JPS6358890A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPS6358890A JPS6358890A JP20134586A JP20134586A JPS6358890A JP S6358890 A JPS6358890 A JP S6358890A JP 20134586 A JP20134586 A JP 20134586A JP 20134586 A JP20134586 A JP 20134586A JP S6358890 A JPS6358890 A JP S6358890A
- Authority
- JP
- Japan
- Prior art keywords
- palladium
- wiring board
- printed wiring
- insulating plate
- aqueous solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 31
- 239000010949 copper Substances 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 27
- 238000007747 plating Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 22
- 239000000084 colloidal system Substances 0.000 claims description 21
- 229910052763 palladium Inorganic materials 0.000 claims description 17
- 239000007864 aqueous solution Substances 0.000 claims description 13
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 claims description 8
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 5
- 239000000243 solution Substances 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- 230000002378 acidificating effect Effects 0.000 claims description 2
- 230000001235 sensitizing effect Effects 0.000 claims description 2
- 238000002791 soaking Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- -1 palladium ions Chemical class 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 238000010292 electrical insulation Methods 0.000 description 5
- 239000003365 glass fiber Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000003197 catalytic effect Effects 0.000 description 4
- KPVWDKBJLIDKEP-UHFFFAOYSA-L dihydroxy(dioxo)chromium;sulfuric acid Chemical compound OS(O)(=O)=O.O[Cr](O)(=O)=O KPVWDKBJLIDKEP-UHFFFAOYSA-L 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920000159 gelatin Polymers 0.000 description 3
- 239000008273 gelatin Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910001430 chromium ion Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
Landscapes
- Chemically Coating (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は印刷配線板の製造方法に関し、特に絶縁仮に付
加的に導電回路を形成する印刷配線板の製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a method for manufacturing a printed wiring board in which an insulating circuit is additionally formed with a conductive circuit.
従来、絶！ｉ板に付加的に導電回路を形成する方法、所
謂フリアディティブ法として次の方法が知られている。Traditionally, absolutely! The following method is known as a so-called free additive method, which is a method for additionally forming a conductive circuit on an i-board.
第一の方法は、パラジウム等の触媒金属を分散含有した
エポキシ樹脂等の化１．１板に貫通孔を開設した後、こ
の絶縁板の非回路部分にめっきレジストを形成し、次い
で貫通孔の壁面及び鞄８ゑ板の回路部分をクロム酸−硫
酸混液で化学的に親水化した後無電解銅めっきし、貫通
孔の壁面及び絶縁１反の回路部分に導電回路を形成する
方法である。The first method is to open a through hole in a chemical 1.1 plate made of epoxy resin or the like containing dispersed catalytic metal such as palladium, then form a plating resist on the non-circuit part of this insulating plate, and then form a plating resist on the non-circuit part of the insulating plate. In this method, the wall surface and the circuit portion of the bag board are chemically made hydrophilic with a chromic acid-sulfuric acid mixture and then electroless copper plated to form a conductive circuit on the wall surface of the through-hole and the circuit portion of the insulator.
また、第二の方法は、絶縁仮に貫通孔を形成した後、絶
縁板をクロム酸−硫酸混液で化学的に親水化し、次いで
塩化パラジウム−塩化第一錫の混合コロイド触媒で増感
した後、絶縁仮の非回路部分にめっきレジストを形成し
、その後無電解銅めっきし、貫通孔の壁面及び絶縁板の
回路部分に導電回路を形成する方法である。In the second method, after temporarily forming through holes in the insulation, the insulation plate is chemically made hydrophilic with a chromic acid-sulfuric acid mixture, and then sensitized with a mixed colloidal catalyst of palladium chloride and stannous chloride. This is a method in which a plating resist is formed on a temporary non-circuit part of the insulation, and then electroless copper plating is applied to form a conductive circuit on the wall surface of the through hole and the circuit part of the insulating plate.
