JPS6354467A - Antistatic thermoplastic resin composition - Google Patents
Antistatic thermoplastic resin compositionInfo
- Publication number
- JPS6354467A JPS6354467A JP61196858A JP19685886A JPS6354467A JP S6354467 A JPS6354467 A JP S6354467A JP 61196858 A JP61196858 A JP 61196858A JP 19685886 A JP19685886 A JP 19685886A JP S6354467 A JPS6354467 A JP S6354467A
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- antistatic
- resin composition
- monomer unit
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 29
- 239000011342 resin composition Substances 0.000 title claims description 12
- 239000000178 monomer Substances 0.000 claims abstract description 34
- 229920001577 copolymer Polymers 0.000 claims abstract description 17
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 7
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 7
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 claims abstract description 6
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims abstract 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract 2
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 239000004793 Polystyrene Substances 0.000 claims description 5
- 229920002223 polystyrene Polymers 0.000 claims description 5
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 claims description 4
- 239000004800 polyvinyl chloride Substances 0.000 claims description 4
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 150000007522 mineralic acids Chemical class 0.000 claims 2
- 150000007524 organic acids Chemical group 0.000 claims 2
- 150000001450 anions Chemical class 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract description 6
- 239000002253 acid Substances 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 abstract 1
- 238000007786 electrostatic charging Methods 0.000 abstract 1
- 230000002085 persistent effect Effects 0.000 abstract 1
- 150000003242 quaternary ammonium salts Chemical group 0.000 abstract 1
- -1 polyethylene Polymers 0.000 description 12
- 229920005601 base polymer Polymers 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000002216 antistatic agent Substances 0.000 description 9
- 230000000704 physical effect Effects 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000008188 pellet Substances 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000009864 tensile test Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920005990 polystyrene resin Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- SJIXRGNQPBQWMK-UHFFFAOYSA-N 2-(diethylamino)ethyl 2-methylprop-2-enoate Chemical compound CCN(CC)CCOC(=O)C(C)=C SJIXRGNQPBQWMK-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000008051 alkyl sulfates Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- VAYGXNSJCAHWJZ-UHFFFAOYSA-N dimethyl sulfate Chemical compound COS(=O)(=O)OC VAYGXNSJCAHWJZ-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 150000003459 sulfonic acid esters Chemical class 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 239000004753 textile Substances 0.000 description 2
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- VKDHHIOILCFABI-UHFFFAOYSA-N 2-(2,2-dihydroxyethylamino)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCNCC(O)O VKDHHIOILCFABI-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- QHVBLSNVXDSMEB-UHFFFAOYSA-N 2-(diethylamino)ethyl prop-2-enoate Chemical compound CCN(CC)CCOC(=O)C=C QHVBLSNVXDSMEB-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 1
- OAKUJYMZERNLLT-UHFFFAOYSA-N 4-(dimethylamino)butyl 2-methylprop-2-enoate Chemical compound CN(C)CCCCOC(=O)C(C)=C OAKUJYMZERNLLT-UHFFFAOYSA-N 0.000 description 1
- LEOJISUPFSWNMA-UHFFFAOYSA-N ABEI Chemical compound O=C1NNC(=O)C=2C1=CC(N(CCCCN)CC)=CC=2 LEOJISUPFSWNMA-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 241000894006 Bacteria Species 0.000 description 1
- OWNRRUFOJXFKCU-UHFFFAOYSA-N Bromadiolone Chemical compound C=1C=C(C=2C=CC(Br)=CC=2)C=CC=1C(O)CC(C=1C(OC2=CC=CC=C2C=1O)=O)C1=CC=CC=C1 OWNRRUFOJXFKCU-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- RJFAYQIBOAGBLC-BYPYZUCNSA-N Selenium-L-methionine Chemical compound C[Se]CC[C@H](N)C(O)=O RJFAYQIBOAGBLC-BYPYZUCNSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 125000006177 alkyl benzyl group Chemical group 0.000 description 1
- 150000001347 alkyl bromides Chemical class 0.000 description 1
- 150000001348 alkyl chlorides Chemical class 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 150000005524 benzylchlorides Chemical class 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- KVNRLNFWIYMESJ-UHFFFAOYSA-N butyronitrile Chemical compound CCCC#N KVNRLNFWIYMESJ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- DENRZWYUOJLTMF-UHFFFAOYSA-N diethyl sulfate Chemical compound CCOS(=O)(=O)OCC DENRZWYUOJLTMF-UHFFFAOYSA-N 0.000 description 1
- 229940008406 diethyl sulfate Drugs 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- MYWUZJCMWCOHBA-VIFPVBQESA-N methamphetamine Chemical compound CN[C@@H](C)CC1=CC=CC=C1 MYWUZJCMWCOHBA-VIFPVBQESA-N 0.000 description 1
- VUQUOGPMUUJORT-UHFFFAOYSA-N methyl 4-methylbenzenesulfonate Chemical compound COS(=O)(=O)C1=CC=C(C)C=C1 VUQUOGPMUUJORT-UHFFFAOYSA-N 0.000 description 1
- CZXGXYBOQYQXQD-UHFFFAOYSA-N methyl benzenesulfonate Chemical compound COS(=O)(=O)C1=CC=CC=C1 CZXGXYBOQYQXQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- MBABOKRGFJTBAE-UHFFFAOYSA-N methyl methanesulfonate Chemical compound COS(C)(=O)=O MBABOKRGFJTBAE-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- KZCOBXFFBQJQHH-UHFFFAOYSA-N octane-1-thiol Chemical compound CCCCCCCCS KZCOBXFFBQJQHH-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は良好且つ恒久的な帯電防止性を有する熱可塑性
Ｓ脂組酸物に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a thermoplastic S-lipid composite acid having good and permanent antistatic properties.
