JPS6374611A - Resin molding die - Google Patents
Resin molding dieInfo
- Publication number
- JPS6374611A JPS6374611A JP21953386A JP21953386A JPS6374611A JP S6374611 A JPS6374611 A JP S6374611A JP 21953386 A JP21953386 A JP 21953386A JP 21953386 A JP21953386 A JP 21953386A JP S6374611 A JPS6374611 A JP S6374611A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- force
- grooves
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 51
- 239000011347 resin Substances 0.000 title claims abstract description 51
- 238000000465 moulding Methods 0.000 title claims description 18
- 238000010125 resin casting Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 14
- 238000001816 cooling Methods 0.000 abstract description 9
- 230000013011 mating Effects 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000006082 mold release agent Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は樹脂成形用金型に係り、特にエポキシ樹脂等の
成形に好適な樹脂成形用金型に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin molding mold, and particularly to a resin molding mold suitable for molding epoxy resin and the like.
樹脂成形用金型は通常上型及び下型を備え、これらの内
少なくとも一方の対向面に四部を設けてキャビティとし
、キャビティへの樹脂の鋳口を上型または下型に設けて
いる。A mold for resin molding usually includes an upper mold and a lower mold, and at least one of these molds has four parts provided on opposing surfaces to form a cavity, and an inlet for resin into the cavity is provided in the upper mold or the lower mold.
高温で溶融軽化させて樹脂を成形する金型においては、
成形後の樹脂の金型からの離型性に配慮する必要がある
。In molds that mold resin by melting and lightening it at high temperatures,
It is necessary to consider the releasability of the resin from the mold after molding.
金型における離型性は抜き勾配、金型の表面処理（メッ
キ、コーティング）などが常用されるが、抜き勾配だけ
では樹脂の接着は防止できず、メッキ、コーティング等
は繰返し使用により摩耗、脱落が起こり、効果が次第に
損われる。特にＩＣパッケージ用樹脂のようにガラスフ
ィラーを大量に含んだものには耐摩耗性の面から使用で
きない。Draft angle, mold surface treatment (plating, coating), etc. are commonly used to improve mold releasability, but draft angle alone cannot prevent resin from adhering, and plating, coating, etc. may wear out and fall off due to repeated use. occurs, and the effectiveness is gradually diminished. In particular, it cannot be used in products containing a large amount of glass filler, such as resins for IC packages, from the viewpoint of wear resistance.
樹脂中に離型剤を配合して金型との離型性を得る方法が
現在ＩＣパッケージの成形に使われているが、これはリ
ードフレーム等と樹脂との接着に対しては不利に働く。The method currently used for molding IC packages is to mix a mold release agent into the resin to obtain mold releasability from the mold, but this is disadvantageous when it comes to adhesion between lead frames, etc. and the resin. .
上記従来例で金型離型性が考慮されているのは抜き勾配
だけで、樹脂そのものに接着性がある場合には、例えば
勾配があっても金型と樹脂とが接着するため離型性は良
くない、その為樹脂中に離型剤を配合して、接着性を一
部犠牲にして離型性を求める方法も行われている。しか
しモールドにおいては被覆されるもの（被覆体）と樹脂
は確実に接着していることが望まれる場合が多く、上記
の方法は明らかに最良のものではない、また金型と樹脂
が接着した場合、被覆体と樹脂界面には高い応力が発生
して界面剥離の可能性を高めるので。In the conventional example above, only the draft angle is considered for mold releasability.If the resin itself has adhesive properties, the mold and resin will adhere even if there is a slope, so mold releasability will be improved. Therefore, a method is used in which a mold release agent is blended into the resin to obtain mold release properties at the expense of part of the adhesive properties. However, in molds, it is often desired that the thing to be coated (covering body) and the resin adhere reliably, so the above method is clearly not the best method, and if the mold and resin adhere to each other, , because high stress occurs at the coating and resin interface, increasing the possibility of interfacial delamination.
この面からも金型の離型性の良さが必要とされる。From this point of view as well, good mold releasability is required.
本発明は、上記のように樹脂中に離型剤を含ませること
なく、金型本来の特性により離型性を確保することを目
的とするもので、被着体と樹脂間の接着を損うことなく
この目的を達成させようとするものである。The purpose of the present invention is to ensure mold releasability using the inherent characteristics of the mold without including a mold release agent in the resin as described above, thereby impairing the adhesion between the adherend and the resin. The aim is to achieve this goal without any effort.
上記目的は上型〜下型間の対向面に形成されたキャビテ
ィ用凹部の形成された少なくとも一方の型の、前記対向
面とは反対面の表面に、溝を形成することにより達成さ
れる。The above object is achieved by forming a groove on a surface opposite to the opposing surface of at least one mold in which a cavity recess is formed on the opposing surface between the upper mold and the lower mold.
