JPS6366809U - - Google Patents
Info
- Publication number
- JPS6366809U JPS6366809U JP16040286U JP16040286U JPS6366809U JP S6366809 U JPS6366809 U JP S6366809U JP 16040286 U JP16040286 U JP 16040286U JP 16040286 U JP16040286 U JP 16040286U JP S6366809 U JPS6366809 U JP S6366809U
- Authority
- JP
- Japan
- Prior art keywords
- base
- pins
- emitting diode
- light emitting
- rows
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Laser Beam Printer (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
- Dot-Matrix Printers And Others (AREA)
Description
第１図は本考案実施例の線状光源の分解斜視図
で、第２図はその線状光源の断面図である。
１……基台、２，２……ピン、３，３……発光
ダイオード、４……配線基板、５，５……反射枠
、６……円柱状レンズ。
FIG. 1 is an exploded perspective view of a linear light source according to an embodiment of the present invention, and FIG. 2 is a sectional view of the linear light source. 1... Base, 2, 2... Pin, 3, 3... Light emitting diode, 4... Wiring board, 5, 5... Reflective frame, 6... Cylindrical lens.
Claims (1)
基台のピンに載置され配線が施された発光ダイオ
ードと、ピンの列の間に前記基台と略直交するよ
うに挿入されピンが固着された配線基板と、基板
の発光ダイオード側が開放される様に基台を側方
から挟持する反射枠と、発光ダイオードの上方に
保持された円柱状レンズとを具備した事を特徴と
する線状光源。 A long base with pins arranged in two rows,
A light emitting diode is placed on the pins of a base and wired, a wiring board is inserted between the rows of pins so as to be substantially orthogonal to the base and the pins are fixed, and the light emitting diode side of the board is open. A linear light source characterized by comprising a reflective frame that holds a base from the sides so that the base is held in place, and a cylindrical lens held above a light emitting diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16040286U JPS6366809U (en) | 1986-10-20 | 1986-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16040286U JPS6366809U (en) | 1986-10-20 | 1986-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6366809U true JPS6366809U (en) | 1988-05-06 |
Family
ID=31085749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16040286U Pending JPS6366809U (en) | 1986-10-20 | 1986-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6366809U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008244220A (en) * | 2007-03-28 | 2008-10-09 | Kyocera Corp | Light emitting device |
-
1986
- 1986-10-20 JP JP16040286U patent/JPS6366809U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008244220A (en) * | 2007-03-28 | 2008-10-09 | Kyocera Corp | Light emitting device |