−ｆｆに１ラスチツクスは電気抵抗値が大きく、摩擦、
剥離等によって容易に帯電し易く、ごみや埃を吸引して
外観を損ねる等成形品、フィルム、シート、＃Ｊ！維等
の分野で様々なトラブルの原因となっている。-ff 1 Lastics has a large electrical resistance value, friction,
Molded products, films, sheets, etc. that easily become electrostatically charged due to peeling, attract dirt and dust, and damage the appearance. #J! This is the cause of various troubles in fields such as textiles.
プラスチックスに訓電性を付与するには一般的に
ｔ帯電防止剤の内部練り込み法
２帯電防止剤の表面塗布法
の二種の方法がもちいられてｒる。他にもシリコン系化
合物の表面ｍ商法、又はプラスチックス表面構造の改質
、すなわちプラズマ処理等があるが、いずれも高価なも
のとなる。Generally, two methods are used to impart electrostatic properties to plastics: (1) internal kneading of an antistatic agent, (2) surface coating of an antistatic agent. There are other methods, such as a surface treatment method for silicon-based compounds or modification of the surface structure of plastics, that is, plasma treatment, but both are expensive.
帯電防止剤の内部練り込み法は、一般的に低分子の界面
活性剤が用いられるが、この方法では恒久的な帯電防止
性を付与することが困難であり、表面に存在する帯電防
止剤を水洗、摩擦等の手段で除いてしまうと制電性が失
われてしまう、又、特開昭５５−５６２３７号公報で見
られる様に制電性ゴムを用いる方法があるが。In the internal kneading method of antistatic agents, low-molecular-weight surfactants are generally used, but it is difficult to provide permanent antistatic properties with this method, and the antistatic agent present on the surface is If it is removed by means such as washing with water or rubbing, the antistatic property will be lost.Also, there is a method of using antistatic rubber, as shown in Japanese Patent Application Laid-Open No. 55-56237.
添加量を多く必要とし、プラスチック本来の耐熱性等の
物性を低下させてしまう上に表面抵抗値もたかだか１０
１１０程度であり良好とはいえない。It requires a large amount of additive, reduces the physical properties such as heat resistance that are inherent to plastics, and has a surface resistance value of at most 10.
It is about 110, which is not good.
帯電防止剤の表面塗布法は、表面抵抗値１０９０程度と
非常に良好な訓電性を示すが水洗、３９！擦等によって
制電性は簡単に失われてしまう。The surface coating method of antistatic agent shows very good electrostatic properties with a surface resistance value of about 1090, but washing with water, 39! The antistatic property is easily lost due to rubbing, etc.
その上内部練り込み法と違って表面塗布工程を必要とし
コスト高となってしまう。Moreover, unlike the internal kneading method, a surface coating process is required, resulting in high costs.
最近ではエレクトロニクス部品の運搬用コンテナーや包
装材で信頼性の高い帯電防止性材料が求められている。Recently, highly reliable antistatic materials are required for transportation containers and packaging materials for electronic parts.
しかるに上述の如き、特別な工程全必要とせず、少量の
配合量で良好な訓電性を恒久的に示し且つベースポリマ
ー本来の物性も低下させない帯電防止剤がなく、その開
発が望まれている。However, as mentioned above, there is no antistatic agent that does not require any special process, permanently exhibits good electrostatic properties with a small amount of addition, and does not deteriorate the inherent physical properties of the base polymer, and the development of such an agent is desired. .
本発明者らは上述し九如き現状に鑑み鋭意検討の結果、
特定の四級アンモニウム塩基を有する単量体単位を必須
成分とする共重合体ｔベースポリマーである熱可塑性樹
脂に少量配合することＶｃエク、ベースポリマーの耐熱
性を殆ど低下させずに良好で且つ恒久的な制電性が付与
され交熱可塑性樹脂組成物とし得ることを見出し本発明
に到達し穴。As a result of intensive study in view of the current situation as described above, the inventors of the present invention have found that
A copolymer containing a monomer unit having a specific quaternary ammonium base as an essential component can be blended in a small amount with a thermoplastic resin that is a base polymer. The present invention was achieved by discovering that a thermoplastic resin composition can be provided with permanent antistatic properties.
本発明は熱可塑性樹脂１００重量部に対し、一般式
％式％
（式中、Ｒｏは水素又はメチル基、Ｒ，〜Ｒ４は水素又
は置換基を有していてもよい炭素数１〜９のアルキル基
、ｎは１〜１０の数、Ｘ−は−価の無機、又はＭ機の酸
基か又は魚機酸あるいは有機酸の相応する等何物を表す
。）で表される四級アンモニウム塩基を有する単量体単
位３０〜９９１１ｔ％およびこれと共１合可能なビニル
単量体又はビニリデン単量体単位７０〜１ＭＬ！９６か
らなる共重合体をα１〜４０重量部配合してなる帯電防
止性熱可塑性樹脂組成物である。The present invention uses the general formula % formula % (in the formula, Ro is hydrogen or a methyl group, R, ~R4 are hydrogen or a carbon number of 1 to 9 which may have a substituent), based on 100 parts by weight of the thermoplastic resin. Quaternary ammonium represented by an alkyl group, n is a number from 1 to 10, 30-9911 t% of base-containing monomer units and 70-1 ML of vinyl monomer or vinylidene monomer units that can be combined with the monomer units! This is an antistatic thermoplastic resin composition containing α1 to 40 parts by weight of a copolymer consisting of 96.