表面に設けた上記の溝は放熱面積を増加させ。 The above grooves provided on the surface increase the heat dissipation area.
その結果、成形後の冷却過程では他の部分より速く冷却
が進む、特に金型の上型と下型が接するキャビティーの
面は最も冷却が遅れるので、両面の変形差により金型は
溝側を凹、キャビティ側を凸とした彎曲形に変形する。As a result, in the cooling process after molding, cooling progresses faster than other parts. In particular, the cavity surface where the upper mold and lower mold contact is slowest in cooling, so the mold is on the groove side due to the difference in deformation on both sides. It is deformed into a curved shape with the cavity side concave and the cavity side convex.
溝は必要に応じて幅。Groove width as required.
深さ、数を変えることにより彎曲の大きさを種々変える
こともできる。溝はまた上記彎曲形の変形抵抗を下げる
効果があるので、金型板厚が同一の場合溝のないものに
比べより大きな彎曲を生じさせることができる。The size of the curvature can also be varied by changing the depth and number. The grooves also have the effect of lowering the deformation resistance of the curved shape, so when the mold plate thickness is the same, a larger curvature can be produced compared to a mold without grooves.
以下、本発明の実施例につき図面に従って説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図は本発明の実施例に係る樹脂成形用金型を金型キ
ャビティの位置で切った断面図であり、第２図は第１図
のアーア視図、第３図は第１図のイーイ視図である。−
力筒４図は第１図と同様の断面を従来形で示したもので
ある。FIG. 1 is a sectional view of a resin molding mold according to an embodiment of the present invention taken at the position of the mold cavity, FIG. 2 is a perspective view of FIG. 1, and FIG. This is a perspective view. −
Figure 4 shows a conventional cross section similar to that shown in Figure 1.
本実施例は上型２及び下型１から構成され、鋳口４は上
型２内に形成されている０本実施例では上型２及び下型
１の双方対向部分（合わせ而７）に夫々凹部を形成して
これをキャビティ３としている。キャビティ３と鋳口４
との間は上型底面部に沿って形成された溝（すなわちラ
ンナ）にて連通している。上型２と下型１とは合わせ面
７にて合わせビン１０により相互に固定されている１本
実施例では上型２及び下型１の夫々に、縦、横各２本の
溝５．溝６を形成している。This embodiment is composed of an upper mold 2 and a lower mold 1, and a casting hole 4 is formed in the upper mold 2. A recessed portion is formed in each case, and this is used as a cavity 3. Cavity 3 and spout 4
A groove (i.e., a runner) formed along the bottom surface of the upper mold communicates with the upper die. The upper mold 2 and the lower mold 1 are fixed to each other at the mating surfaces 7 by a mating pin 10. In this embodiment, the upper mold 2 and the lower mold 1 each have two vertical and horizontal grooves 5. A groove 6 is formed.
本実施例の適用は高温の溶融樹脂を金型に注入成形する
ための金型を対象としており成形には熱変形が判う、注
形後の冷却過程における金形の変形は第４図の従来形で
は、特別の配慮をしていないため、同図に二点鎖線で示
すようにほぼ対称の変形（収縮）が起きる。これに対し
本実施例の金型は第１図に示すように、キャビティー３
と反対側に１個〜複数個の溝５，６を設けである為、こ
の溝側の冷却が速く、かつ変形抵抗も少ないことから図
示のように溝側を凹とする彎曲を生じる。This example is applied to a mold for injecting high-temperature molten resin into the mold, and thermal deformation occurs during molding.The deformation of the mold during the cooling process after casting is shown in Figure 4. In the conventional type, since no special consideration is taken, almost symmetrical deformation (shrinkage) occurs as shown by the two-dot chain line in the same figure. On the other hand, the mold of this embodiment has a cavity 3 as shown in FIG.
Since one to a plurality of grooves 5 and 6 are provided on the opposite side, cooling on this groove side is fast and there is little deformation resistance, so that a curve is formed with the groove side being concave as shown in the figure.
このときのキャビティーの変形を誇張して書くと第５図
の如くで、キャビティーの口が広がるように変形してい
る６なお平均的な熱収縮分は除いて考えている。合成形
によってキャビティー内に樹脂９が注入されている状態
で上記の変形が起きることを考えると、それは第６図の
ようであると考えられる。すなわちキャビティーの口開
き形の変形により、金型側面８と樹脂が仮りに接着して
いた場合でも第６図のように自動的に剥離（離型）させ
ることができる。The deformation of the cavity at this time is exaggerated as shown in Fig. 5, where the mouth of the cavity is deformed so as to widen.6 Note that the average heat shrinkage is excluded. Considering that the above deformation occurs in a state where the resin 9 is injected into the cavity due to the composite mold, it is considered that the deformation is as shown in FIG. 6. That is, by deforming the opening shape of the cavity, even if the mold side surface 8 and the resin are temporarily adhered to each other, they can be automatically peeled off (mold released) as shown in FIG.
