JPS6352968A - Automatic polishing device - Google Patents
Automatic polishing deviceInfo
- Publication number
- JPS6352968A JPS6352968A JP61194611A JP19461186A JPS6352968A JP S6352968 A JPS6352968 A JP S6352968A JP 61194611 A JP61194611 A JP 61194611A JP 19461186 A JP19461186 A JP 19461186A JP S6352968 A JPS6352968 A JP S6352968A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- resistance value
- monitor
- monitors
- magnetic head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 72
- 238000007689 inspection Methods 0.000 claims description 8
- 238000007517 polishing process Methods 0.000 claims description 6
- 238000012544 monitoring process Methods 0.000 claims 1
- 239000012528 membrane Substances 0.000 abstract 2
- 239000010409 thin film Substances 0.000 description 31
- 238000010586 diagram Methods 0.000 description 17
- 238000003754 machining Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/048—Lapping machines or devices; Accessories designed for working plane surfaces of sliders and magnetic heads of hard disc drives or the like
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
所定寸法を有する直方体状物体を自動的に連続研摩加工
する自動研磨装置であって、研磨面の加工状況と加工精
度を検査する度に、被加工物である直方体状物体を取り
外して他の検査装置で検査しながら研磨加工していたの
に対して、研磨面の長手方向の両端に矩形パターンの抵
抗体からなるモニタを埋込み、研磨により変化するモニ
タの抵抗値を標準抵抗値パターンと比較しながら研磨面
の加工状況と加工精度を自動検査するように構成するこ
とにより、連続加工でしかも高精度な研磨加工が可能と
なる。[Detailed Description of the Invention] [Summary] This is an automatic polishing device that automatically and continuously polishes a rectangular parallelepiped object having predetermined dimensions. In contrast to polishing while removing a rectangular parallelepiped object and inspecting it with other inspection equipment, we embedded monitors made of rectangular patterned resistors at both longitudinal ends of the polishing surface to monitor changes that occur during polishing. By configuring the machine to automatically inspect the machining status and machining accuracy of the polished surface while comparing the resistance value with a standard resistance value pattern, continuous machining and high-precision polishing becomes possible.
本発明は、所定寸法を有する直方体状物体をミクロン単
位で連続研磨加工する自動研磨装置に関する。The present invention relates to an automatic polishing apparatus that continuously polishes a rectangular parallelepiped object having predetermined dimensions in micron units.
例えば、薄膜磁気ヘッドを製作する工程に、薄膜磁気ヘ
ッドブロック上の複数コアが形成された面を数十ミクロ
ン研磨する工程がある。For example, the process of manufacturing a thin film magnetic head includes a process of polishing a surface of a thin film magnetic head block on which a plurality of cores are formed by several tens of microns.
この研磨精度は薄膜磁気ヘッドの特性を決定する上で重
要な要素をなすため、１０分の数ミクロンの精度を持っ
て研摩する必要があり、かかる研摩を短時間にしかも高
精度を持って自動的に連続加工する方式の実用化が期待
されている。This polishing accuracy is an important factor in determining the characteristics of thin-film magnetic heads, so it is necessary to polish with an accuracy of several tenths of a micron. There are high expectations for the practical application of continuous processing methods.
第６図は従来例を説明するブロック図、第７図は薄膜磁
気ヘッドブロックの状態を説明する図、第８図は研磨加
工状態を説明する図をそれぞれ示す。FIG. 6 is a block diagram illustrating a conventional example, FIG. 7 is a diagram illustrating the state of a thin film magnetic head block, and FIG. 8 is a diagram illustrating a polishing state.
第７図は３膜磁気ヘツドを製作する工程の一部を示し、
第７図（Ａ）は薄膜パターンの基盤となるウェハー（１
）を、第７図（Ｂ）は薄膜パターンを形成したウェハー
（１）に複数の薄膜磁気ヘッドを作成した状態を、第７
図（Ｃ）は薄膜磁気ヘッドを作成したウェハー（１）を
所定数の薄膜磁気ヘッドからなる薄膜磁気ヘッドブロッ
ク■〜■に分割した状態をそれぞれ示す。Figure 7 shows part of the process of manufacturing a three-film magnetic head, and Figure 7 (A) shows a wafer (1
), and FIG. 7(B) shows a state in which a plurality of thin film magnetic heads are formed on a wafer (1) on which a thin film pattern is formed.