本発明におけるベースポリマーとして用いる熱可塑性樹
脂としては、（イ）少なくとも一種のエチレン性不飽和
単量体の重合生成物並びにその共重合体、例えはポリエ
チレン、ポリプロピレン、ポリメチルペンテン、更には
ビニル単量体、その構成成分とするもの、例えばポリ塩
化ビ二ル、ポリ酢酸ビニル、エチレン−酢酸ビニル共ｇ
ｏ体、エチレン系アイオンマー１１ｆ脂、ｙＮＩＪ−Ｘ
チレン、スチレン−アクリロニトリル共重合体、ゴム変
性ポリスチレン、ＡＢＥｉ樹脂、ムＡ３１Ｍ脂等、（Ｃ
４自己縮合により１！合可能な少なくとも一種の二官能
的反応性化合物の重合体、例えばポリオキシメチレノ、
ポリアセタール共重合体、ポリフェニレンエーテル、Ｐ
Ｐ８樹脂、ポリカプロラクト７、ポリカプロラクト７等
、（５多給合によって重合可能な少なくとも二重の二官
能的反２性化合物の重合体１例えばナイロ７−６６゜ポ
リスルフォン、ポリエステル、ポリエステル−ポリエー
テルあるいはポリエステル−ポリアミドブロック共１合
体、ポリイミド、芳香族ポリエステル、ポリカーボネイ
ト、ポリエーテルエーテルケトン、ボリウレタノエラス
トマー等が挙げられ、これらの重合体を単独もしくは組
合せて用いることができる。The thermoplastic resin used as the base polymer in the present invention includes (a) polymerization products of at least one ethylenically unsaturated monomer and copolymers thereof, such as polyethylene, polypropylene, polymethylpentene, and even vinyl monomers. Polyvinyl chloride, polyvinyl acetate, ethylene-vinyl acetate, etc.
o form, ethylene ionmer 11f fat, yNIJ-X
Styrene, styrene-acrylonitrile copolymer, rubber-modified polystyrene, ABEi resin, Mu A31M resin, etc.
4 1 by self-condensation! polymers of at least one difunctionally reactive compound that can be combined, such as polyoxymethyleno,
Polyacetal copolymer, polyphenylene ether, P
P8 resin, polycaprolact 7, polycaprolact 7, etc. (5 Polymers of at least two difunctional anti-bifunctional compounds polymerizable by polyhydration 1 e.g. nylon 7-66° polysulfone, polyester, polyester -Polyether or polyester-polyamide block comonomer, polyimide, aromatic polyester, polycarbonate, polyether ether ketone, polyurethane elastomer, etc., and these polymers can be used alone or in combination.
これら重合体の内ポリスチレン、スチレン−アクリロニ
トリル共重合体、ムＢＳ樹脂およびポリ塩化ビニルが好
ましく用いられる。Among these polymers, polystyrene, styrene-acrylonitrile copolymer, MuBS resin and polyvinyl chloride are preferably used.
本発明における訓電性を付与し得る共１合体の構成成分
である四級アンモニウム塩基ｔ−有する単量体ユニット
は、一般式
％式％
（式中、Ｒ１、Ｒ，〜Ｒ４，ｎおよびＸ″″は上記に同
じ）
で表されるものであり、こｎはアミンを有するアクリレ
ート又はメタクリレートが四級化剤によって四級化され
たものである。In the present invention, the monomer unit having the quaternary ammonium base t-, which is a component of the co-monomer which can impart electrostatic properties, has the general formula % (where R1, R, ~R4, n and ``'' is the same as above), and n is an amine-containing acrylate or methacrylate that has been quaternized with a quaternizing agent.
アミンｔ−有するアクリレート又はメタクリレートの具
体例としてはジメチルアミノエチルアクリレート、ジエ
チルアミノエチルアクリレート、ジメチルアミノエチル
メタクリレート、ジエチルアミノエチルメタクリレート
、ジメチルアミノ１０ビルメタクリレート、ジメチルア
ミノブチルメタクリレート、ジノ０ピルアミノエチルメ
タクリレート、ジブチルアミノエチルメタクリレート、
ジヒドロキシエチルアミノエチルメタクリレート等が挙
げられる。Specific examples of acrylates or methacrylates having amine t- are dimethylaminoethyl acrylate, diethylaminoethyl acrylate, dimethylaminoethyl methacrylate, diethylaminoethyl methacrylate, dimethylamino-10-vinyl methacrylate, dimethylaminobutyl methacrylate, dino-pyraminoethyl methacrylate, dibutylamino ethyl methacrylate,
Examples include dihydroxyethylaminoethyl methacrylate.
四級化剤としてはジメチル硫酸、ジエチル硫１！１２．
ジプロピル硫酸等のアルキル硫酸類、Ｐ−トルエンスル
ホン酸メチル、ベンゼンスルホン酸メチル等のスルホン
酸エステル類、ジメチル亜硫酸等のアルキル亜硫酸類、
トリメチルホスフェイト等のアルキルリン酸類、アルキ
ルベンジルクロライド、ベンジルクロライド、アルキル
クロライド、アルキルブロマイド等の各槙ノ１ライドが
挙げられ、特にアルキル硫酸類およびスルホン酸エステ
ル類が耐熱分解性の点より好ましいものである。As a quaternizing agent, dimethyl sulfate, diethyl sulfate 1!12.
