JPS6356389A - Processing head for laser beam machine - Google Patents
Processing head for laser beam machineInfo
- Publication number
- JPS6356389A JPS6356389A JP61197296A JP19729686A JPS6356389A JP S6356389 A JPS6356389 A JP S6356389A JP 61197296 A JP61197296 A JP 61197296A JP 19729686 A JP19729686 A JP 19729686A JP S6356389 A JPS6356389 A JP S6356389A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- assist gas
- processing head
- laser beam
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 25
- 238000010586 diagram Methods 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
ａ、産業上の利用分野
この発明はレーザ加工機の加工ヘッドに係り、更に詳細
には、薄板のガス切断においても、浮き上りを生じない
加工ヘッドに関するものである。DETAILED DESCRIPTION OF THE INVENTION a. Field of Industrial Application This invention relates to a processing head for a laser processing machine, and more particularly to a processing head that does not cause lifting even when gas cutting a thin plate.
ｂ、従来の技術
レーザビームにより被加工物を切断する場合、酸素等の
アシストガス（補助ガス）をレーザビームと同軸で噴出
させると、加工速度が著しく向上する。そのため、一般
に、このガス切断法が広く採用されている。しかし、被
加工物の厚さが薄くなると、被加工物がノズルに吸着さ
れる現象が生ずる。このようになると、レーザビームの
焦点位置が被加工物から外れ、一般に切断幅の増加、切
断面の不良等の問題が生ずる。この問題については従来
、有効な対策がなかった。b. Prior Art When cutting a workpiece with a laser beam, the processing speed can be significantly improved if an assist gas such as oxygen is ejected coaxially with the laser beam. Therefore, this gas cutting method is generally widely adopted. However, when the thickness of the workpiece becomes thinner, a phenomenon occurs in which the workpiece is attracted to the nozzle. In this case, the focal position of the laser beam is deviated from the workpiece, which generally causes problems such as an increase in the cutting width and a defective cut surface. Until now, there has been no effective countermeasure for this problem.
Ｃ９発明が解決しようとする問題点
前記のように、ガス切断法は加工速度が著しく向上する
が、被加工物が薄板の場合には吸着現象により浮き上り
、加工精度が低下するという問題がある。この吸着現象
は、概ね次のような理由により生ずるものである。これ
を第３図によって説明する。第３図（ａ）は従来のノズ
ルのアシストガスの流れを示す図で、図示のようにノズ
ル２３から噴出したガスの一部は、被加工物Ｗの孔から
下方へ流出すると共に、その残部は、被加工物Ｗの上面
で９０度以上曲げられ放射状に流出する。C9 Problems to be Solved by the Invention As mentioned above, the gas cutting method significantly improves the processing speed, but when the workpiece is a thin plate, it floats due to the adsorption phenomenon, reducing processing accuracy. . This adsorption phenomenon generally occurs for the following reasons. This will be explained with reference to FIG. FIG. 3(a) is a diagram showing the flow of assist gas in a conventional nozzle. As shown in the figure, part of the gas ejected from the nozzle 23 flows downward from the hole in the workpiece W, and the remaining part flows out from the hole in the workpiece W. is bent by 90 degrees or more on the upper surface of the workpiece W and flows out radially.
この場合、被加工物Ｗの表面上のアシストガスの圧力分
布は、同図（ｂ ）のようになり、孔の近くでは正圧に
なるが、孔から遠ざかるに従って急速に低下し、孔の中
心から半径１以上の部分では負圧になる。したがって、
全体としては、負圧部が多くなり、被加工物Ｗは上方向
へ吸引される。In this case, the pressure distribution of the assist gas on the surface of the workpiece W becomes as shown in the same figure (b), where the pressure becomes positive near the hole, but rapidly decreases as the distance from the hole increases, and the pressure distribution at the center of the hole becomes positive. Negative pressure occurs in areas with a radius of 1 or more. therefore,
Overall, the number of negative pressure parts increases, and the workpiece W is sucked upward.
薄板は一般に剛性が小さいので、第４図のように、一端
をクランプ装置１７により把持された被加工物Ｗは、ノ
ズル２３により吸引され、針山状の支持部材３１から浮
き上るようになる。Since thin plates generally have low rigidity, the workpiece W, whose one end is gripped by the clamp device 17, is sucked by the nozzle 23 and floats up from the needle-like support member 31, as shown in FIG.