Figure (C) shows a state in which a wafer (1) on which thin film magnetic heads are formed is divided into thin film magnetic head blocks (1) to (2) each consisting of a predetermined number of thin film magnetic heads.
第８図（Ａ）は薄膜磁気ヘッドブロック■〜■（但し、
図中にはウェハー（１）で代表して表示する）の成膜パ
ターン配置を示し、第８図（Ｂ）はその断面を示す。FIG. 8(A) shows thin film magnetic head blocks ■～■ (However,
The figure shows the film formation pattern arrangement of a wafer (representatively shown as wafer (1)), and FIG. 8(B) shows its cross section.
尚、各薄膜磁気ヘッドのコア（ａ）とコア（ａ）に捲か
れているコイルｆｂ）の引き出し線（ｅ）はそれぞれの
端子座（ｆ）に接続されている。Note that the core (a) of each thin-film magnetic head and the lead wire (e) of the coil fb) wound around the core (a) are connected to the respective terminal seats (f).
又、薄膜磁気へソドブロンク■〜■の側面は、所定厚さ
を持って保護されており、その中に予め埋め込まれてい
るバクーン（Ｃ）を基準位置にして、表面（約数十μｍ
の厚さがある）を研磨して行き、第８図（Ｂ）に示すよ
うにコア（ａ）のギャップディツプス（ｄ）が数μｍに
なるように加工する。In addition, the side surfaces of the thin-film magnetic shield bronches ■ to ■ are protected with a predetermined thickness, and the surface (approximately several tens of μm
As shown in FIG. 8(B), the gap depth (d) of the core (a) is several μm.
尚、符号２ｇはコア（ａｌの極をなす部分の間隙を示す
。又、研磨加工は第６図に示す方式で行う。即ち、第６
図の構成は、
研磨定盤８の回転駆動源であるモータ９及び研磨加工さ
れる薄膜磁気ヘッドブロック■〜■の研磨定盤８に対す
る角度（アーム５先端の長方形の片側を支点として、も
う片側が水平な研磨定盤８に対してなす角度）を制御す
るモータ７の駆動制御を行う研磨制御部１０と、
薄膜磁気ヘッドブロック■〜■を接着しているホルダ４
と、ホルダ４を装着するアーム５と、アーム５を支える
支柱６と、研磨定盤８に対する角度を支柱６に与えるモ
ータ７と、薄膜磁気ヘッドブロック■〜■を研磨する研
磨定盤８と、研摩定盤８の回転駆動源であるモータ９と
を具備する研磨機構部３とから構成されている。Incidentally, the reference numeral 2g indicates the gap between the poles of the core (al).The polishing process is performed using the method shown in FIG.
The configuration of the figure is as follows: The angle of the motor 9, which is the rotational drive source of the polishing surface plate 8, and the thin film magnetic head blocks ■ to ■ to be polished relative to the polishing surface plate 8 (with one side of the rectangle at the tip of the arm 5 as a fulcrum, and the other side a polishing control unit 10 that controls the drive of a motor 7 that controls the angle of the polishing surface (with respect to a horizontal polishing surface plate 8); and a holder 4 to which the thin film magnetic head blocks ■ to ■ are bonded.
, an arm 5 on which the holder 4 is attached, a support 6 supporting the arm 5, a motor 7 that gives the support 6 an angle with respect to the polishing surface plate 8, and a polishing surface plate 8 for polishing the thin film magnetic head blocks 1 to 2. The polishing mechanism section 3 includes a motor 9 which is a rotational driving source for the polishing surface plate 8.
上述の方式で目標とするコア（ａ）のギャップディ７ブ
ス（ｄ）を得るためには、まず研磨対象の薄膜磁気ヘッ
ドブロック■〜■を接着しているホルダ４をアーム５に
装着する。In order to obtain the target gap depth (d) of the core (a) using the above-described method, the holder 4 to which the thin film magnetic head blocks (1) to (3) to be polished are adhered is first attached to the arm 5.
この状態で、研磨制御部１０に研磨開始指示を所定方法
で与え、モータ９の駆動を開始し数十μｍの厚さの研磨
を開始する。In this state, a polishing start instruction is given to the polishing control unit 10 in a predetermined manner to start driving the motor 9 and begin polishing to a thickness of several tens of μm.