Alkyl sulfates such as dipropyl sulfate, sulfonic acid esters such as methyl P-toluenesulfonate and methyl benzenesulfonate, alkyl sulfites such as dimethyl sulfite,
Examples include alkyl phosphoric acids such as trimethyl phosphate, alkyl benzyl chlorides, benzyl chlorides, alkyl chlorides, alkyl bromides, etc., and alkyl sulfates and sulfonic acid esters are particularly preferred from the viewpoint of heat decomposition resistance. It is.
上記一般式中のｎは１〜１０であるが、ｎが２〜６が特
に好ましいものである。In the above general formula, n is 1 to 10, and preferably 2 to 6.
本発明における訓電性を付与し得る共重合体は四級アン
モニウム塩基を有する単量体単位が３０〜９９ｉ食係で
あり、他の単量体単位はこれと共重合可能なビニル単量
体又はビニリデン単量体単位７０〜１重量％からなるも
のである。In the copolymer capable of imparting electrical conductivity in the present invention, the monomer unit having a quaternary ammonium base has a ratio of 30 to 99i, and the other monomer units are vinyl monomers copolymerizable with this monomer unit. Or it consists of 70 to 1% by weight of vinylidene monomer units.
共１合可能なビニル単量体又はビニリデン単量体として
はアクリル酸、メタクリル酸、アクリル酸アルキルエス
テル、メタクリル酸アルキルエステル、アクリルアミド
、メタクリルアミド、酢酸ビニル、不飽和ニトリル化合
物、芳香族ビニル化合物、アルキルビニルエーテル、ア
ルキルビニルケトム ２−ヒドロキシアルキル（メタ）
アクリレート、塩化ビニル、塩化ビニリデン、イソブチ
ン、２−アシッドホスフォキシエチル（メタ）アクリレ
ート等が挙ケラれ、これらは単独で又は２ａ以上組合せ
て用いることができる。Examples of vinyl monomers or vinylidene monomers that can be combined include acrylic acid, methacrylic acid, acrylic acid alkyl esters, methacrylic acid alkyl esters, acrylamide, methacrylamide, vinyl acetate, unsaturated nitrile compounds, aromatic vinyl compounds, Alkyl vinyl ether, alkyl vinyl ketone 2-hydroxyalkyl (meth)
Examples include acrylate, vinyl chloride, vinylidene chloride, isobutyne, 2-acid phosphoxyethyl (meth)acrylate, and these can be used alone or in combination of 2a or more.
これら共重合可能な単量体の内子クリロニトリルのよう
な極性の高い単量体又はスルホン酸基、リン酸基、カル
ボッ酸基等のようなイオン性置換基を含む単量体を選択
すると訓電性は更に向上するので好ましい。特にベース
ポリマーである熱可塑性樹脂を構成するｊ１１量体単位
と同一か又は熱可塑性樹脂と相溶性の良い樹脂？！−構
成するｊｐ、ｎ体単位と同一のものを用いるとべ−スボ
リマーの強度、透明性等の物性を保つ上で特にＭ旧であ
る。It is recommended to select highly polar monomers such as crylonitrile, or monomers containing ionic substituents such as sulfonic acid groups, phosphoric acid groups, carboxylic acid groups, etc., of these copolymerizable monomers. This is preferable because the electrical property is further improved. In particular, is it the same as the J11 monomer unit that makes up the thermoplastic resin that is the base polymer, or is it a resin that has good compatibility with the thermoplastic resin? ! - Using the same units as the constituting jp and n-units is especially advantageous in maintaining the physical properties such as strength and transparency of the base polymer.
本発明における訓電性を付与し得る共重合体の分子量は
１．０００〜１０，０．０００であることが好ましい。It is preferable that the molecular weight of the copolymer capable of imparting electrophoretic properties in the present invention is 1.000 to 10.000.
分子量が１． ＯＯ０未満であれば良好な恒久的制電性
が得られないばかりでなく、賦型時にスリップ等の問題
を起こし、その上可塑化効果によりベースポリマーの耐
熱性を低下させてしまうため好喧しくない。The molecular weight is 1. If it is less than OO0, not only will it not be possible to obtain good permanent antistatic properties, but it will also cause problems such as slipping during molding, and furthermore, it will reduce the heat resistance of the base polymer due to the plasticizing effect, which is undesirable. .
なお、この共１合体の７（Ｃ，合方法は特に限定されな
いが、通常ラジカル１合開始剤および連鎖移動剤の存在
下にて溶ｇ、１！合、塊状１合等の手法音用いることが
できる。又共重合をうまく進める為に滴下重合を行うの
も有利である。In addition, the method of combining 7 (C) of this co-1 combination is not particularly limited, but methods such as molten g, 1! combination, lump 1 combination, etc. are usually used in the presence of a radical 1 combination initiator and a chain transfer agent. It is also advantageous to carry out dropwise polymerization in order to successfully proceed with the copolymerization.