この発明は、このような点に着目して案出されたもので
、ノズルから噴出したアシストガスを、別の気体流で包
囲し、正圧を保持させることにより、被加工物が薄板の
場合でも浮き上りを生じないレーザ加工機の加工ヘッド
を提供することを目的とするものである。This invention was devised by focusing on these points, and by surrounding the assist gas ejected from the nozzle with another gas flow and maintaining positive pressure, it is possible to However, the object of the present invention is to provide a processing head for a laser processing machine that does not cause lifting.
ｄ０問題を解決するだの手段
前記の目的を達成するために、この発明は、レーザビー
ムとアシストガスを放出するノズルの外部に、このノズ
ルから放出されるアシストガスを包囲して、中空筒状の
気体流を形成する環状のノズルを設けたことを構成の要
旨とするものである。Means for Solving the d0 Problem In order to achieve the above-mentioned object, the present invention provides a hollow cylindrical structure that surrounds the assist gas emitted from the nozzle and is provided outside the nozzle that emit the laser beam and the assist gas. The gist of the structure is that an annular nozzle is provided to form a gas flow of .
００作用
このように構成されているので、環状のノズルから噴出
される気体は、中空筒状の気体流（カーテン）を構成し
、その内部に噴出されたアシストガスが、被加工物の表
面に沿って放射状に流出することを制限する。このため
、気体流（カーテン）内は正圧に保持される。したがっ
て、被加工物が薄板の場合でも、吸着現象を生じないの
で、浮き上ることはなく、高精度の切断加工を行なうこ
とできる。00 Effect With this structure, the gas ejected from the annular nozzle forms a hollow cylindrical gas flow (curtain), and the assist gas ejected into the curtain hits the surface of the workpiece. restricting radial outflow along the line. Therefore, the inside of the gas flow (curtain) is maintained at a positive pressure. Therefore, even if the workpiece is a thin plate, no adsorption phenomenon occurs, so the workpiece does not float up, and highly accurate cutting can be performed.
ｆ、実施例
次に、この発明の実施例について図面に基づいて説明す
る。第２図は、この発明を実施したレーザ加工機の正面
図である。即ち、このレーザ加工機１は、数値制御装置
３．レーザビーム発生装置５、レーザビームの強度調整
装置７．レーザビーム９の反射鏡１１．加工ヘッド１３
．ベッド１５゜被加工物Ｗを把持するクランプ装置１７
等からなっている。被加工物Ｗは、前記の数値制御装置
３の指令により、レーザビームの方向（Ｚ軸）に垂直な
平面（Ｘ、Ｙ軸）に沿って移動制御され、加工ヘッド１
３から照射されるレーザビームにより加工される。f. Example Next, an example of the present invention will be described based on the drawings. FIG. 2 is a front view of a laser processing machine embodying the present invention. That is, this laser processing machine 1 includes a numerical control device 3. Laser beam generator 5, laser beam intensity adjustment device 7. Reflector 11 for laser beam 9. Processing head 13
．． Bed 15° Clamping device 17 that grips the workpiece W
It consists of etc. The workpiece W is controlled to move along a plane (X, Y axes) perpendicular to the direction of the laser beam (Z axis) according to commands from the numerical control device 3, and the processing head 1
Processing is performed using a laser beam irradiated from 3.
第１図に加工ヘッド１３の詳細を示しである。FIG. 1 shows details of the processing head 13.
加工ヘッド１３の上部には、集光レンズ１９が内蔵され
ており、側壁には、酸素等のアシストガスの供給口２１
が設けである。また、下端中央部には、レーザビーム９
及びアシストガスを放出するノズル２３が、取付けられ
ている。加工ヘッド１３の下端外周部には、前記ノズル
２３を包囲して、環状のノズル２５が押えボルト２７に
より取付けられており、この環状ノズル２５には、圧力
空気の供給口２９が設けである。加工ヘッド１３の下方
には、集光レンズ１９の焦点位置に、被加工物Ｗが、針
山状の支持部材３１上に支持されている。A condensing lens 19 is built in the upper part of the processing head 13, and a supply port 21 for assist gas such as oxygen is provided in the side wall.
is the provision. In addition, a laser beam 9 is provided at the center of the lower end.
and a nozzle 23 for emitting assist gas. An annular nozzle 25 is attached to the outer periphery of the lower end of the processing head 13 by a presser bolt 27, surrounding the nozzle 23, and this annular nozzle 25 is provided with a supply port 29 for pressurized air. Below the processing head 13 , a workpiece W is supported on a needle-like support member 31 at the focal point of a condensing lens 19 .