尚、モータ７の回転数により支持機構部５ａを矢印方向
に動作させ、アーム５先端に装着されているホルダ４の
長手方向の研磨面が水平な研磨定盤８に対して有する角
度を設定する。Note that the support mechanism section 5a is moved in the direction of the arrow by the rotation speed of the motor 7, and the angle that the longitudinal polishing surface of the holder 4 attached to the tip of the arm 5 has with respect to the horizontal polishing surface plate 8 is set. .
研磨方法としては、研磨する数十μｍの厚さの約半分強
は連続して粗研磨し、残り半分弱の厚さからは、研磨定
盤８を所定回転数回転する度に、ホルダ４をアーム５か
ら取外してパターン（Ｃ）位置と比較して、研磨状態を
図示してない他の検査装置で検査することを繰返し行う
ことにより実施する。As for the polishing method, about half of the thickness of several tens of μm to be polished is continuously rough polished, and from the remaining half thickness, the holder 4 is rotated every time the polishing surface plate 8 is rotated at a predetermined number of revolutions. This is carried out by repeatedly removing it from the arm 5, comparing it with the pattern (C) position, and inspecting the polishing state using another inspection device (not shown).
上述のように、回層対象の薄膜磁気ヘッドブロック■〜
■を、数μｍずつ研摩する度にホルダ４をアーム５から
取外してパターン（Ｃ）位置と比較して、研磨状態を図
示してない他の検査装置で検査することを繰返すために
、その加工工数に余分の手間が必要になる。As mentioned above, the thin film magnetic head block for rotation
In order to repeat the process of removing the holder 4 from the arm 5 and comparing it with the pattern (C) position each time the polishing process is performed by several μm, the polishing condition is inspected using another inspection device (not shown). Additional man-hours are required.
又、ホルダ４へ研磨対象の薄膜磁気ヘンドブロック■〜
■を再装着する時に装着誤差が発生し、検査する前と同
一状態で精度を確保することが困難になる等の問題点が
ある。Also, attach the thin film magnetic hend block to be polished to the holder 4.
There are problems such as an installation error occurring when reinstalling the item (2), making it difficult to maintain accuracy in the same condition as before inspection.
第１図は本発明の詳細な説明するブロック図を示す。 FIG. 1 shows a block diagram illustrating the invention in detail.
第１図に示す原理ブロック図は、
その長手方向の両端に埋込んだモニタ（ｇ）、 （ｈ）
を直方体状物体の被研摩物体（薄膜磁気ヘンドブロック
）の研磨面と同一状態で研磨するにつれて変化すると予
測される標準抵抗値特性パターンを予め格納している制
御部１２で得た実測抵抗値と標準抵抗値特性パターンと
を比較し、その比較結果に基づき被研磨物体の研磨面の
研磨定盤８に対する角度をモータ７に与えるパルス数に
より制御する処理部１１、
処理部１１から指定されるパルス数に基づきモータ７の
駆動を行うと共に、被研磨物体の長手方向の両端のモニ
タ（ｇ）、 （ｈ）に安定化した直流電流を供給して、
モニタ（ｇ）、 ｆｈ）が有する抵抗値をモニタ（ｇ）
。The principle block diagram shown in Figure 1 consists of monitors (g) and (h) embedded at both longitudinal ends.
The actual resistance value obtained by the control unit 12 that stores in advance a standard resistance value characteristic pattern that is predicted to change as the object is polished in the same state as the polished surface of the rectangular parallelepiped object (thin film magnetic hend block). and a standard resistance value characteristic pattern, and based on the comparison result, the angle of the polished surface of the object to be polished with respect to the polishing surface plate 8 is controlled by the number of pulses applied to the motor 7; The motor 7 is driven based on the number of pulses, and a stabilized direct current is supplied to the monitors (g) and (h) at both ends of the object to be polished in the longitudinal direction.
Monitor (g) the resistance value of monitor (g), fh)
.