上記側［件を付与し得る共重合体の配合量はベースポリ
マーである熱可塑性樹脂１００ｉ量部に対しα１〜４０
重量部、好ましくは（１５〜４０ｉｉ（全部である。配
合量が［１１７！を全部米温であると良好な制電性全付
与できず、又４０重食Ｍ、’ｉ’ＡＲｊ（るとベースポ
リマーの本来の物性を大きく損ねる傾向となり好ましく
ない。通常は３重量部程度の配合量で十分であり、この
場合で表面抵抗値１ （ｌｌａＱ−Ｉ Ｑｌ”Ωとなる
。The blending amount of the copolymer capable of imparting the above properties is α1 to 40 parts per 100 parts of the thermoplastic resin as the base polymer.
Parts by weight, preferably (15 to 40ii (total). If the blended amount is [117!] all at rice temperature, it will not be possible to impart good antistatic properties, and 40 heavy meals M, 'i' ARj ( This is undesirable because it tends to greatly impair the original physical properties of the base polymer. Usually, a blending amount of about 3 parts by weight is sufficient, and in this case, the surface resistance value becomes 1 (llaQ-IQl''Ω).
本発明の熱可塑性樹脂組成物が制電性全発現するのは、
本発明において用いる四級アンモニウム塩基を有する共
１合体の独特の性質のため、本組成物を射出成形や押出
成形等の成形時に成形物表面へこの共重合体が濃縮し７
ｔ５配向したりすることによるものである。またかかる
四級アンモニウム塩基含有１合体は共１合体である友め
、かかる組成物からの成形品を水洗しても容易に脱落せ
ず、恒久制電性全付与できる上にベースポリマーとの相
溶性、非相溶性のバランスをとることが容易であるｔめ
樹脂本来の様々な物性全低下させることなく制電性を発
現させることができる等優ｎた効果を有する。The thermoplastic resin composition of the present invention fully exhibits antistatic properties because:
Due to the unique properties of the copolymer having a quaternary ammonium base used in the present invention, when the present composition is molded by injection molding, extrusion molding, etc., the copolymer concentrates on the surface of the molded product.
This is due to the t5 orientation. In addition, such a quaternary ammonium base-containing monomer is a co-monomer, and does not easily fall off even when molded products made from such a composition are washed with water, can provide permanent antistatic properties, and is compatible with the base polymer. Since it is easy to balance solubility and incompatibility, it has excellent effects such as being able to exhibit antistatic properties without reducing all of the various physical properties inherent to the resin.
本発明の熱可塑性樹脂組成物には他の帯電防止剤、滑剤
、抗酸化剤、紫外線吸収剤および七の他の添加剤を配合
しても差し支えない。The thermoplastic resin composition of the present invention may contain other antistatic agents, lubricants, antioxidants, ultraviolet absorbers, and seven other additives.
なお、上記共重合体中の四級アンモニウム塩基は酸化さ
れ易いためホスファイト系の抗酸化剤を配合することが
好ましい・
〔実施例〕
以下、実施例によｐ本発明を具体的に説明する。なお、
実施例および比較例中の処理条件および物性計画条件は
下記の、方法によった。In addition, since the quaternary ammonium base in the above copolymer is easily oxidized, it is preferable to incorporate a phosphite-based antioxidant. [Examples] The present invention will be specifically explained below with reference to Examples. . In addition,
The processing conditions and physical property planning conditions in the Examples and Comparative Examples were as follows.
調 湿 ：ベレットを射出成形に工ｐｉｏｃｍＸ１０
ＩｙｎＸ ２ ［の板に成形し、２３℃、湿度６５％で
１日調湿した。Humidity control: Injection molding of pellets piocmX10
It was molded into a board of IynX 2 and kept at 23° C. and 65% humidity for one day.
水洗処理：測定用試片を３０℃で超音波洗浄全３０分間
行った。Water washing treatment: The measurement specimen was subjected to ultrasonic washing at 30° C. for a total of 30 minutes.
表面抵抗値：超絶縁抵抗計（タケダ理研製、ＴＲ−８６
０１）を便用し、２３℃、湿度６５優の条件下で印加電
圧５００ｖで１分後の表面抵抗値（Ω）を測定した＠
ｍＷ牛極減時間スタティックオネストメーター（宍戸間
会製）全使用し、印加電圧１００００Ｖ、試料回転速度
１５００ ｒｐｍ、印加時間３０秒、２３℃、湿度６５
％の条件下で測定し、電圧印加時の試料電圧を初期電圧
（Ｖ）、電圧印加後試料電圧が初期電圧の半分になるま
での時間全電荷半減時間（抄）とした。Surface resistance value: Super insulation resistance meter (manufactured by Takeda Riken, TR-86
01) was used to measure the surface resistance value (Ω) after 1 minute with an applied voltage of 500 V under conditions of 23°C and humidity of 65%. Applied voltage: 10,000 V, sample rotation speed: 1,500 rpm, application time: 30 seconds, 23°C, humidity: 65
The sample voltage at the time of voltage application was defined as the initial voltage (V), and the time required for the sample voltage to become half of the initial voltage after voltage application was defined as the total charge half-life time (excerpt).
熱変形温度（ＨＤＴ）： Ａ８ＴＭ Ｄ６４８に準じ
て、ＨＤＴ測定用試片を作成し、この試片をアニール％
ｌＡｓＴＭ Ｄ６４８に準じテＨＤ Ｔ （Ｃ）を測
定した・
引張試験： Ａ８ＴＭ Ｄ６３Ｂに準じて引張試験全
行い、引張弾性係数および引張破壊強度を測定した。Heat distortion temperature (HDT): A specimen for HDT measurement was prepared according to A8TM D648, and this specimen was annealed at %
Tensile test: All tensile tests were conducted according to A8TM D63B, and the tensile elastic modulus and tensile breaking strength were measured.
