JPS6355696B2 - - Google Patents
Info
- Publication number
- JPS6355696B2 JPS6355696B2 JP54147623A JP14762379A JPS6355696B2 JP S6355696 B2 JPS6355696 B2 JP S6355696B2 JP 54147623 A JP54147623 A JP 54147623A JP 14762379 A JP14762379 A JP 14762379A JP S6355696 B2 JPS6355696 B2 JP S6355696B2
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- exposure
- jig
- manufacturing
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000007747 plating Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 11
- 239000012190 activator Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Description
【発明の詳細な説明】
本発明はプリント板の製造方法に関し、特に孔
または凹部が形成されたプリント板基材の感光性
材料を施し、これにプリント板基材に対しほぼ垂
直な平行光線を用いて所要パターンを焼き付ける
工程を含むプリント板の製造方法における焼付け
露光方法の改良に係るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a printed board, and in particular, a method of manufacturing a printed board, in which a photosensitive material of a printed board substrate in which holes or recesses are formed is applied, and parallel light rays substantially perpendicular to the printed board substrate are applied to the photosensitive material. The present invention relates to an improvement in a printing exposure method in a printed board manufacturing method including a step of printing a required pattern using the present invention.
上記のようなパターン焼付け露光工程を含むプ
リント板製造方法の一例として、アデイテイブ法
において感光性のメツキ活性付与剤を使用する場
合などが挙げられる。すなわち、アデイテイブ法
はプリント板の絶縁基板上に所要の導体部分のみ
銅メツキで形成する方法であるが、この場合にプ
リント板基材の銅メツキすべき部分をメツキ活性
化してやる必要がある。メツキ活性化の手段とし
ては種々の方法があるが、その一例として感光性
のメツキ活性付与剤を用いる方法がある。これは
メツキ活性付与剤をプリント板基材の全面に施し
ておき、これに露光マスクを用いて所要パターン
の焼付け露光を行ない、銅メツキすべき部分のみ
をメツキ活性化するものである。 An example of a printed board manufacturing method including the above-described pattern baking and exposure process includes the use of a photosensitive plating activator in an additive method. That is, the additive method is a method in which only the required conductor portions are formed on the insulating substrate of the printed board by copper plating, but in this case, it is necessary to activate the plating of the portions of the printed board base material to be copper plated. There are various methods for plating activation, one example of which is a method using a photosensitive plating activator. In this method, a plating activator is applied to the entire surface of a printed board substrate, and then a required pattern is printed and exposed using an exposure mask to activate plating only on the areas to be plated with copper.
しかるに、このような焼付け露光工程を含むプ
リント板製造方法には以下のような問題がある。
すなわち、パターン焼付け露光においてはパター
ン精度の点からプリント板基材の表面に対してほ
ぼ垂直な平行光線を用いることが望ましいが、こ
れではプリント板基材に孔または凹部が形成され
ている場合にこれらの孔または凹部の殊に焼付け
光線と平行な内周面の露光が極めて困難である。 However, the printed board manufacturing method including such a baking/exposure process has the following problems.
In other words, in pattern printing exposure, it is desirable to use parallel light rays that are almost perpendicular to the surface of the printed board substrate from the point of view of pattern accuracy, but this does not work well when holes or recesses are formed in the printed board substrate. It is extremely difficult to expose the inner peripheral surfaces of these holes or recesses, especially those parallel to the printing beam.
従つて本発明の目的は、上述したようなプリン
ト板製造方法における従来の問題を解消するこ
と、具体的にはプリント板基材に対してほぼ垂直
な平行光線を用いてプリント板基材の孔または凹
部の内表面を良好に露光し得る方法を提供するこ
とにある。 Therefore, an object of the present invention is to solve the conventional problems in the printed board manufacturing method as described above, and specifically, to form holes in a printed board base material using parallel light rays that are substantially perpendicular to the printed board base material. Another object of the present invention is to provide a method that can satisfactorily expose the inner surface of a recess.
本発明は、焼付け露光に際して補助的に露光治
具を使用することにより上記目的の実現を図つた
ものであり、概略的にはプリント板の孔または凹
部と対応する部分に光拡散面が形成された露光治
具をプリント板基材に添え当てゝ焼付け露光を行
なうことを要旨とするものである。 The present invention aims to achieve the above object by using an auxiliary exposure jig during printing exposure, and roughly speaking, a light diffusing surface is formed in a portion corresponding to a hole or a recess of a printed board. The gist of this method is to apply a printed exposure jig to a printed board base material and perform printing exposure.
以下、本発明につき実施例にもとづいて図面を
参照し詳細に説明する。 Hereinafter, the present invention will be described in detail based on embodiments with reference to the drawings.