（ｈ）に流れた電流値により測定して、刻々変化する実
測抵抗値を得る制ｆＩ１１部１２とを具備する研磨制御
部１と、
研磨制御部１内に予め格納している標準抵抗値特性パタ
ーンと、制御部１２で得た実測抵抗値との比較検査状況
を監視出来るように図形表示する表示装置２と、
直方体状物体の研磨面の長手方向両端の幅方向に埋込ん
だ所定形状を有する抵抗体からなるモニタ（（ｇ）、
（ｈ））を備えた被研磨物体を、研摩制御部１からの制
′４′［Ｉｌ信号を基にして回転する研磨定盤８で研摩
加工する研磨機構部３とから構成されている。(h) A polishing control section 1 comprising a control fI 11 section 12 that measures the current value flowing in the step to obtain an actual resistance value that changes moment by moment; and a standard resistance value characteristic stored in advance in the polishing control section 1. A display device 2 that graphically displays the pattern and the actual resistance value obtained by the control unit 12 so that the inspection status can be monitored; A monitor consisting of a resistor ((g),
(h) A polishing mechanism section 3 polishes an object to be polished with a polishing surface plate 8 which rotates based on a control signal '4' [Il from a polishing control section 1.
直方体状物体の被研摩物体（薄膜磁気ヘッドブロック）
の研磨面の両端に埋込まれている抵抗体からなるモニタ
を同時に研磨し、その研磨状況に応じて変化するモニタ
の抵抗値を、そのモニタに流れる直流電流により測定し
、予め格納している標準抵抗値パターンと比較しながら
研磨面の加工状況と加工精度を表示装置に抵抗値の変化
状況を図形表示し、連続処理される研磨加工状況及び回
層精度をその図形表示を通して監視出来るように構成す
ることにより、連続した加工でしかも高加工精度を短時
間に得ることが可能となった。Rectangular parallelepiped object to be polished (thin film magnetic head block)
A monitor consisting of a resistor embedded at both ends of the polishing surface is polished at the same time, and the resistance value of the monitor, which changes depending on the polishing situation, is measured by the DC current flowing through the monitor and stored in advance. The machining status and machining accuracy of the polished surface are graphically displayed on the display device while comparing with the standard resistance value pattern, and the continuous polishing process status and layer accuracy can be monitored through the graphic display. This configuration makes it possible to achieve high machining accuracy in a short period of time through continuous machining.
以下本発明の要旨を第２図〜第５図に示す実施例により
具体的に説明する。The gist of the present invention will be specifically explained below with reference to embodiments shown in FIGS. 2 to 5.
第２図は本発明の詳細な説明するブロック図、第３図は
本発明の実施例におけるモニタの幅と抵抗値の関係を説
明する図、第４図は本発明の実施例における薄膜磁気ヘ
ッドブロックの装着状態を説明する図、第５図は本発明
の実施例におけるモニタの取付は状態を説明する図であ
る。尚、企図を通じて同一符号は同一対象物を示す。FIG. 2 is a block diagram explaining the present invention in detail, FIG. 3 is a diagram explaining the relationship between monitor width and resistance value in an embodiment of the present invention, and FIG. 4 is a thin film magnetic head in an embodiment of the present invention. FIG. 5 is a diagram illustrating the mounting state of the block, and FIG. 5 is a diagram illustrating the mounting state of the monitor in the embodiment of the present invention. Note that the same reference numerals refer to the same objects throughout the plan.
本実施例も薄膜磁気ヘッドの製作工程で行う薄膜磁気ヘ
ッドの表面研磨を例に取り説明する。This embodiment will also be explained by taking as an example the surface polishing of a thin film magnetic head performed in the manufacturing process of the thin film magnetic head.
第５図（Ａ）に示す図は、第７図（Ｃ）に示す３１Ａ
磁気へ・ノドブロック■〜■を示し、上面が研磨面とな
る。The diagram shown in FIG. 5(A) is the 31A shown in FIG. 7(C).
Magnetic throat block ■～■ is shown, and the top surface is the polished surface.
又、矩形パターンの抵抗体であるモニタ（ｇｌ、 （ｈ
）は薄膜磁気ヘッドブロック■〜■の長方形長手方向の
両端に取付けられ、第５図（Ｂ）に示すようにモニタ（
ｇ）、 （ｈ） （但し、図中にはモニタ（ｈ）のみし
か図示してない）の矩形パターンの解放部分の両端は、
端子座（１）に接続され、この端子座（１）を経由した
リード線が研磨制御部１に伸びている。In addition, the monitor (gl, (h
) are attached to both ends of the rectangular longitudinal direction of the thin film magnetic head blocks ■ to ■, and the monitor (
g), (h) (However, only the monitor (h) is shown in the figure) Both ends of the open part of the rectangular pattern are
A lead wire is connected to the terminal seat (1) and extends to the polishing control section 1 via the terminal seat (1).