５発明が解決しようとする問題点〕 上述した従来の方法では次のような問題が生じている。5 Problems that the invention attempts to solve] The conventional method described above has the following problems.
先ず、第一の方法においては、絶縁板中の触媒金属（パ
ラジウム）は電気絶縁性の面からゴム系樹脂で被覆され
で粒子状に分散含有されており、触媒金属濃度も高（は
できない。このため、無電解銅めっきで絶縁板の表面及
び貫通孔の壁面が完全に被覆されるまで数時間かかる場
合があり、無電解銅めっき液中への絶縁板の溶解、即ち
無電解銅めっき液の汚染の原因となっている。First, in the first method, the catalytic metal (palladium) in the insulating plate is coated with a rubber-based resin and dispersed in the form of particles for electrical insulation, and the catalytic metal concentration is also high. For this reason, it may take several hours for the surface of the insulating board and the wall of the through hole to be completely coated with electroless copper plating, and the insulating board must be dissolved in the electroless copper plating solution. is causing pollution.
また、この方法においては、触媒金属は絶縁板中に分散
して含有されているため、導電回路形成後に印刷配線板
が高湿度雰囲気に晒されると導電回路間の電気絶縁性が
低下されることがある。In addition, in this method, the catalyst metal is dispersed and contained in the insulating plate, so if the printed wiring board is exposed to a high humidity atmosphere after forming the conductive circuit, the electrical insulation between the conductive circuits will be reduced. There is.
一方、第二の方法では、触媒金属は導電回路間のめっき
レジストの下に残存しており、第一の方法と同様高湿度
雰囲気中で印刷配線板の導電回路間の電気絶縁性が低下
される問題がある。また、無電解銅めっきの増感に塩化
パラジウム−塩化第ｔＬｎ合コココロイド用されるが、
このコロイドは負に帯電しており、ガラス織組強化エポ
キシ樹脂板等のような絶縁板において負に帯電している
ガラス礒維面（貫通孔壁面）には吸着量が低下する。こ
のため、無電解銅めっきがガラス繊維面に析出し難いと
いう問題もある。On the other hand, in the second method, the catalytic metal remains under the plating resist between the conductive circuits, and as in the first method, the electrical insulation between the conductive circuits of the printed wiring board is reduced in a high humidity atmosphere. There is a problem. In addition, palladium chloride-tLn chloride cococolloid is used for sensitization of electroless copper plating.
This colloid is negatively charged, and the amount of colloid adsorbed is reduced on the negatively charged glass fiber surface (through-hole wall surface) of an insulating plate such as a glass texture reinforced epoxy resin plate. For this reason, there is also the problem that electroless copper plating is difficult to deposit on the glass fiber surface.
いずれにしても、上記した従来方法では高湿度雰囲気中
での絶縁性が低（、また貫通孔の導電回路にピンホール
やボイドが発生して電気的接続信頼性が低下され易いも
のとなっている。In any case, the conventional method described above has poor insulation properties in a high-humidity atmosphere (also, pinholes and voids occur in the conductive circuit of the through hole, which tends to reduce the reliability of electrical connection). There is.
本発明の印刷配線板の製造方法は、高湿度雰囲気中でも
高絶縁性を保持するとともに、貫通孔の導電回路におい
てもピンホールやボイドの発生を防止して電気的接続信
頼性を向上することを可能とするものである。The printed wiring board manufacturing method of the present invention maintains high insulation even in a high humidity atmosphere, and also prevents pinholes and voids from occurring in conductive circuits in through holes, thereby improving electrical connection reliability. It is possible.