なお溝の形状９寸法、数などは必要に応じて種種の選択
を行い、キャビティーの変形を制御することができる。Note that the shape, dimensions, number, etc. of the grooves can be selected from various types as necessary to control the deformation of the cavity.
金型各部の変形は有限要素法で計算できるので、予めキ
ャビティーの変形を定めて金型の設計をすることができ
る。また本実施例では上型及び下型の２部分から成るも
のを例にしたが、上型中型及び下型の３部分から構成さ
れるものも本発明の範囲である（この場合には上型〜中
型間にキャビティーを形成するなら中型が本発明の下型
に相当し、中型〜下型間の場合には中型が本発明の上型
に相当する。）
第７図はＩＣパッケージの樹脂モールドの状況を示した
もので、金型の上型２と下型１の間にす−ドフレーム（
４２７０イ、銅）１１を挾み込み、リードフレーム上の
ＩＣ素子１２は金型キャビティー３内に位置するように
セットされる。ここに鋳口４より溶融した樹脂９が加圧
注入されＩＣ素子が封止される。このプロセスにおいて
、樹脂とリードフレームおよびＩＣ素子、樹脂と金型の
２種の界面が形成されるが、前者に対しては耐湿性の面
から強固な接着状態が必要であるのに対し、後者に対し
ては離型性の面から前者と全く逆の非接着状態が必要で
ある。樹脂の金型とリードフレーム等に対する接着性は
大差ないので、上記の２種の界面を形成するのは可成り
困藩なことである。Since the deformation of each part of the mold can be calculated using the finite element method, the mold can be designed by determining the deformation of the cavity in advance. In addition, in this embodiment, an example is given of a mold made of two parts, an upper mold and a lower mold, but a mold made of three parts, an upper mold, a middle mold, and a lower mold is also within the scope of the present invention (in this case, the upper mold If a cavity is formed between the middle molds, the middle mold corresponds to the lower mold of the present invention, and if the cavity is formed between the middle molds and the lower mold, the middle mold corresponds to the upper mold of the present invention.) Figure 7 shows the resin of the IC package. This shows the state of the mold, with a slide frame (
4270, copper) 11 is inserted, and the IC element 12 on the lead frame is set so as to be located within the mold cavity 3. Molten resin 9 is injected under pressure from the casting spout 4 to seal the IC element. In this process, two types of interfaces are formed: the resin and the lead frame and IC element, and the resin and the mold.The former requires a strong bond from the standpoint of moisture resistance, while the latter From the viewpoint of mold releasability, a non-adhesive state is required, which is the complete opposite of the former. Since there is not much difference in the adhesion of resin to a mold, a lead frame, etc., it is quite difficult to form the above two types of interface.
現状では樹脂中に離型剤を含ませ、樹脂中から浸出した
この離型剤で金型表面を覆うことにより離型性を得てい
る。しかしこの方法は同時にリードフレーム等と樹脂の
接着性もある程度犠牲にすることである。第７図に示す
ように金型に溝５，６を設けた金型では樹脂注入硬化後
の冷却過程で第１図、第５〜６図に示したように、キャ
ビティーの変形によって金型と樹脂を剥離させることが
できる。しかも金型と樹脂が接着している場合と非接着
の場合のリードフレームと樹脂の接着端の応力は第８図
のように顕著に相違するので、金型と樹脂を非接着状態
にすることにより、リードフレームと樹脂の接着が保護
されることにもなる。Currently, mold releasability is obtained by incorporating a mold release agent into the resin and covering the surface of the mold with the mold release agent leached from the resin. However, this method also sacrifices adhesiveness between the lead frame and the resin to some extent. As shown in Fig. 7, in a mold having grooves 5 and 6 in the mold, the mold is deformed by deformation of the cavity as shown in Fig. 1 and Figs. 5 and 6 during the cooling process after resin injection and hardening. and the resin can be peeled off. Moreover, the stress at the bonded end of the lead frame and resin is significantly different when the mold and resin are bonded and when they are not bonded, as shown in Figure 8, so it is necessary to keep the mold and resin in a non-bonded state. This also protects the bond between the lead frame and the resin.
第９〜１０図は本発明の金型をモールディング装置にセ
ットして樹脂モールドをする際、金型の熱変形の効果を
高めるようにした実施例を示す。Figures 9 and 10 show an embodiment in which the effect of thermal deformation of the mold is enhanced when the mold of the present invention is set in a molding device and resin molded.