表面状態：銀条の有無を表し、○は銀条が全く現れず、
Δは銀条が少し現れたこと七示す。Surface condition: Indicates the presence or absence of silver streaks; ○ means no silver streaks appear;
Δ indicates that some silver stripes appeared.
実施例１
攪拌羽根付き３ｔのガラス製フラスコにジエチルアミノ
ヱチルメタクリレー）３７４重ｉ部、ハイドロキノンモ
ノメチルエーテル４１ｎ量部。Example 1 In a 3-ton glass flask equipped with a stirring blade, 374 weight parts of diethylaminoethyl methacrylate and 41 weight parts of hydroquinone monomethyl ether were added.
メタノ−ルミ５０′Ｎｆｆ１部を入れ、激しくｒ４押し
ながらジメチル硫酸２５２］１量部、メタノール８０重
量部の混合物を３０℃以下になるように滴下した。滴下
終了後３０分間攪拌し四級アンモニウム塩基を有する単
量体浴液（Ｍ−１）を得窺。該（Ｍ−１）溶液にアゾビ
スインブチロニトリル６Ｍ量部、ｎ−オクチルメルカプ
タン４重量部、スチレン１５０！量部、Ｈ，Ｎ−ジメチ
ルホルムアミド４８０Ｍ１１部’ｔ 加え、６０℃、窒
素雰囲気下で４時間重合し友。１合後そのまま真空乾燥
し制電性付与共重合体（Ｔ−１）を得た。1 part of methanol Lumi 50'Nff was added, and while vigorously pressing R4, a mixture of 1 part of dimethyl sulfuric acid 252] and 80 parts of methanol was added dropwise to keep the temperature below 30°C. After the dropwise addition was completed, the mixture was stirred for 30 minutes to obtain a monomer bath solution (M-1) containing a quaternary ammonium base. The (M-1) solution contains 6M parts of azobisin butyronitrile, 4 parts by weight of n-octylmercaptan, and 150 parts of styrene. 11 parts of 480M H,N-dimethylformamide was added, and the mixture was polymerized at 60° C. for 4 hours under a nitrogen atmosphere. After the first reaction, the mixture was directly vacuum-dried to obtain an antistatic property-imparting copolymer (T-1).
得られ九制電性付与共重合体５′Ｎ量部をポリスチレン
樹脂１００ｉ量部に混合し、溶融押出様によりペレット
化し友。5'N parts of the obtained antistatic property-imparting copolymer were mixed with 100 parts of polystyrene resin and pelletized by melt extrusion.
得られ九ペレットを射出成形により１０菌×１０ ｃｌ
ＲＸ ２ ｗｍの板にしてから調湿後側電柱を評価し友
ところ表面抵抗値５ Ｘ １０”Ω、電荷半減時間２秒
であった。The resulting nine pellets were injection molded into 10 bacteria x 10 cl.
After making a RX 2 wm board and evaluating the humidity, the utility pole on the side was evaluated, and the surface resistance was 5 x 10''Ω, and the charge half-life time was 2 seconds.
又、得られた板に水洗処理を行い、直ちに制電性を評価
したところ表面抵抗値五７ Ｘ １０’ｌΩ、電荷半減
時間２秒であった。Further, the obtained plate was washed with water and immediately evaluated for antistatic property, and the surface resistance value was 57 x 10'lΩ, and the charge half-life time was 2 seconds.
又、ＨＤＴを測定し九ところ９２℃であった。Also, HDT was measured and found to be 92°C.
さらに引張試験を行つ九ところ、引張弾性係数１１ Ｘ
１０’ Ｋ９／１ｙｒｒｚ、引張破壊強度４５０ Ｋ
９／ｃｒｓ”であった。After further tensile testing, the tensile modulus of elasticity was 11
10' K9/1yrrz, tensile breaking strength 450K
9/crs”.
実施例２〜５
実施例１で得た制電性付与共重合体（Ｔ−１）をポリス
チレン樹脂１００］Ｉ量部に対し表１に示す６独の配合
量で配合し、溶融押出様によりペレット化した。Examples 2 to 5 The antistatic property-imparting copolymer (T-1) obtained in Example 1 was blended with 100 parts of polystyrene resin in the six proportions shown in Table 1, and then melt-extruded. Pelleted.
得られた各ペレットを用い実施例１と同じ方法により１
！ｉ々の物性を評価した結果を表１に示す。1 by the same method as in Example 1 using each pellet obtained.
! Table 1 shows the results of evaluating the physical properties of each.
実施例６〜１９
アミン含有〔メタ〕アクリレートおよび四級化剤を表２
に示すものを用いる以外は実施例１と同様の方法により
各種の単量体溶液（Ｍ−２〜Ｍ−６）を得た・
表 ２
上記単量体溶ｉ（Ｍ−２〜Ｍ−６）’ｊｉ用い、表３に
示す共１合単量体の種類および共重合量となるようにす
る以外は、実施例１と同様の方法により各ｆ上の訓電性
付与共重合体（Ｔ−２〜Ｔ−１３）を得た。Examples 6-19 Amine-containing [meth]acrylates and quaternizing agents are shown in Table 2.