第１図は本発明によるプリント板基材へのパタ
ーン焼付け露光方法の第１実施例を示す図であ
り、図において符号１がプリント板の絶縁基材
（以下、単に「基材」と略記）を示す。基材１に
はスルーホール２が孔明けされ、かつ全表面に感
光性のメツキ活性付与剤が施されている。メツキ
活性付与剤３に所要パターンを焼付け露光するこ
とにより露光部分がメツキ活性化され、これに銅
メツキ（無電解ないし電解）を施すことにより所
要の導体パターン（配線部、ランド、およびスル
ーホールメツキを含む）が形成される。パターン
焼付け露光は片面ずつ行なわれ、例えば基材１の
上面に露光マスク４を重ね合わせ、紫外線または
レーザー光線等の平行光線５（矢印で示す）を基
材１の表面に対しほぼ垂直に照射して行なわれ
る。この場合、基材１の上面の露光マスク４で覆
われていない部分は焼付け光線５によつて直接露
光されるが、焼付け光線５とほぼ平行なスルーホ
ール２の内周面は直接露光されないことになる。
このため本発明の方法では、更に露光治具が補助
的に使用される。 FIG. 1 is a diagram showing a first embodiment of the method of printing and exposing a pattern on a printed board base material according to the present invention, and in the figure, reference numeral 1 is an insulating base material of a printed board (hereinafter simply abbreviated as "base material"). shows. A through hole 2 is formed in the base material 1, and a photosensitive plating activator is applied to the entire surface. By baking a required pattern onto the plating activation agent 3 and exposing it to light, the exposed area is activated for plating, and by applying copper plating (electroless or electrolytic) to this, the required conductor pattern (wiring portion, land, and through-hole plating) is activated. ) is formed. Pattern printing exposure is carried out on one side at a time. For example, an exposure mask 4 is placed on the top surface of the base material 1, and parallel light rays 5 (indicated by arrows) such as ultraviolet rays or laser beams are irradiated almost perpendicularly to the surface of the base material 1. It is done. In this case, the portion of the upper surface of the substrate 1 that is not covered by the exposure mask 4 is directly exposed to the printing light beam 5, but the inner peripheral surface of the through hole 2, which is approximately parallel to the printing light beam 5, is not directly exposed. become.
Therefore, in the method of the present invention, an exposure jig is additionally used.
第１図の例では、露光治具１０は基材１の下面
すなわち焼付け光線５の入射側とは反対側に添え
当てゝ用いる。この治具１０は光反射型であり、
板状素材の上面に基材１の各スルーホール２と対
応させて凹状の光拡散反射面１０ａが形成されて
いる。この方法によれば、スルーホール２内に入
射した光線５が治具１０の反射面１０ａで拡散反
射し、この拡散反射光によつてスルーホール内周
面が間接露光されることになる。 In the example shown in FIG. 1, the exposure jig 10 is placed against the lower surface of the substrate 1, that is, the side opposite to the side on which the printing light beam 5 is incident. This jig 10 is a light reflective type,
A concave light diffusing and reflecting surface 10a is formed on the upper surface of the plate-like material in correspondence with each through hole 2 of the base material 1. According to this method, the light beam 5 entering the through hole 2 is diffusely reflected by the reflecting surface 10a of the jig 10, and the inner peripheral surface of the through hole is indirectly exposed by this diffusely reflected light.
尚、治具１０は、例えばステンレス板等の素材
に光拡散反射面を例えばプレス成形することによ
り非常に簡単に製作できる。また、その他のガラ
スやプラスチツクなどの適当な素材を用い、これ
に適当な方法で凹面を形成し、鏡面仕上げして作
ることもできる。 The jig 10 can be manufactured very easily by, for example, press-molding a light diffusing and reflecting surface on a material such as a stainless steel plate. Alternatively, it can also be made from other suitable materials such as glass or plastic, by forming a concave surface using an appropriate method and finishing it with a mirror finish.
第２図は上述した光反射型露光治具の変形例を
示す。すなわち、第１図に示す治具１０は光拡散
反射面１０ａが凹面であるのに対し、第２図に示
す治具１１はその反射面１１ａを全体的に粗面化
して光拡散反射作用が得られるようにしたもので
ある。この治具１１もまた、金属やガラス、プラ
スチツク、あるいはその他の適当な素材に粗面化
加工を施し、必要ならば鏡面処理を施すことによ
り比較的簡単に製作できる。尚、図示例では反射
面１１ａが全体的に粗面化されているが、その必
要はなく、スルーホール２と対応する部分だけを
粗面化すれば足りる。しかし、加工上は多数の面
積の小さな部分を個別的に粗面化するよりは全面
を一括的に粗面化加工する方が有利な場合が多
い。 FIG. 2 shows a modification of the above-mentioned light reflection type exposure jig. That is, while the jig 10 shown in FIG. 1 has a concave light diffusing and reflecting surface 10a, the jig 11 shown in FIG. It was made so that it could be obtained. This jig 11 can also be manufactured relatively easily by roughening metal, glass, plastic, or any other suitable material and, if necessary, mirror-finishing it. In the illustrated example, the reflecting surface 11a is entirely roughened, but this is not necessary, and it is sufficient to roughen only the portion corresponding to the through hole 2. However, in terms of processing, it is often more advantageous to roughen the entire surface at once rather than individually roughening many small areas.