第２図に示す研磨処理システムは、研磨制御部１と、研
磨状態の進行状況及び研磨状態の検査状況を図形表示す
る表示装置２と、研磨機構部３とからなっている。The polishing processing system shown in FIG. 2 includes a polishing control section 1, a display device 2 that graphically displays the progress status of the polishing state and the inspection status of the polishing state, and a polishing mechanism section 3.
又、研磨機構部３の研磨加工処理を制御する研磨制御部
１は第２図に示す構成をなしている。即ち、下記に説明
する処理部１１と制御部１２とから構成されている。Further, the polishing control section 1 that controls the polishing process of the polishing mechanism section 3 has a configuration shown in FIG. That is, it is composed of a processing section 11 and a control section 12, which will be explained below.
処理部１１は、内部の処理動作をマイクロプログラムに
基づき制御するマイクロプロセッサ（以下ＭＰＵ と称
する）１１１ と、
モニタ（ｇｌ、 （ｈ）を薄膜磁気ヘッドブロック■〜
■の研磨面と同一状態で研磨するにつれて変化すると予
測される標準抵抗値特性パターンを予め格納しているメ
モリー１２と、
研磨状態の検査状況、即ち標準抵抗値特性パターンに対
する実測抵抗値の変化状況を図形表示する表示装置２の
図形表示制御を行うグラフィック制御「回路１１３と、
制御部１２内抵抗値測定回路１２１で得た実測抵抗値と
メモリー１２に格納している標準抵抗値特性パターンと
を比較する比較回路１１４ と、比較回路１１４での比
較結果に基づき薄膜磁気ヘッドブロック■〜■の研磨面
の研磨定盤８に対する角度をモータ駆動回路１２３を介
してモータ７に与えるパルス数を指定するモータ制’＋
１１１回路１１５と、
抵抗値測定回路１２１で得た実測抵抗値を格納ずす
るメモリーｆｆ６とを具備する。The processing unit 11 includes a microprocessor (hereinafter referred to as MPU) 111 that controls internal processing operations based on a microprogram, and a monitor (gl, (h)) connected to a thin film magnetic head block.
A memory 12 that stores in advance a standard resistance value characteristic pattern that is predicted to change as it is polished in the same state as the polished surface of (2), and the inspection status of the polishing state, that is, the change status of the actual resistance value with respect to the standard resistance value characteristic pattern. A graphic control circuit 113 controls the graphical display of the display device 2 to graphically display the actual resistance value obtained by the resistance value measuring circuit 121 in the control unit 12 and the standard resistance value characteristic pattern stored in the memory 12. The comparison circuit 114 to be compared and the number of pulses to be applied to the motor 7 via the motor drive circuit 123 to determine the angle of the polishing surfaces of the thin film magnetic head blocks (■ to ■) with respect to the polishing surface plate 8 are specified based on the comparison results in the comparison circuit 114. Motor system'＋
111 circuit 115, and a memory ff6 for storing the measured resistance value obtained by the resistance value measuring circuit 121.
一方、制御部１２は、モニタ（ｇ）、 （ｈ）が有する
抵抗値をモニタ（ｇ）、 （ｈ）に流れた電流値の変化
により変換して測定する砥抗値測回路１２１と、モニタ
［ｇ）、 （ｈ）及びモータ７．９に安定した直流電流
を供給する直流安定化回路１２２と、モータ制御回路１
１５からの制御信号に基づきモータ７に送出するパルス
数を演算して送出するモータ駆動回路１２３と、
研磨機構部３とのインタフェースをなすインタフェース
回路１２４とを具備している。On the other hand, the control unit 12 includes a grinding resistance value measuring circuit 121 that converts and measures the resistance values of the monitors (g) and (h) based on changes in the current values flowing through the monitors (g) and (h); [g), (h) and a DC stabilizing circuit 122 that supplies stable DC current to the motor 7.9, and a motor control circuit 1
A motor drive circuit 123 calculates and sends the number of pulses to be sent to the motor 7 based on a control signal from the polishing mechanism 15, and an interface circuit 124 serves as an interface with the polishing mechanism section 3.
