JPS6364079U

JPS6364079U -

Info

Publication number: JPS6364079U
Application number: JP15789986U
Authority: JP
Priority date: 1986-10-15
Filing date: 1986-10-15
Publication date: 1988-04-27

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図乃至第３図は、本考案の第１の実施例を
説明する図であり、第２図はプリント配線板の平
面図、第１図は第２図のプリント配線板の正規の
位置に電子部品を実装した状態を示す第２図の
―線断面図、第３図はパツドの長手方向にずれ
て電子部品を実装した状態を示す第２図の―
線断面図である。第４図乃至第６図は本考案の第
２の実施例を説明する図であり、第４図はプリン
ト配線板の平面図、第５図は第４図のプリント配
線板の正規の位置に電子部品を実装した状態を示
す第４図の―線断面図、第６図はパツドの長
手方向にずれて電子部品を実装した状態を示す第
４図の―線断面図である。第７図乃至第１１
図は従来例を説明する図であり、第７図はリフロ
ー半田付で電子部品を半田付けした状態を示す断
面図、第８図はフロー半田付けで電子部品を半田
付けした状態を示す断面図、第９図はフロー半田
付け用のプリント配線板を示す平面図、第１０図
は第９図のプリント配線板の正規の位置に電子部
品を実装した状態を示す第９図の―線断面図
、第１１図はパツドの長手方向にずれて電子部品
を実装した状態を示す第９図の―線断面図で
ある。２０……電子部品、２１……本体部、２２……
リード、２３……第１のリード部、２４……基端
、２５……第２のリード部、２８，２８Ａ……プ
リント配線板、２９，２９Ａ……パツド、３０，
３０Ａ……第１のパツド部、３１，３１Ａ……第
２のパツド部、３３……一端。 1 to 3 are diagrams explaining the first embodiment of the present invention, FIG. 2 is a plan view of the printed wiring board, and FIG. 1 is the normal position of the printed wiring board in FIG. 2. Figure 2 is a sectional view taken along line 2, showing a state in which electronic components are mounted on the pad, and Figure 3 is a cross-sectional view of Figure 2 showing a state in which electronic components are mounted shifted in the longitudinal direction of the pad.
FIG. 4 to 6 are diagrams explaining the second embodiment of the present invention, in which FIG. 4 is a plan view of the printed wiring board, and FIG. 5 is a diagram showing the normal position of the printed wiring board in FIG. FIG. 4 is a sectional view taken along the line ``-'' in FIG. 4 showing a state in which electronic components are mounted, and FIG. 6 is a sectional view taken along the line ``--'' in FIG. 4 showing a state in which electronic components are mounted shifted in the longitudinal direction of the pad. Figures 7 to 11
The figures are diagrams explaining a conventional example, and Fig. 7 is a sectional view showing a state in which electronic components are soldered by reflow soldering, and Fig. 8 is a sectional view showing a state in which electronic components are soldered by flow soldering. , FIG. 9 is a plan view showing a printed wiring board for flow soldering, and FIG. 10 is a cross-sectional view taken along the line -- in FIG. , and FIG. 11 is a sectional view taken along the line -- in FIG. 9, showing a state in which electronic components are mounted shifted in the longitudinal direction of the pad. 20...Electronic component, 21... Main body, 22...
Lead, 23...first lead part, 24...base end, 25...second lead part, 28, 28A...printed wiring board, 29, 29A...pad, 30,
30A...first pad part, 31, 31A...second pad part, 33...one end.

Claims

【実用新案登録請求の範囲】第１のリード部とこの第１のリード部の基端で
立ち上がり本体部に致る第２のリード部とでリー
ドが形成されている電子部品の前記リードを半田
付けするパツドを有するプリント配線板において
、その一端側に前記第１のリード部の基端が位置
づけられる状態で前記第１のリード部と当接する
第１のパツド部と、この第１のパツド部の前記一
端側から所定の間隔を開けて設けられた第２のパ
ツド部とで前記パツドが形成されていることを特
徴とするプリント配線板。[Claims for Utility Model Registration] The leads of an electronic component in which a lead is formed by a first lead part and a second lead part that rises from the base end of the first lead part and reaches the main body part are soldered. A printed wiring board having a pad to be attached, a first pad part that comes into contact with the first lead part with the base end of the first lead part positioned on one end side thereof, and the first pad part The printed wiring board is characterized in that the pad is formed by a second pad part provided at a predetermined distance from the one end side of the board.