JPS6364051U - - Google Patents

Info

Publication number
JPS6364051U
JPS6364051U JP15892186U JP15892186U JPS6364051U JP S6364051 U JPS6364051 U JP S6364051U JP 15892186 U JP15892186 U JP 15892186U JP 15892186 U JP15892186 U JP 15892186U JP S6364051 U JPS6364051 U JP S6364051U
Authority
JP
Japan
Prior art keywords
lead frame
holes
utility
scope
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15892186U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15892186U priority Critical patent/JPS6364051U/ja
Publication of JPS6364051U publication Critical patent/JPS6364051U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385Shape, e.g. interlocking features

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例のアイランドを上方向
から見た図である。 1はリードフレーム、2はアイランド部、3は
貫通孔である。
FIG. 1 is a top view of an island according to an embodiment of the present invention. 1 is a lead frame, 2 is an island portion, and 3 is a through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードフレームの半導体素子を固着するアイラ
ンド部に1個又は複数個の貫通穴をあけたことを
特徴とする半導体装置。
A semiconductor device characterized in that one or more through holes are formed in an island portion of a lead frame to which a semiconductor element is fixed.
JP15892186U 1986-10-16 1986-10-16 Pending JPS6364051U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15892186U JPS6364051U (en) 1986-10-16 1986-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15892186U JPS6364051U (en) 1986-10-16 1986-10-16

Publications (1)

Publication Number Publication Date
JPS6364051U true JPS6364051U (en) 1988-04-27

Family

ID=31082866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15892186U Pending JPS6364051U (en) 1986-10-16 1986-10-16

Country Status (1)

Country Link
JP (1) JPS6364051U (en)

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