本発明の印刷配線板の製造方法は、絶縁板の表面にめっ
きレジストを逆版印刷する工程と、この絶縁仮に必要に
応じて貫通孔を開設した後、絶縁板の表面及び貫通孔の
壁面等の露呈面を親水化する工程と、この絶縁仮の露呈
面に銅コロイド膜を形成する工程と、銅コロイド膜の形
成された面をパラジウムイオンを含む水溶液に接触させ
増感する工程と、この増感した面に無電解銅めっきして
導電回路を形成する工程とを含んでいる。The method for manufacturing a printed wiring board of the present invention includes the steps of reverse printing a plating resist on the surface of an insulating plate, and after forming through holes in this insulation as necessary, the surface of the insulating plate and the wall surface of the through hole, etc. a step of making the exposed surface of the temporary insulator hydrophilic, a step of forming a copper colloid film on the exposed surface of this temporary insulation, a step of sensitizing the surface on which the copper colloid film is formed by contacting it with an aqueous solution containing palladium ions; The method includes the step of electroless copper plating on the sensitized surface to form a conductive circuit.
ここで、前記絶縁板としては表面にゴム系接着剤層の形
成されたエポキシ樹脂板（ガラス迅維強化）等が使用さ
れる。また、めっきレジストとしては、エポキシ樹脂系
めっきレジストインクが使用でき、スクリーン印刷によ
って逆版（回路パターンと逆のパターン）に印刷される
。Here, as the insulating plate, an epoxy resin plate (glass fiber reinforced) or the like having a rubber adhesive layer formed on its surface is used. Further, as the plating resist, an epoxy resin-based plating resist ink can be used, and it is printed on a reverse plate (a pattern opposite to the circuit pattern) by screen printing.
絶縁板表面の親木化方法としては、クロム酸−硫酸混液
、過マンガン酸カリウムのアルカリ性水溶液を使用して
化学的に親水化する方法が採用できる。As a method for making the surface of the insulating plate hydrophilic, a method of chemically making it hydrophilic using a chromic acid-sulfuric acid mixture or an alkaline aqueous solution of potassium permanganate can be adopted.
更に、銅コロイド膜は、銅−ゼラチンコロイドを含むＰ
Ｈ２〜８の水溶液に絶縁板を浸漬することで形成される
。銅コロイド膜はめっきレジストの表面にも吸着形成さ
れるが、めっきレジスト上の銅コロイド膜はスポンジ等
を使用し、水洗研磨することで容易に除去され、銅コロ
イド膜を必要部分に選択的に形成できる。銅−ゼラチン
コロイトはＰＨ２〜８において正に帯電しており、エポ
キシ樹脂板の貫通孔壁のガラス繊維面にも吸着し易い。Furthermore, the copper colloid film contains P containing copper-gelatin colloid.
It is formed by immersing an insulating plate in an aqueous solution of H2 to H8. The copper colloid film is also adsorbed and formed on the surface of the plating resist, but the copper colloid film on the plating resist is easily removed by washing and polishing with a sponge, etc., and the copper colloid film can be selectively applied to the required areas. Can be formed. The copper-gelatin colloid is positively charged at pH 2 to 8, and is easily adsorbed to the glass fiber surface of the through-hole wall of the epoxy resin plate.
また、パラジウムイオン（Ｐｄ”）を含む水溶液（以下
、パラジウムイオン水溶液と称する）としては、塩化パ
ラジウム、硫酸パラジウムの酸性水溶液が使用でき、パ
ラジウムイオンの濃度は０．００１〜０．１ｇ／βが適
当である。このパラジウムイオン水溶液のＰＨは４以下
が適当であり、塩素イオンの濃度はＩｇ／β以下が適当
である。Furthermore, as an aqueous solution containing palladium ions (Pd'') (hereinafter referred to as palladium ion aqueous solution), an acidic aqueous solution of palladium chloride or palladium sulfate can be used, and the concentration of palladium ions is 0.001 to 0.1 g/β. The pH of this palladium ion aqueous solution is suitably 4 or less, and the concentration of chlorine ions is suitably Ig/β or less.