Various monomer solutions (M-2 to M-6) were obtained in the same manner as in Example 1 except for using those shown in Table 2. )'ji was used, and the electrophoricity-imparting copolymer (T -2 to T-13) were obtained.
表 ３
得られ交各訓電性付与共１合体および前記Ｔ−１のＳＸ
Ｘ郡部表４に示す各槙熱可塑性樹脂１００重量部に夫々
配合し、溶融押出機によりベレット化し次。Table 3 SX of the obtained cross-training property imparting combination and T-1 above
The mixture was blended with 100 parts by weight of each Maki thermoplastic resin shown in Table 4 and formed into pellets using a melt extruder.
得られ几各ペレット’ｔ−用い実施例１と同じ方法によ
り種々の物性を評価した結果を表４に併せて示す。Table 4 also shows the results of evaluating various physical properties using the same method as in Example 1 using each of the obtained pellets.
表４中の略号は次の通りである（以下の比較例に同じ）
。The abbreviations in Table 4 are as follows (same as in the comparative example below)
.
ｐｓｔ：ポリスチレン
ＰＡ日：スチレノーアクリロニトリル共重合体ｐｖｃ：
ポリ塩化ビニル
ＡＢＥＩ：ＡＢＳ樹脂
比較例１〜４
表５記載の％種熱可塑性樹脂ｔ−溶融押出機によりペレ
ット化した。これらペレットを用い実施例１と同じ方法
によりｓｉｉ、々の物性を評価し九結果を表５に併せて
示す。pst: polystyrene PA day: styrene-acrylonitrile copolymer pvc:
Polyvinyl chloride ABEI: ABS Resin Comparative Examples 1 to 4 The % species thermoplastic resins listed in Table 5 were pelletized using a t-melt extruder. Using these pellets, the physical properties of sii were evaluated in the same manner as in Example 1, and the results are also shown in Table 5.
比較例５
ポリスチレン樹脂１００重量部に対しグリセリンモノス
テアレート（低分子界面活性剤）１０′Ｎ量部金混合し
、溶融押出機によりペレット化し穴。Comparative Example 5 10'N parts of glycerin monostearate (low molecular surfactant) were mixed with 100 parts by weight of polystyrene resin, and pelletized using a melt extruder.
得られ友ペレットヲ射出成形によｐ１０ｚＸ１０ｍＸ２
ｍの板にしてから調湿後側電性を評価し友ところ表面抵
抗値Ｓ、 Ｓ Ｘ １０’Ω、電荷半減時間五５秒であ
つ友。The obtained pellets were injection molded into p10zX10mX2
After using a 200-mm plate and evaluating the side conductivity after humidity conditioning, the surface resistance value S, S x 10'Ω, and the charge half-life time was 55 seconds.
又、得られた板に水洗処理を行い、直ちに制電性を評価
したところ表面抵抗値＆４Ｘ１０”Ω。In addition, the obtained board was washed with water and immediately evaluated for antistatic properties, and the surface resistance value was +4 x 10''Ω.
電荷半減時間２分以上であった。The charge half-life time was 2 minutes or more.
又、ＨＤＴ’ｉ測定し友ところ６８℃であった。In addition, HDT'i was measured and found to be 68°C.
さらに引張試験を行ったところ引張弾性係数２．５Ｘ１
０’に９／１Ｍｌ” 、引張破壊強度５００に９／ｃＩ
ｍ”であり、耐熱性および強度の低下が見られた。Further tensile tests revealed that the tensile modulus of elasticity was 2.5X1.
9/1Ml” at 0', 9/cI at tensile strength 500
m'', and a decrease in heat resistance and strength was observed.
比較例６
四級アンモニウム塩基ｔ−７にする塗布型帯電防止剤の
１，５％水浴液に１０国×１０国×２簡のポリスチレン
成形板を１分間浸漬し、風乾後２３℃、湿度６５％で１
日調湿後制電性を評価し九ところ表面抵抗値１．３ＸＩ
Ｑ１０Ω、電荷半減時間１．５秒であった。Comparative Example 6 A polystyrene molded plate of 10 countries x 10 countries x 2 pieces was immersed in a 1.5% water bath solution of a coating type antistatic agent made into quaternary ammonium base t-7 for 1 minute, and after air drying, the temperature was 23°C and the humidity was 65%. 1 in %
Surface resistance value 1.3XI was evaluated for antistatic property after humidity conditioning
Q: 10Ω, charge half-life time: 1.5 seconds.
又、得らｔ′Ｌ九板に水洗処理を行い直ちに制定性を評
価したところ表面抵抗値ａ８Ｘ１０”Ω。In addition, when the obtained t'L nine plates were washed with water and immediately evaluated for stability, the surface resistance value was a8 x 10''Ω.
電荷半減時間は２分以上であり、恒久制電柱に欠けてい
た。The charge half-life time was more than 2 minutes, which was lacking in permanent power blocking poles.
本発明の樹脂組放物は良好且つ恒久的な帯電防止性を有
し、しかもベースポリマー本来のｊ士熱性０強度等の物
ｆｆ：ｔ−低下させないものであるため、ごみや埃を吸
引して外ｃ！全全損る等の成形品、フィルム、シート、
儲維等の分野で起る様々な帯電トラブルがなく、且つエ
レクトロニクス関連等の高信頓性を必要とする分野にも
使用することができる。The resin composition of the present invention has good and permanent antistatic properties, and does not reduce the inherent thermal properties of the base polymer, such as zero strength, so it does not attract dirt or dust. Outside c! Molded products, films, sheets, etc. that are completely destroyed, etc.