モータ７はステンピングモータであり、モータ駆動回路
１２３から送出されて来るパルス数に応じた回転を行い
、この回転に伴いアーム５が取付けられている支持機構
部５ａの片側を矢印方向に移動させることにより、アー
ム５先端に装着されている直方体状物体である薄膜磁気
ヘッドブロック■〜■の研磨定盤８に対する角度を制御
する。The motor 7 is a stamping motor, and rotates in accordance with the number of pulses sent from the motor drive circuit 123, and with this rotation, moves one side of the support mechanism 5a to which the arm 5 is attached in the direction of the arrow. As a result, the angle of the thin film magnetic head blocks (1) to (2), which are rectangular parallelepiped objects attached to the tip of the arm 5, with respect to the polishing surface plate 8 is controlled.
本実施例における研磨加工は第６図で説明したように、
研磨する数十μｍの厚さの約半分強は連続して粗研磨し
て置き、残りの研磨を精密加工とする。尚、この切り換
えは処理部１１内のプログラムに基づきＭＰＵＩＩＩで
指示するものとする。The polishing process in this example is as explained in Fig. 6.
About half of the thickness of several tens of micrometers to be polished is continuously rough polished, and the remaining polishing is done by precision processing. It is assumed that this switching is instructed by the MPU III based on the program in the processing section 11.
次に、精密加工を開始すると第５図（Ｂ）に示すように
モニタ（ｇ）、 ｆｈ）も同時に研磨されて行き、これ
に伴いモニタ（ｇ）、 ｆｈ）に流れる直流電流をイン
タフェース回路１２４を介して抵抗値測定回路１２１で
監視し、直流電流の変化から演算した抵抗値を処理部１
１内メモリー１６に格納する。Next, when precision machining is started, the monitors (g) and fh) are polished at the same time as shown in FIG. The resistance value is monitored by the resistance value measuring circuit 121 via the
1 internal memory 16.
尚、抵抗値を求める演算式は直流電流の変化からモニタ
（ｇｌ、 （ｈｌの抵抗値を求める。The calculation formula for calculating the resistance value is to calculate the resistance value of the monitor (gl, (hl) from the change in DC current.
このようにして求めたモニタ（ｇｌ、 （ｈ）のそれぞ
れの数分量分の抵抗値の変化状況を格納したメモリ１１
６は、格納している実測抵抗値を比較回路１１４とｌ’
１ＰＩＪ１１１に送出する。The memory 11 stores the resistance change status for several portions of each of the monitors (gl, (h)) obtained in this way.
6 compares the stored measured resistance value with the comparison circuit 114 and l'
Send to 1PIJ111.
一方、標準抵抗値バクーンを格納しているメモリ１１２
からは標準抵抗値が比較回路１１４に送出さる。比較回
路１１４は標準抵抗値と実測抵抗値との比較差分及びモ
ニタ（ｇ）、 （ｈ）間の抵抗値の差分を４Ｐ下記式（
１）の定数Ａ、 Ｂを設定する。On the other hand, the memory 112 storing the standard resistance value Bakun
The standard resistance value is sent to the comparator circuit 114. The comparison circuit 114 calculates the comparison difference between the standard resistance value and the measured resistance value and the difference in resistance value between the monitors (g) and (h) using the following 4P formula (
1) Set constants A and B.
実測抵抗値−ＡＸ （抵抗体幅）−３・・・（１）次に
、ｈｐｔｎ着よ定数Ａ、Ｂを設定した式（１）の関係式
と、比較差分とをグラフツク制御回路１１３にセントし
て表示装置２上に、例えば第３図に示す特性（′ｋ）の
ような図形表示をする。Actual resistance value - AX (resistor width) - 3... (1) Next, the relational expression of equation (1) in which the constants A and B are set, and the comparison difference are sent to the graph control circuit 113. Then, a graphical display such as the characteristic ('k) shown in FIG. 3 is displayed on the display device 2, for example.
尚、第３図の縦軸はモニタ抵抗値を、横軸はモニタの幅
をそれぞれ示す。又、第４図はホルダ４に装着された薄
膜磁気ヘッドブロック■〜■を示し、符号（Ｊ）、 （
１１は端子盤を示す。Note that the vertical axis in FIG. 3 represents the monitor resistance value, and the horizontal axis represents the monitor width. Moreover, FIG. 4 shows thin film magnetic head blocks ■ to ■ attached to the holder 4, with symbols (J), (
11 indicates a terminal board.