モールディングは金型１，２を上固定板１６とプレス板
１５の間にクランプし、予熱した樹脂タブレットをプラ
ンジャ１７で押圧してキャビティー内に注入し、一定時
間保持して樹脂が硬化した後プレス板を降下させ金型を
取出す、１３はベース、１４はコラムである。このプレ
ス板降下過程に第１０図に示すように、プレス板がある
程度降下した時、このプレス板の動きに連動してリミッ
トスイッチ１８が作動して電磁弁１９が開となり、この
弁を通してノズル２０がら空気が噴出するようにしであ
る。すなわち、金型をモールディング装置から取出す以
前に金型に設けた冷却用溝に空気が吹き付けられるため
、この溝部分が金型の他の部分より急速に冷却され、前
述のキャビティーの変形を助長し、金型と樹脂の剥離（
離型）をより確実なものとすることができる。Molding is carried out by clamping the molds 1 and 2 between the upper fixing plate 16 and the press plate 15, pressing a preheated resin tablet with a plunger 17 and injecting it into the cavity, and holding it for a certain period of time to harden the resin. The press plate is lowered and the mold is taken out. 13 is the base and 14 is the column. As shown in FIG. 10 during this process of lowering the press plate, when the press plate has descended to a certain extent, the limit switch 18 is operated in conjunction with the movement of the press plate, and the solenoid valve 19 is opened. It is so that air is blown out. In other words, before the mold is taken out of the molding machine, air is blown into the cooling grooves provided in the mold, which cools the grooves more rapidly than other parts of the mold, promoting the aforementioned deformation of the cavity. and peeling of the mold and resin (
mold release) can be made more reliable.
本発明によれば、金型と樹脂の接着を防ぐことができる
ので、離型性がよいだけでなく、ＩＣのリードフレーム
と樹脂の接着端の応力を低下させ、必要な接着部分を保
護することもできる。According to the present invention, it is possible to prevent adhesion between the mold and the resin, which not only improves mold releasability but also reduces stress at the adhesive end of the IC lead frame and resin, protecting the necessary adhesive part. You can also do that.
第１図は本発明の一実施例を示す樹脂成形用金型の断面
図、第２図は第１図のアーア断面図、第３図は第１図の
イーイ断面図、第４図は従来例を示す樹脂成形金型の断
面図、第５図及び第６図は第１図に示す実施例金型のキ
ャビティー付近の熱変形を示す部分拡大図、第７図は本
発明の他の実施例を示すＩＣパッケージモールド工程中
の金型断面図、第８図は第７図の接着端部の応力分布を
示す特性図、第９図及び第１０図は本発明達成の為の一
手段を示すモールド装置構成図である。
１・・・下型、２・・・上型、３・・・キャビティー、
４・・・鋳ＶＪ３図
ｘ ７ 図Fig. 1 is a sectional view of a resin molding die showing an embodiment of the present invention, Fig. 2 is a sectional view of A-A in Fig. 1, Fig. 3 is a sectional view of E-I in Fig. 1, and Fig. 4 is a conventional sectional view. 5 and 6 are partially enlarged views showing thermal deformation near the cavity of the example mold shown in FIG. 1, and FIG. 7 is a cross-sectional view of a resin molding die showing an example. A cross-sectional view of a mold during the IC package molding process showing an embodiment, FIG. 8 is a characteristic diagram showing the stress distribution at the bonded end of FIG. 7, and FIGS. 9 and 10 are one means for achieving the present invention. FIG. 2 is a configuration diagram of a molding device. 1...lower mold, 2...upper mold, 3...cavity,
4... Cast VJ3 diagram x 7 diagram
Claims (1)
一方の対向面に凹部を設けてキャビティとし、該キヤビ
テイへの樹脂の鋳口を該上型または下型に設けてなる樹
脂成形用金型において、前記凹部の形成された少なくと
も一方の型の前記対向面とは反対側の表面に溝を設けた
ことを特徴とする樹脂成形用金型。1. A resin comprising an upper mold and a lower mold, a cavity formed by providing a recess on the opposing surface of at least one of the upper mold and the lower mold, and a resin casting port for the resin into the cavity provided in the upper mold or the lower mold. A mold for resin molding, characterized in that a groove is provided on a surface of at least one mold in which the recessed portion is formed, on a side opposite to the opposing surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21953386A JPS6374611A (en) | 1986-09-19 | 1986-09-19 | Resin molding die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21953386A JPS6374611A (en) | 1986-09-19 | 1986-09-19 | Resin molding die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6374611A true JPS6374611A (en) | 1988-04-05 |
Family
ID=16736973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21953386A Pending JPS6374611A (en) | 1986-09-19 | 1986-09-19 | Resin molding die |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6374611A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012204722A (en) * | 2011-03-28 | 2012-10-22 | Canon Inc | Imprint method, mold, and article manufacturing method using the same |
-
1986
- 1986-09-19 JP JP21953386A patent/JPS6374611A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012204722A (en) * | 2011-03-28 | 2012-10-22 | Canon Inc | Imprint method, mold, and article manufacturing method using the same |
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