an apparatus for testing heat transfer characteristics, and FIG. 4 is a diagram showing the boiling heat transfer coefficient and cathode? showing the heat transfer characteristics of a steel pipe manufactured according to an embodiment of the present invention. It is a diagram showing the relationship with It flow density. 2... Heat exchanger tube (metal base), 7...
Pressure pump, 9... Electrode rod (anode), 1
0...DC power supply, 11...Hopper.
Claims (7)
面を鍍金液中に浸し、該鍍金液中に発泡物質を混入して
微細気泡を生成するとともに、該微細気泡を前記金属製
基体の表面近傍に供給しつつ、該金属製基体を陰極とし
て、前記鍍金液中に配設した陽極との間で電気鍍金を行
うことを特徴とする金属表面における多孔質層の形成方
法。(1) The surface of a metal substrate on which a hydrophobic thin film is formed is immersed in a plating solution, a foaming substance is mixed into the plating solution to generate microbubbles, and the microbubbles are transferred to the metal substrate. A method for forming a porous layer on a metal surface, the method comprising performing electroplating using the metal substrate as a cathode and an anode disposed in the plating solution while supplying the plating solution near the surface of the plating solution.
する特許請求の範囲第１項記載の金属表面における多孔
質層の形成方法。(2) A method for forming a porous layer on a metal surface according to claim 1, wherein the electroplating is performed using a pulsed current.
が硫酸銅溶液であることを特徴とする特許請求の範囲第
１項および第２項記載の金属表面における多孔質層の形
成方法。(3) The method for forming a porous layer on a metal surface according to claims 1 and 2, wherein the metal substrate is made of copper, and the plating solution is a copper sulfate solution. .
許請求の範囲第３項記載の金属表面における多孔質層の
形成方法。(4) The method for forming a porous layer on a metal surface according to claim 3, wherein the foamed material is copper carbonate.
許請求の範囲第１項ないし第３項記載の金属表面におけ
る多孔質層の形成方法。(5) The method for forming a porous layer on a metal surface according to any one of claims 1 to 3, wherein the metal substrate is a tube.
を特徴とする特許請求の範囲第１項ないし第３項および
第５項記載の金属表面における多孔質層の形成方法。(6) A method for forming a porous layer on a metal surface as set forth in claims 1 to 3 and 5, characterized in that the metal substrate and the plating solution are moved relative to each other.
許請求の範囲第１項ないし第６項記載の金属表面におけ
る多孔質層の形成方法。(7) The method for forming a porous layer on a metal surface according to any one of claims 1 to 6, wherein the anode is an insoluble metal.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61221065A JPH0765230B2 (en) | 1986-09-19 | 1986-09-19 | Method for forming porous layer on metal surface |
| FI864554A FI85060C (en) | 1985-11-11 | 1986-11-10 | Heat transfer material and process for making the same |
| EP86115606A EP0224761B1 (en) | 1985-11-11 | 1986-11-11 | Heat-transfer material and method of producing same |
| DE8686115606T DE3677338D1 (en) | 1985-11-11 | 1986-11-11 | HEAT TRANSFER MATERIAL AND METHOD FOR THE PRODUCTION THEREOF. |
| US07/221,999 US4826578A (en) | 1985-11-11 | 1988-07-20 | Method of producing heat-transfer material |
| US07/221,990 US4879185A (en) | 1985-11-11 | 1988-07-20 | Heat transfer material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61221065A JPH0765230B2 (en) | 1986-09-19 | 1986-09-19 | Method for forming porous layer on metal surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6376895A true JPS6376895A (en) | 1988-04-07 |
| JPH0765230B2 JPH0765230B2 (en) | 1995-07-12 |
Family
ID=16760939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61221065A Expired - Lifetime JPH0765230B2 (en) | 1985-11-11 | 1986-09-19 | Method for forming porous layer on metal surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0765230B2 (en) |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6210296A (en) * | 1985-07-08 | 1987-01-19 | Matsushita Refrig Co | Production of heat-transfer pipe |
-
1986
- 1986-09-19 JP JP61221065A patent/JPH0765230B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6210296A (en) * | 1985-07-08 | 1987-01-19 | Matsushita Refrig Co | Production of heat-transfer pipe |
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| JPH0765230B2 (en) | 1995-07-12 |
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