次に、？１Ｐｔｌｌｌ’４よモニタ（ｇ）、 （ｔ、ｌ
の抵抗値の推移と、モニタ（ｇ）及びモニタ（ｈｌとの
間の抵抗値の差分をモータ制御回路１１５に与え、モー
タ７の回転量を演算させ、その回転量に伴う制御信号を
モータ駆動回路１２３に送出し、モータ７を回転するこ
とにより、モニタ（ｇ＋、 （ｈ）の研磨定盤８に対す
る角度を変更する。next,? 1Ptllll'4 monitor (g), (t, l
The change in resistance value and the difference in resistance value between the monitor (g) and the monitor (hl) are given to the motor control circuit 115 to calculate the rotation amount of the motor 7, and a control signal associated with the rotation amount is used to drive the motor. By sending the signal to the circuit 123 and rotating the motor 7, the angle of the monitor (g+, (h)) with respect to the polishing surface plate 8 is changed.
これらの制御を研磨加工中に連続して行うことにより、
所定量の加工量と加工精度を得る処理を短時間に実施す
ることが可能となった。By continuously performing these controls during polishing,
It has become possible to carry out processing to obtain a predetermined amount of machining and machining accuracy in a short time.
尚、本実施例における薄膜磁気ヘッドブロック■〜■の
研磨加工精度としては、それまでの方式による加工精度
に対して約数子％向上させることが可能となった。It should be noted that the polishing precision of the thin film magnetic head blocks (1) to (4) in this embodiment was able to be improved by about a few percent compared to the processing precision of the previous method.
以上のような本発明によれば、十分の数ミクロンオーダ
の研磨加工が要求される回層面の研磨加工を連続して、
しかも高加工精度を短時間に処理して得ることが出来る
。According to the present invention as described above, polishing of a layer surface that requires polishing on the order of several tenths of a micron can be continuously performed.
Moreover, high machining accuracy can be achieved in a short time.
第１図は本発明の詳細な説明するプロ・ツク図、第２図
は本発明の詳細な説明するブロック図、第３図は本発明
の実施例におけるモニタの幅と抵抗値の関係を説明する
図、
第４図は本発明の実施例における薄膜磁気ヘッドブロッ
クの装着状態を説明する図、
第５図は本発明の実施例におけるモニタの取付は状態を
説明する図、
第６図は従来例を説明するブロック図、第７図は薄膜磁
気ヘッドブロックの状態を説明する図、
第８図は研磨加工状態を説明する図、
をそれぞれ示す。
図において、
１．１０は研磨制御部、 ２は表示装置、３は研磨
機構部、 ４はホルダ、５はアーム、
５ａは支持機構部、６は支柱、 ７
．９はモータ、８は研磨定盤、 １１は処理部
、１２は制御部、 １１１は門ＰＵ、１１
２、１１６ はメモリ、
１１３はグラフインク制御回路、
１１４は比較回路、 １１５はモータ制御回路、
１２１は抵抗値測定回路、 １２２は直流安定化回路、
１２３はモータ駆動回路、
１２４はインタフェース回路、
をそれぞれ示す。
＄４図Fig. 1 is a block diagram explaining the present invention in detail, Fig. 2 is a block diagram explaining the present invention in detail, and Fig. 3 explains the relationship between monitor width and resistance value in an embodiment of the present invention. FIG. 4 is a diagram illustrating how the thin film magnetic head block is mounted in the embodiment of the present invention, FIG. 5 is a diagram illustrating the mounting state of the monitor in the embodiment of the present invention, and FIG. 6 is the conventional FIG. 7 is a block diagram for explaining an example, FIG. 7 is a diagram for explaining the state of the thin film magnetic head block, and FIG. 8 is a diagram for explaining the polishing state. In the figure, 1.10 is a polishing control unit, 2 is a display device, 3 is a polishing mechanism unit, 4 is a holder, 5 is an arm,
5a is a support mechanism part, 6 is a support column, 7
．． 9 is a motor, 8 is a polishing surface plate, 11 is a processing section, 12 is a control section, 111 is a gate PU, 11
2, 116 is a memory, 113 is a graph ink control circuit, 114 is a comparison circuit, 115 is a motor control circuit,
121 is a resistance value measurement circuit, 122 is a DC stabilization circuit,
123 is a motor drive circuit, and 124 is an interface circuit. $4 figure
Claims (1)
点として水平な研磨定盤（８）に対して所定角度を持っ
て上下方向に移動するアーム（５）を有し、前記アーム
（５）の長方形先端に取りつけたホルダ（４）に所定寸
法を有する直方体状物体を装着し、所定角度を持って前
記直方体状物体の研磨面を、回転する前記研磨定盤（８
）で研磨する自動研磨装置であって、 前記直方体状物体の研磨面の長手方向両端の幅方向に埋