本発明によるパターン焼付け露光方法の第２実
施例を第３図に示してある。この例は、露光方法
の基本的部分は前述した第１実施例の場合と同様
であるが、露光治具１２の構成およびその使い方
が異なる。すなわち、治具１２は、透明な板状素
材の下面に各スルーホール２と対応させて凸状の
光拡散透過面１２ａを形成した光透過型のもので
あり、第１実施例の場合とは逆に基材１の上面す
なわち焼付け光線５の入射側に添え当てゝ用い
る。この場合は、基材１の上面は治具１２を透過
した平行光線によつて露光され、一方、光拡散透
過面１２ａを透過した光線は図示の如くスルーホ
ール２内で拡散し、この拡散透過光によつてスル
ーホール内周面が露光されることになる。この場
合は両面同時焼付けの出来る利点がある。尚治具
１２は、例えばガラスやプラスチツクなどの透明
材料をモールド成形することにより比較的容易に
製作できる。また、図示してないが、光拡散透過
面１３ａを図示の如く球面ではなく、フレネルレ
ンズ状に形成することもできる。 A second embodiment of the pattern printing exposure method according to the present invention is shown in FIG. In this example, the basic part of the exposure method is the same as that of the first embodiment described above, but the configuration of the exposure jig 12 and how to use it are different. That is, the jig 12 is of a light transmission type in which a convex light diffusion and transmission surface 12a is formed on the lower surface of a transparent plate-like material in correspondence with each through hole 2, and is different from the case of the first embodiment. On the contrary, it is applied to the upper surface of the substrate 1, that is, the side on which the printing light beam 5 is incident. In this case, the upper surface of the base material 1 is exposed to the parallel light beams that have passed through the jig 12, while the light beams that have passed through the light diffusing and transmitting surface 12a are diffused within the through holes 2 as shown in the figure, and this diffused transmission The inner peripheral surface of the through hole is exposed to the light. In this case, there is an advantage that both sides can be printed simultaneously. The jig 12 can be relatively easily manufactured by molding a transparent material such as glass or plastic. Further, although not shown, the light diffusing and transmitting surface 13a may be formed into a Fresnel lens shape instead of a spherical surface as shown.
第４図は上述した光透過型露光治具の変形例を
示す。すなわち、第３図に示す治具１２の光拡散
透過面１２ａが凸面であるのに対し、第４図に示
す治具１３はスルーホール２と対応する透過面１
３ａを粗面化して光拡散作用が得られるようにし
たものである。尚、第４図の治具１３の場合は、
粗面化は透過面１３ａに限定しなければならな
い。なぜなら、もし下面全体を粗面化すると、ス
ルーホール２以外の部分への焼付け光線が拡散し
てパターン精度に悪影響を及ぼすからである。 FIG. 4 shows a modification of the above-mentioned light transmission type exposure jig. That is, while the light diffusing and transmitting surface 12a of the jig 12 shown in FIG. 3 is a convex surface, the jig 13 shown in FIG.
3a has a roughened surface so that a light diffusing effect can be obtained. In addition, in the case of the jig 13 in Fig. 4,
The roughening must be limited to the transparent surface 13a. This is because, if the entire lower surface is roughened, the printing light beam will be diffused to areas other than the through-holes 2, which will have an adverse effect on pattern accuracy.
以上に説明したように、本発明の方法は、簡単
な露光治具を使用することによつてプリント板基
材の孔または凹部の内面を確実に露光することを
可能とするものであり、プリント板の製造におい
て実用性の高いすぐれた方法である。 As explained above, the method of the present invention makes it possible to reliably expose the inner surface of a hole or recess in a printed board substrate by using a simple exposure jig, and it is possible to This is an excellent and highly practical method for manufacturing plates.
尚、以上に説明した実施例はアデイテイブ法に
よるプリント板の製造におけるメツキ活性付与剤
へのパターン焼付け露光に適用した場合である
が、本発明はこれに限定されず、その他の種々の
用途、例えばスルーホール内のメツキレジストの
露光等にも適用可能である。 Although the embodiments described above are applied to pattern baking exposure of a plating activator in the production of printed boards by an additive method, the present invention is not limited thereto, and can be applied to various other applications, such as It can also be applied to exposure of plating resist inside through holes.