このような構成において、ノズル２３からレーザビーム
とアシストガスを放出し、同時に環状ノズルから圧力空
気を噴出すると、環状ノズルから噴出する円筒状の空気
流（カーテン）はアシストガスを包囲し、アシストガス
が被加工部Ｗの表面に沿って半径方向へ逸散することを
制限する。この場合の被加工物Ｗ上の圧力分布は、例え
ば同図（ｂ）のようになり、環状ノズルによる円筒状気
流の外部で、一部員圧を生ずるが、内部は正圧に保持さ
れ、全体として被加工物Ｗは、下方向へ押しつけられる
。したがって、被加工物が薄板の場合でも、吸着現象が
起らず、高精度の切断加工を行なうことができる。In such a configuration, when a laser beam and assist gas are emitted from the nozzle 23 and pressurized air is ejected from the annular nozzle at the same time, the cylindrical air flow (curtain) ejected from the annular nozzle surrounds the assist gas, and the assist gas is radially dissipating along the surface of the workpiece W. The pressure distribution on the workpiece W in this case is, for example, as shown in FIG. As a result, the workpiece W is pressed downward. Therefore, even when the workpiece is a thin plate, the adsorption phenomenon does not occur, and highly accurate cutting can be performed.
なお、この実施例は、例示的なもので、これに限定する
ものではなく、発明の技術的範囲において、異る態様に
おいても実施できるものである。It should be noted that this embodiment is an illustrative example, and is not intended to be limiting, and the present invention can be implemented in other embodiments within the technical scope of the invention.
ｇ０発明の効果
以上の説明から理解されるように、この発明は特許請求
の範囲に記載の構成を備えているので、レーザガス切断
において、被加工物が薄板の場合でも、吸着現象が起ら
ず、したがって、切断幅が小さく、また良好な切断面が
得られるレーザ加工機の加工ヘッドを提供することがで
きる。g0 Effects of the Invention As understood from the above explanation, this invention has the structure set forth in the claims, so that no adsorption phenomenon occurs during laser gas cutting even when the workpiece is a thin plate. Therefore, it is possible to provide a processing head for a laser processing machine that has a small cutting width and can obtain a good cutting surface.
第１図（ａ ）はこの発明の実施例の説面図、同じく（
ｂ）は被加工物上の圧力分布図、第２図はこの発明を実
施したレーザ加工機の正面図、第３図（ａ ）は従来の
加工ヘッドによるノズル部のアシストガスの流れ方向の
説明図、同じく（ｂ）は被加工物上の圧力分布図、第４
図は従来の加工ヘッドによる被加工物の浮き上りの説明
図である。
図中の同一符号は同−物又は相等物を表わす。
図面の主要な部分を表わす符号の説明
１・・・レーザ加工機
１３・・・加工ヘッド
２１・・・アシストガス供給口
２３・・・ノズル（レーザビーム、アシストガス用）２
５・・・環状ノズル
２９・・・圧力空気供給口
代理人 弁理士 三 好 保 男第１図（ａ）
圧
力
÷
第１図（ｂ）
第２図
エバ
力
士
↑
０−＼ζ
φ
第３図（ｂ）FIG. 1(a) is an explanatory diagram of an embodiment of the present invention;
b) is a pressure distribution diagram on a workpiece, Fig. 2 is a front view of a laser processing machine implementing the present invention, and Fig. 3(a) is an explanation of the flow direction of assist gas in the nozzle section by a conventional processing head. Similarly, (b) is a pressure distribution diagram on the workpiece, the fourth
The figure is an explanatory diagram of lifting of a workpiece by a conventional processing head. The same reference numerals in the figures represent the same or equivalent items. Explanation of symbols representing main parts of the drawings 1... Laser processing machine 13... Processing head 21... Assist gas supply port 23... Nozzle (for laser beam, assist gas) 2
5...Annular nozzle 29...Pressure air supply port Agent Yasuo Miyoshi, patent attorney Figure 1 (a) Pressure ÷ Figure 1 (b) Figure 2 Eva Sumo wrestler ↑ 0-\ζ φ Figure 3 (b)
Claims (1)
に、このノズルから放出されるアシストガスを包囲して
、中空筒状の気体流を形成する環状のノズルを設けてな
ることを特徴とするレーザ加工機の加工ヘッド。A laser processing machine characterized in that an annular nozzle that surrounds the assist gas emitted from the nozzle and forms a hollow cylindrical gas flow is provided outside the nozzle that emit the laser beam and the assist gas. processing head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61197296A JPS6356389A (en) | 1986-08-25 | 1986-08-25 | Processing head for laser beam machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61197296A JPS6356389A (en) | 1986-08-25 | 1986-08-25 | Processing head for laser beam machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6356389A true JPS6356389A (en) | 1988-03-10 |
Family