絶縁板の表面に吸着形成された銅コロイド膜は、パラジ
ウムイオン水溶液中で下式で示されるように、パラジウ
ムイオン（Ｐｄ”）と置換反応し、銅コロイドの表面に
はパラジウム金属が形成されることになる。The copper colloid film adsorbed and formed on the surface of the insulating plate undergoes a substitution reaction with palladium ions (Pd'') in an aqueous palladium ion solution as shown by the formula below, and palladium metal is formed on the surface of the copper colloid. It turns out.
Ｃｕ＋Ｐｄ”→Ｐｄ＋Ｃｕ” 〔実施例〕 次に、本発明を図面を参照して説明する。Cu+Pd”→Pd+Cu” 〔Example〕 Next, the present invention will be explained with reference to the drawings.
第１図乃至第第７図は本発明の一実施例を工程順に説明
するための断面図である。FIGS. 1 to 7 are cross-sectional views for explaining an embodiment of the present invention in the order of steps.
先ず、第１図のようにガラス繊維強化エポキシ樹脂系の
ｆＩ！！縁仮１の表面にゴム系接着剤層２を形成した印
刷配線基板１０を用意する。そして、第２図のようにこ
の表面にエポキシ樹脂系紫外線硬化型めっきレジスト３
をスクリーン印刷で逆版に印刷し、紫外線を照射して完
全硬化させる。First, as shown in Figure 1, fI of glass fiber reinforced epoxy resin system! ! A printed wiring board 10 having a rubber adhesive layer 2 formed on the surface of a border 1 is prepared. Then, as shown in Figure 2, an epoxy resin-based ultraviolet curing type plating resist 3 is applied to this surface.
is printed onto a reverse plate using screen printing, and is completely cured by irradiating it with ultraviolet light.
次いで、第３図のように印刷配線基板１０に貫通孔４を
開設した後、これを液温４０℃のクロム酸−硫酸混液に
１５分間浸漬し、貫通孔４の壁面及び接着剤層２の表面
を化学的に親水化する。Next, as shown in FIG. 3, after opening a through hole 4 in the printed wiring board 10, it is immersed in a chromic acid-sulfuric acid mixture at a liquid temperature of 40° C. for 15 minutes, so that the wall surface of the through hole 4 and the adhesive layer 2 are coated. Chemically make the surface hydrophilic.
そして、亜硫酸水素ナトリウム水溶液に３分間浸漬し、
貫通孔４の表面及び接着剤層２の表面のクロムイオン（
６価）を中和し、無毒化する。Then, immerse it in a sodium bisulfite aqueous solution for 3 minutes,
Chromium ions (
(hexavalent) and detoxifies it.
続いて、第４図のように水洗後、銅−ゼラチンコロイド
を含むＰＨ５，５，液温２−５℃の水溶液に３分間浸漬
し、貫通孔４の壁面及びめっきレジスト３の表面及び接
着剤層２の表面に夫々銅コロイド膜５を形成する。Subsequently, as shown in FIG. 4, after washing with water, the wall surface of the through hole 4, the surface of the plating resist 3, and the adhesive were immersed for 3 minutes in an aqueous solution containing copper-gelatin colloid with a pH of 5.5 and a temperature of 2 to 5 degrees Celsius. A copper colloid film 5 is formed on each surface of the layer 2.
次に、第５図のように、めっきレジスト３０表面に吸着
形成された銅コロイド膜５をスポンジ７使用して水洗研
廖してこれを除去する。Next, as shown in FIG. 5, the copper colloid film 5 adsorbed and formed on the surface of the plating resist 30 is removed by washing and polishing using a sponge 7.
更に、水洗後、塩化パラジウム０．０５ｇ／ ｌ−（パ
ラジウムイオンとして０．０３ｇ／β）、ＰＨ１，５の
パラジウムイオン水溶液に約３０秒間浸漬し、第６図の
ように銅コロイド膜５の表面にパラジウム金属６を置換
反応で形成させこれを増感する。Furthermore, after washing with water, the surface of the copper colloid film 5 was immersed for about 30 seconds in a palladium ion aqueous solution containing 0.05 g/l of palladium chloride (0.03 g/β as palladium ions) and pH 1.5, as shown in FIG. Palladium metal 6 is formed by a substitution reaction, and this is sensitized.