第１図は本発明によるプリント板基材へのパタ
ーン焼付け露光方法の第１実施例を示す図、第２
図は本発明による光反射型露光治具の変形例を示
す図、第３図は本発明によるパターン焼付け露光
方法の第２実施例を示す図、第４図は本発明によ
る光透過型露光治具の変形例を示す図。
１……プリント板基材、２……スルーホール、
３……メツキ活性付与剤、４……露光マスク、５
……焼付け光線、１０，１１，１２，１３……露
光治具、１０ａ，１１ａ……光拡散反射面、１２
ａ，１３ａ……光拡散透過面。
FIG. 1 is a diagram showing a first embodiment of the pattern printing exposure method on a printed board substrate according to the present invention, and FIG.
The figure shows a modification of the light reflection type exposure jig according to the invention, FIG. 3 shows a second embodiment of the pattern baking exposure method according to the invention, and FIG. 4 shows a light transmission type exposure jig according to the invention. The figure which shows the modification of a tool. 1...Printed board base material, 2...Through hole,
3...Metting activator, 4...Exposure mask, 5
...Printing light beam, 10, 11, 12, 13...Exposure jig, 10a, 11a...Light diffusing and reflecting surface, 12
a, 13a... Light diffusing and transmitting surface.
Claims (1)
感光性材料を施し、これにプリント板基材の表面
に対しほぼ垂直な平行光線を用いて所要パターン
を焼き付ける工程を含むプリント板の製造方法に
おいて、プリント板の孔または凹部と対応する部
分に光拡散面が形成された露光治具をプリント板
基材に添え当てゝ焼付け露光を行なうことを特徴
とするプリント板の製造方法。 ２ 前記露光治具の光拡散面を反射面として形成
し、焼付け露光時に該露光治具をプリント板基材
の焼付け光入射側と反対側に配置する特許請求の
範囲第１項記載のプリント板の製造方法。 ３ 前記光拡散反射面が凹面である特許請求の範
囲第２項記載のプリント板の製造方法。 ４ 前記光拡散反射面が粗面である特許請求の範
囲第２項記載のプリント板の製造方法。 ５ 前記露光治具の光拡散面を透過面として形成
し、焼付け露光時に該露光治具をプリント板基材
の焼付け光入射側に配置する特許請求の範囲第１
項記載のプリント板の製造方法。 ６ 前記光拡散透過面が凸面である特許請求の範
囲第５項記載のプリント板の製造方法。 ７ 前記光拡散透過面が粗面である特許請求の範
囲第５項記載のプリント板の製造方法。[Claims] 1. Includes the step of applying a photosensitive material to a printed board base material in which holes or recesses are formed, and printing a desired pattern thereon using parallel light rays substantially perpendicular to the surface of the printed board base material. A method for manufacturing a printed board, characterized in that an exposure jig, in which a light diffusing surface is formed in a portion corresponding to a hole or a recess of the printed board, is attached to a printed board base material to perform baking exposure. Method. 2. The printed board according to claim 1, wherein the light-diffusing surface of the exposure jig is formed as a reflective surface, and the exposure jig is disposed on the side opposite to the baking light incident side of the printed board base material during printing exposure. manufacturing method. 3. The method of manufacturing a printed board according to claim 2, wherein the light diffusing and reflecting surface is a concave surface. 4. The method of manufacturing a printed board according to claim 2, wherein the light diffusing and reflecting surface is a rough surface. 5. The light diffusing surface of the exposure jig is formed as a transmission surface, and the exposure jig is arranged on the printing light incident side of the printed board base material during printing exposure.
2. Method for manufacturing a printed board as described in Section 1. 6. The method of manufacturing a printed board according to claim 5, wherein the light diffusing and transmitting surface is a convex surface. 7. The method of manufacturing a printed board according to claim 5, wherein the light diffusing and transmitting surface is a rough surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14762379A JPS5671993A (en) | 1979-11-16 | 1979-11-16 | Method of manufacturing printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14762379A JPS5671993A (en) | 1979-11-16 | 1979-11-16 | Method of manufacturing printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5671993A JPS5671993A (en) | 1981-06-15 |
| JPS6355696B2 true JPS6355696B2 (en) | 1988-11-04 |
Family
ID=15434505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14762379A Granted JPS5671993A (en) | 1979-11-16 | 1979-11-16 | Method of manufacturing printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5671993A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6340157A (en) * | 1986-08-06 | 1988-02-20 | Mitsubishi Electric Corp | Exposing machine |
| JP2648100B2 (en) * | 1994-07-29 | 1997-08-27 | 富山日本電気株式会社 | Manufacturing method of printed wiring board |
| JP2006351770A (en) * | 2005-06-15 | 2006-12-28 | Fujikura Ltd | Wiring substrate and its manufacturing method |
-
1979
- 1979-11-16 JP JP14762379A patent/JPS5671993A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5671993A (en) | 1981-06-15 |
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