It is free from the various charging problems that occur in fields such as textile manufacturing, and can also be used in fields that require high reliability, such as electronics-related fields.
Claims (1)
水素、又は置換基を有していてもよい炭素 数１〜９のアルキル基、ｎは１〜１０の数、Ｘ＾−は一
価の無機、又は有機の酸基か又は無機酸あるいは有機酸
の相応する等価物を表 す。） で表される四級アンモニウム塩基を有する単量体単位３
０〜９９重量％およびこれと共重合可能なビニル単量体
又はビニリデン単量体単位７０〜１重量％からなる共重
合体を０．１〜４０重量部配合してなる帯電防止性熱可
塑性樹脂組成物。 ２、一般式中の四級アンモニウム塩基のカウンタ−アニ
オンＸ＾−が ＲＳＯ＾−＿３又はＲＯＳＯ＾−＿３ （但し、Ｒは水素又はフエニル基を有していてもよい炭
素数１〜２０のアルキル基を表 す。） である特許請求の範囲第１項記載の帯電防止性熱可塑性
樹脂組成物。 ３、共重合可能なビニル単量体又はビニリデン単量体単
位が熱可塑性樹脂を構成する単量体単位と同一か又は熱
可塑性樹脂と相溶性の良い樹脂を構成する単量体単位と
同一である特許請求の範囲第１項記載の帯電防止性熱可
塑性樹脂組成物。 ４、熱可塑性樹脂がポリスチレンである特許請求の範囲
第１項記載の帯電防止性熱可塑性樹脂組成物。 ５、熱可塑性樹脂がスチレン−アクリロニトリル共重合
体である特許請求の範囲第１項記載の帯電防止性熱可塑
性樹脂組成物。 ６、熱可塑性樹脂がＡＢＳ樹脂である特許請求の範囲第
１項記載の帯電防止性熱可塑性樹脂組成物。 ７、熱可塑性樹脂がポリ塩化ビニルである特許請求の範
囲第１項記載の帯電防止性熱可塑性樹脂組成物。[Claims] 1. For 100 parts by weight of thermoplastic resin, there are general formulas, mathematical formulas, chemical formulas, tables, etc. an alkyl group having 1 to 9 carbon atoms, n is a number from 1 to 10, and X^- is a monovalent inorganic or organic acid group, or a corresponding equivalent of an inorganic acid or an organic acid. Monomer unit 3 having a quaternary ammonium base represented by
Antistatic thermoplastic resin containing 0.1 to 40 parts by weight of a copolymer consisting of 0 to 99% by weight and 70 to 1% by weight of vinyl monomer or vinylidene monomer units copolymerizable therewith. Composition. 2. In the general formula, the counter anion X^- of the quaternary ammonium base is RSO^-_3 or ROSO^-_3 (wherein, R is hydrogen or an alkyl having 1 to 20 carbon atoms which may have a phenyl group) The antistatic thermoplastic resin composition according to claim 1, which represents a group. 3. The copolymerizable vinyl monomer or vinylidene monomer unit is the same as the monomer unit constituting the thermoplastic resin, or is the same as the monomer unit constituting the resin with good compatibility with the thermoplastic resin. An antistatic thermoplastic resin composition according to claim 1. 4. The antistatic thermoplastic resin composition according to claim 1, wherein the thermoplastic resin is polystyrene. 5. The antistatic thermoplastic resin composition according to claim 1, wherein the thermoplastic resin is a styrene-acrylonitrile copolymer. 6. The antistatic thermoplastic resin composition according to claim 1, wherein the thermoplastic resin is an ABS resin. 7. The antistatic thermoplastic resin composition according to claim 1, wherein the thermoplastic resin is polyvinyl chloride.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61196858A JPS6354467A (en) | 1986-08-22 | 1986-08-22 | Antistatic thermoplastic resin composition |
| US07/087,524 US4859727A (en) | 1986-08-22 | 1987-08-20 | Antistatic thermoplastic resin composition |
| CA000545093A CA1335013C (en) | 1986-08-22 | 1987-08-21 | Antistatic thermoplastic resin composition |
| EP87112178A EP0257592B1 (en) | 1986-08-22 | 1987-08-21 | Antistatic thermoplastic resin composition |
| DE3788544T DE3788544T2 (en) | 1986-08-22 | 1987-08-21 | Antistatic thermoplastic molding compound. |
| KR1019870009191A KR910007310B1 (en) | 1986-08-22 | 1987-08-22 | Antistatic thermoplastic resin compositions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61196858A JPS6354467A (en) | 1986-08-22 | 1986-08-22 | Antistatic thermoplastic resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6354467A true JPS6354467A (en) | 1988-03-08 |
Family
ID=16364826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61196858A Pending JPS6354467A (en) | 1986-08-22 | 1986-08-22 | Antistatic thermoplastic resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6354467A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4997A (en) * | 1972-04-13 | 1974-01-05 | ||
| JPS4916033A (en) * | 1972-06-05 | 1974-02-13 |
-
1986
- 1986-08-22 JP JP61196858A patent/JPS6354467A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4997A (en) * | 1972-04-13 | 1974-01-05 | ||
| JPS4916033A (en) * | 1972-06-05 | 1974-02-13 |
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