次いで、水洗後、液温７０℃、ＰＨ１２，０の無電解銅
めっき液に浸漬し、第７図のように厚さ約３０ミクロン
の無電解銅めっき膜で増感した面に導電回路７．８を形
成し、印刷配線板を完成する。Next, after washing with water, the conductive circuit 7 is immersed in an electroless copper plating solution with a temperature of 70° C. and a pH of 12.0, and a conductive circuit 7. 8 to complete the printed wiring board.
このようにして製造した印刷配線板を４０°Ｃ１相対湿
度９５％の雰囲気中に９６時間放置したが、導電回路７
間の電気絶縁抵抗は１０１０Ω以上の高絶縁性を示し、
また１通孔４の導電回路７にもピンホール、ボイド等の
欠陥は観察されなかった。The printed wiring board manufactured in this way was left in an atmosphere of 40°C and 95% relative humidity for 96 hours, but the conductive circuit 7
The electrical insulation resistance between the two shows high insulation properties of 1010Ω or more,
Furthermore, no defects such as pinholes or voids were observed in the conductive circuit 7 of the single hole 4.
なお、前記実施例におけるパラジウムイオン水溶液とし
て塩化パラジウムＯ，０１ｇ／ ｅ （パラジウムイオ
ンとして０．００６ｇ＃り 、 ＰＨ１，８のパラジ
ウムイオン水溶液を使用してもよい。この方法によって
も導電回路間の電気絶縁性は高絶縁性を示し、かつピン
ホールやボイド等の欠陥は観察されていない。Note that an aqueous palladium ion solution containing palladium chloride O,01 g/e (0.006 g/e as palladium ions and a pH of 1.8) may also be used as the palladium ion aqueous solution in the above examples. The insulation showed high insulation properties, and no defects such as pinholes or voids were observed.
ここで、この実施例においては、パラジウム金属は貫通
孔の壁面及び回路部分のみに形成されており、４電回路
形成後、導電回路間には銅コロイドもパラジウム金属も
残存していないので、製造された印刷配線基板は高湿度
雰囲気中でも導電回路間の絶縁性の劣化が従来技術より
小さくなる。In this example, palladium metal is formed only on the wall surface of the through hole and the circuit part, and after the formation of the four electric circuits, neither copper colloid nor palladium metal remains between the conductive circuits. The resulting printed wiring board exhibits less deterioration in insulation between conductive circuits than in the prior art even in a high-humidity atmosphere.
以上説明したように本発明は、無電解銅めっきの増悪を
銅コロイドとパラジウムイオンの置換めっき反応によっ
て選択的に行った後、無電解銅めっきで導電回路を付加
的に形成しているので、製造される印刷配線板の導電回
路間の電気絶縁性は高湿度雰囲気中でも高絶縁性を保持
することができ、また印刷配線板の貫通孔の４電回路に
ピンホール、ボイドが生じることなくその信頼性を向上
することができる。As explained above, in the present invention, after selectively deteriorating electroless copper plating by a displacement plating reaction of copper colloid and palladium ions, a conductive circuit is additionally formed with electroless copper plating. The electrical insulation between the conductive circuits of the printed wiring board to be manufactured can maintain high insulation even in a high humidity atmosphere, and the four electrical circuits in the through holes of the printed wiring board can be completely sealed without pinholes or voids. Reliability can be improved.