ID=16372100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61197296A Pending JPS6356389A (en) | 1986-08-25 | 1986-08-25 | Processing head for laser beam machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6356389A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02200392A (en) * | 1989-01-30 | 1990-08-08 | Nippondenso Co Ltd | Nozzle for laser beam machining and laser beam machining method |
| US5609781A (en) * | 1992-10-23 | 1997-03-11 | Mitsubishi Denki Kabushiki Kaisha | Machining head and laser machining apparatus |
| US6118097A (en) * | 1992-10-23 | 2000-09-12 | Mitsubishi Denki Kabushiki Kaisha | Machining head and laser machining apparatus |
| JP2009517216A (en) * | 2005-11-25 | 2009-04-30 | トルンプフ ヴェルクツォイクマシーネン ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト | Laser processing nozzle |
| WO2013015707A1 (en) * | 2011-07-27 | 2013-01-31 | Общество С Ограниченной Ответственностью "Научно-Техническое Объединение "Ирэ-Полюс" | Method for contact-free laser welding of sheet materials and extension to a laser head for implementing said method |
| JP2013052400A (en) * | 2011-09-01 | 2013-03-21 | Honda Motor Co Ltd | Laser beam machining method |
| US20150196974A1 (en) * | 2012-09-21 | 2015-07-16 | Trumpf Laser Gmbh | Laser Processing Head and Annular Nozzle for a Laser Processing Head |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5823590A (en) * | 1981-08-01 | 1983-02-12 | アマダ エンジニアリング アンド サ−ビス カンパニ− インコ−ポレ−テツド | Laser processing method and processing head device used for said method |
| JPS58212888A (en) * | 1982-06-03 | 1983-12-10 | Mitsubishi Heavy Ind Ltd | Laser welding method |
| JPS619990A (en) * | 1984-06-26 | 1986-01-17 | Matsushita Electric Ind Co Ltd | Laser beam machining device |
-
1986
- 1986-08-25 JP JP61197296A patent/JPS6356389A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5823590A (en) * | 1981-08-01 | 1983-02-12 | アマダ エンジニアリング アンド サ−ビス カンパニ− インコ−ポレ−テツド | Laser processing method and processing head device used for said method |
| JPS58212888A (en) * | 1982-06-03 | 1983-12-10 | Mitsubishi Heavy Ind Ltd | Laser welding method |
| JPS619990A (en) * | 1984-06-26 | 1986-01-17 | Matsushita Electric Ind Co Ltd | Laser beam machining device |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02200392A (en) * | 1989-01-30 | 1990-08-08 | Nippondenso Co Ltd | Nozzle for laser beam machining and laser beam machining method |
| US5609781A (en) * | 1992-10-23 | 1997-03-11 | Mitsubishi Denki Kabushiki Kaisha | Machining head and laser machining apparatus |
| US6118097A (en) * | 1992-10-23 | 2000-09-12 | Mitsubishi Denki Kabushiki Kaisha | Machining head and laser machining apparatus |
| US6288363B1 (en) | 1992-10-23 | 2001-09-11 | Mitsubishi Denki Kabushiki Kaisha | Machining head and laser machining apparatus |
| JP2009517216A (en) * | 2005-11-25 | 2009-04-30 | トルンプフ ヴェルクツォイクマシーネン ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト | Laser processing nozzle |
| US8188403B2 (en) | 2005-11-25 | 2012-05-29 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Nozzle for a laser machining device |
| WO2013015707A1 (en) * | 2011-07-27 | 2013-01-31 | Общество С Ограниченной Ответственностью "Научно-Техническое Объединение "Ирэ-Полюс" | Method for contact-free laser welding of sheet materials and extension to a laser head for implementing said method |
| JP2013052400A (en) * | 2011-09-01 | 2013-03-21 | Honda Motor Co Ltd | Laser beam machining method |
| US20150196974A1 (en) * | 2012-09-21 | 2015-07-16 | Trumpf Laser Gmbh | Laser Processing Head and Annular Nozzle for a Laser Processing Head |
| US9969029B2 (en) * | 2012-09-21 | 2018-05-15 | Trumpf Laser Gmbh | Laser processing head and annular nozzle for a laser processing head |
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