JPS6362332A - Device for manufacturing semiconductor device - Google Patents

Device for manufacturing semiconductor device

Info

Publication number
JPS6362332A
JPS6362332A JP20820686A JP20820686A JPS6362332A JP S6362332 A JPS6362332 A JP S6362332A JP 20820686 A JP20820686 A JP 20820686A JP 20820686 A JP20820686 A JP 20820686A JP S6362332 A JPS6362332 A JP S6362332A
Authority
JP
Japan
Prior art keywords
mold
force
polyhedron
rotating
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20820686A
Other languages
Japanese (ja)
Inventor
Shoji Kobayashi
小林　昭司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP20820686A priority Critical patent/JPS6362332A/en
Publication of JPS6362332A publication Critical patent/JPS6362332A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds
    • B29C2045/2677—The exchangeable mould parts being combinable or rearrangeable in different ways

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To contrive the reduction in an operating time by a method wherein the bottom forces of a transfer mold are combined plural pieces to form a rotationally symmetrical polyhedron and the polyhedron is rotated in such a way that the desired bottom force can be selected. CONSTITUTION:The rotating shaft 2 of a rotating polyhedron constituted of plural pieces of bottom forces 1, a motor 3 which rotates this shaft 2 to make the desired bottom force position just under a top force 5 and such a transmission mechanism 4 as a chain are provided. The clamping of the top force 5, which faces the bottom force 1, of the transfer mold and the bottom force is performed by the descent of this top force. Moreover, a mold fixing jig 7 for positioning correctly a plunger 6 and the desired bottom force 1 is provided. Thereby, by just rotating the rorating shaft 2, works can be completed in a short time, handling and conveying units are not necessitated besides and the resin sealing of a semiconductor device can be performed by the desired another metal mold.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置の製造装置に係り、特に樹脂封入工
程に使用する所謂トランスファーモールド装置の金型の
装着装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device manufacturing apparatus, and more particularly to a mold mounting apparatus for a so-called transfer molding apparatus used in a resin encapsulation process.

〔従来の技術〕[Conventional technology]

従来、この種のトランスファーモールド装置の金型は、
たソー個の重量級大型金型を有し、外形上異種の半導体
装置を製造する際にはこの大型金型を乗せかえる事によ
って、種別切りかえを行なっていた。Conventionally, the mold for this type of transfer molding equipment is
It has several large, heavy-duty molds, and when manufacturing semiconductor devices of different external shapes, the type can be changed by replacing these large molds.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

前述した従来のトランスファーモールド装置は、大型金
型の乗せかえを行なわなければならぬので、種別切りか
えに際しては、金型温度を下降させ、金型を下ろし、別
種の金型を上げ、温度を再上昇させる等、多大の時間を
空費し、また金型の取扱いＫも特別の運搬・取扱い装置
を必要とする等の欠点があった。With the conventional transfer molding equipment mentioned above, it is necessary to change large molds, so when changing types, the mold temperature must be lowered, the mold lowered, the mold of the other type raised, and the temperature re-set. A large amount of time is wasted in raising the mold, and handling of the mold also requires special transportation and handling equipment.

本発明の目的は、前記欠点を解決し、作業時間が著しく
短縮できるようにした半導体装置の製造装置を提供する
ことにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device manufacturing apparatus that solves the above-mentioned drawbacks and can significantly shorten the working time.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の半導体装置の製造装置の構成は、半導体装置の
樹脂封入工程に使用するトランスファーモールド金型を
複数組合せて回転対称な多面体を形成し、所望の前記金
型を選択せしめ得るように、前記多面体を回転させる手
段を設けたことを特徴とする。The configuration of the semiconductor device manufacturing apparatus of the present invention is such that a plurality of transfer mold molds used in the resin encapsulation process of the semiconductor device are combined to form a rotationally symmetrical polyhedron, and a desired mold can be selected. It is characterized by providing means for rotating the polyhedron.

〔実施例〕〔Example〕

次に本発明について図面を参照して詳細に説明する。 Next, the present invention will be explained in detail with reference to the drawings.

第１図は本発明の一実施例の半導体装置の製造装置の斜
視図である。同図釦おいて、トランスフーモールド金型
１は、従来の金型よシ小型化され、幅約３０国、奥約３
０ｃｍ、厚さ約０．５　ａｎ、重量は約３〜程度である
。複数個の下金型ＩＫよシ構成された回転多面体（金型
多面体と略称する）の回転対称軸２と、この軸２を回転
せしめ所望の金型を上金型５の直下に位置せしむるため
のモータ５と、チェーン等の伝達機構４とが示されてい
る。また、金型１に相対するトランスファーモールドの
上金型５は、金型のクランプがこの金型の下降によって
なされる。さらに、プランジャ６と、所望の下金型ｌを
正確に位置出しするための金型固定治具７とが示されて
いる・。FIG. 1 is a perspective view of a semiconductor device manufacturing apparatus according to an embodiment of the present invention. In the same figure, TransfuMold mold 1 is smaller than the conventional mold, and is approximately 30 mm wide and 3 mm deep.
0 cm, thickness of about 0.5 an, and weight of about 3 to about. A rotational symmetry axis 2 of a rotary polyhedron (abbreviated as mold polyhedron) composed of a plurality of lower mold IKs and a desired mold are positioned directly below the upper mold 5 by rotating this axis 2. A motor 5 and a transmission mechanism 4 such as a chain are shown. Further, the upper mold 5 of the transfer mold facing the mold 1 is clamped by lowering the mold. Furthermore, a plunger 6 and a mold fixing jig 7 for accurately positioning the desired lower mold l are shown.