第１図乃至第７図は本発明の一実施例を製造工程順に示
す断面図である。
ｌ・・・絶縁板、２・・・接着剤層、３・・・めっきレ
ジスト、４・・・貫通孔、５・・・銅コロイド膜、６・
・・パラジウム金属、７．８・・・導電回路、１０・・
・印刷配ｖ、ｉ基板。1 to 7 are cross-sectional views showing an embodiment of the present invention in the order of manufacturing steps. l... Insulating plate, 2... Adhesive layer, 3... Plating resist, 4... Through hole, 5... Copper colloid film, 6...
...Palladium metal, 7.8...Conductive circuit, 10...
・Printing distribution, i-board.
Claims (2)
程と、この絶縁板に必要に応じて貫通孔を開設した後、
絶縁板の表面及び貫通孔の壁面等の露呈面を親水化する
工程と、この絶縁板の露呈面に銅コロイド膜を形成する
工程と、この銅コロイド膜が形成された面をパラジウム
イオン水溶液に接触させ増感する工程と、この増感した
部分の面に無電解銅めっきして導電回路を形成する工程
とを含むことを特徴とする印刷配線板の製造方法。(1) After the process of reverse printing a plating resist on the surface of the insulating plate and opening through holes in this insulating plate as necessary,
A process of making the exposed surfaces such as the surface of the insulating plate and the walls of the through holes hydrophilic, a process of forming a copper colloid film on the exposed surface of this insulating plate, and a process of soaking the surface on which the copper colloid film is formed in an aqueous palladium ion solution. A method for manufacturing a printed wiring board, comprising the steps of contacting and sensitizing the sensitized portion, and forming a conductive circuit by electroless copper plating on the surface of the sensitized portion.
、硫酸パラジウムの酸性水溶液を使用してなる特許請求
の範囲第１項記載の印刷配線板の製造方法。(2) The method for producing a printed wiring board according to claim 1, wherein an acidic aqueous solution of palladium chloride or palladium sulfate is used as the palladium ion aqueous solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20134586A JPS6358890A (en) | 1986-08-29 | 1986-08-29 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20134586A JPS6358890A (en) | 1986-08-29 | 1986-08-29 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6358890A true JPS6358890A (en) | 1988-03-14 |
Family
ID=16439492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20134586A Pending JPS6358890A (en) | 1986-08-29 | 1986-08-29 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6358890A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02133989A (en) * | 1988-11-14 | 1990-05-23 | Ibiden Co Ltd | Manufacture of printed-wiring board |
| JPH04232278A (en) * | 1990-11-13 | 1992-08-20 | Internatl Business Mach Corp <Ibm> | Conditioning of substrate for electroless plating onto substrate |
| JPH04365877A (en) * | 1991-06-13 | 1992-12-17 | Ishihara Chem Co Ltd | Catalyst liquid for copper base material-selecting electroless plating |
| JPH04365876A (en) * | 1991-06-13 | 1992-12-17 | Ishihara Chem Co Ltd | Catalyst liquid for copper base selecting electroless plating |
| JP2017208372A (en) * | 2016-05-16 | 2017-11-24 | Dic株式会社 | Formation method of conductive pattern and manufacturing method of electronic device |
-
1986
- 1986-08-29 JP JP20134586A patent/JPS6358890A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02133989A (en) * | 1988-11-14 | 1990-05-23 | Ibiden Co Ltd | Manufacture of printed-wiring board |
| JPH04232278A (en) * | 1990-11-13 | 1992-08-20 | Internatl Business Mach Corp <Ibm> | Conditioning of substrate for electroless plating onto substrate |
| JPH04365877A (en) * | 1991-06-13 | 1992-12-17 | Ishihara Chem Co Ltd | Catalyst liquid for copper base material-selecting electroless plating |
| JPH04365876A (en) * | 1991-06-13 | 1992-12-17 | Ishihara Chem Co Ltd | Catalyst liquid for copper base selecting electroless plating |
| JP2017208372A (en) * | 2016-05-16 | 2017-11-24 | Dic株式会社 | Formation method of conductive pattern and manufacturing method of electronic device |
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