第２図は本発明の他の実施例の半導体装置の製造装置の
斜視図である。同図では、金星多面体の部分だけを示し
た。同図において、４個の下金型１を組み合せ、軸２を
中心として、回転するようＫなっている。FIG. 2 is a perspective view of a semiconductor device manufacturing apparatus according to another embodiment of the present invention. The figure shows only the Venus polyhedron. In the figure, four lower molds 1 are assembled and rotated about a shaft 2.

前記２つの実施例は、３角、４角柱の金型多面体に例を
取ったが、更により多角柱にても、また正四面体等の多
面体をも使用しうる。In the above two embodiments, mold polyhedrons of triangular and quadrangular prisms were used as examples, but polygonal prisms and polyhedrons such as regular tetrahedrons may also be used.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明によれば、複数個の別種金
型を回転対称な面に組込むことＫよシ、その回転軸を回
転せしむるだけで、短時間に作業ができ、他に取扱・運
搬装置を必要とせず、所望の別種金型にて半導体装置の
樹脂封止を履行することが可能となる効果が得られる。As explained above, according to the present invention, instead of assembling a plurality of different types of molds on a rotationally symmetrical surface, the work can be done in a short time by simply rotating the rotation axis. This provides the effect of making it possible to resin-seal a semiconductor device using a desired different type of mold without requiring a handling/transporting device.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の実施例の半導体装置の製造装置を示す
斜視図、第２図は本発明の他の実施例の半導体装置の製
造装置を示す斜視図である。 １・・・・・・トランスファモールド金型（下型）、２
・・・・・・回転対称回転軸、３・・・・・・モータ、
４・・・・・・回転伝達機構、５・・−・・・トランス
ファーモールド金型（上型）、６・・・・・・プランジ
ャ、７・・・・・・金型固定治具。 ＼、＋ノ′FIG. 1 is a perspective view showing a semiconductor device manufacturing apparatus according to an embodiment of the invention, and FIG. 2 is a perspective view showing a semiconductor device manufacturing apparatus according to another embodiment of the invention. 1...Transfer mold mold (lower mold), 2
...Rotationally symmetrical rotation axis, 3...Motor,
4...Rotation transmission mechanism, 5...Transfer mold mold (upper mold), 6...Plunger, 7...Mold fixing jig. \, +ノ′

Claims (1)

【特許請求の範囲】[Claims] 半導体装置の樹脂封入工程に使用するトランスファーモ
ールド金型を複数組み合せて回転対称な多面体を形成し
、所望の前記金型が選択できるように、前記多面体を回
転させる手段を設けたことを特徴とする半導体装置の製
造装置。A rotationally symmetric polyhedron is formed by combining a plurality of transfer mold molds used in the resin encapsulation process of semiconductor devices, and means is provided for rotating the polyhedron so that a desired mold can be selected. Manufacturing equipment for semiconductor devices.
JP20820686A 1986-09-03 1986-09-03 Device for manufacturing semiconductor device Pending JPS6362332A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20820686A JPS6362332A (en) 1986-09-03 1986-09-03 Device for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20820686A JPS6362332A (en) 1986-09-03 1986-09-03 Device for manufacturing semiconductor device

Publications (1)

Publication Number Publication Date
JPS6362332A true JPS6362332A (en) 1988-03-18

Family

ID=16552424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20820686A Pending JPS6362332A (en) 1986-09-03 1986-09-03 Device for manufacturing semiconductor device

Country Status (1)

Country Link
JP (1) JPS6362332A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996038283A1 (en) * 1995-05-31 1996-12-05 The Whitaker Corporation Method and apparatus for injection molding of selected parts
WO1997036727A3 (en) * 1996-03-29 1997-11-13 Nypro Inc System and method for injection molding
US5731013A (en) * 1995-09-13 1998-03-24 The Whitaker Corporation Reconfigurable mold having travelling separator assist
US5783224A (en) * 1995-10-31 1998-07-21 The Whitaker Corporation Mold laminate assembly for an injection mold machine
JP2007214237A (en) * 2006-02-08 2007-08-23 Seiko Instruments Inc Manufacturing method for semiconductor device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996038283A1 (en) * 1995-05-31 1996-12-05 The Whitaker Corporation Method and apparatus for injection molding of selected parts
US5660782A (en) * 1995-05-31 1997-08-26 The Whitaker Corporation Method and apparatus for injection molding of selected parts
CN1066096C (en) * 1995-05-31 2001-05-23 惠特克公司 Method and apparatus for injection molding of selected parts
US5731013A (en) * 1995-09-13 1998-03-24 The Whitaker Corporation Reconfigurable mold having travelling separator assist
US5783224A (en) * 1995-10-31 1998-07-21 The Whitaker Corporation Mold laminate assembly for an injection mold machine
WO1997036727A3 (en) * 1996-03-29 1997-11-13 Nypro Inc System and method for injection molding
JP2007214237A (en) * 2006-02-08 2007-08-23 Seiko Instruments Inc Manufacturing method for semiconductor device
JP4674813B2 (en) * 2006-02-08 2011-04-20 セイコーインスツル株式会社 Manufacturing method of semiconductor device

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