込んだ所定形状を有する抵抗体からなるモニタ（（ｇ）
、（ｈ））と、 前記アーム（５）の片側を上下方向に移動させるモータ
（７）の駆動制御と、前記モニタ（（ｇ）、（ｈ））に
安定化した直流電流を供給すると共に、前記モニタ（（
ｇ）、（ｈ））に流れる直流電流値に基づき前記モニタ
（（ｇ）、（ｈ））が有する抵抗値の変化を測定する制
御部（１２）と、 予め設定している前記モニタ（（ｇ）、（ｈ））を研磨
するにつれて変化する標準の抵抗値特性パターンと、前
記制御部（１２）で得られた前記モニタ（（ｇ）、（ｈ
））の実測抵抗値とを比較し、その比較結果に基づき前
記直方体状物体の研磨面の該研磨定盤（８）に対する該
角度を前記制御部（１２）に対して指定する処理部（１
１）と、 前記標準抵抗値特性パターンと、前記制御部（１２）で
得た該実測抵抗値との比較検査状況を監視出来るように
図形表示する表示装置（２）とを設け、前記直方体状物
体の所定面の研磨加工及び研磨加工状態の検査を、前記
モニタ（（ｇ）、（ｈ））の実測抵抗値と標準抵抗値特
性パターンとの比較結果を前記表示装置（２）で図形表
示し、その状況を監視しながら連続研磨加工処理するこ
とを特徴とする自動研磨装置。[Claims] It has an arm (5) whose tip is rectangular and which moves vertically at a predetermined angle with respect to a horizontal polishing surface plate (8) using one side in the longitudinal direction of the rectangle as a fulcrum. A rectangular parallelepiped object having predetermined dimensions is attached to the holder (4) attached to the rectangular tip of the arm (5), and the polishing surface plate ( 8
) is an automatic polishing device for polishing with a monitor ((g)
, (h)), drive control of a motor (7) that moves one side of the arm (5) in the vertical direction, supplying a stabilized direct current to the monitor ((g), (h)), and , said monitor ((
a control unit (12) that measures a change in the resistance value of the monitor ((g), (h)) based on the DC current value flowing through the monitor ((g), (h)); The standard resistance value characteristic pattern that changes as the polishing of g) and (h)) and the monitor (g) and (h) obtained by the control unit (12) are shown.
)) and a processing unit (1) that specifies the angle of the polished surface of the rectangular parallelepiped object with respect to the polishing surface plate (8) to the control unit (12) based on the comparison result.
1), and a display device (2) for graphically displaying the comparison test status between the standard resistance value characteristic pattern and the measured resistance value obtained by the control unit (12); The polishing process of a predetermined surface of the object and the inspection of the polishing status are performed by graphically displaying the results of comparison between the measured resistance value of the monitor ((g), (h)) and the standard resistance value characteristic pattern on the display device (2). This automatic polishing device is characterized by continuous polishing processing while monitoring the situation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61194611A JPS6352968A (en) | 1986-08-20 | 1986-08-20 | Automatic polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61194611A JPS6352968A (en) | 1986-08-20 | 1986-08-20 | Automatic polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6352968A true JPS6352968A (en) | 1988-03-07 |
Family
ID=16327417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61194611A Pending JPS6352968A (en) | 1986-08-20 | 1986-08-20 | Automatic polishing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6352968A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02124262A (en) * | 1988-08-31 | 1990-05-11 | Digital Equip Corp <Dec> | Electric guide for strictly accurate working |
| US7914362B2 (en) | 2005-11-30 | 2011-03-29 | Hitachi Global Storage Technologies, Netherlands B.V. | Method of evaluating the quality of a lapping plate |
| US8047894B2 (en) | 2005-11-30 | 2011-11-01 | Hitachi Global Storage Technologies, Netherlands, B.V. | Apparatus for evaluating the quality of a lapping plate |
-
1986
- 1986-08-20 JP JP61194611A patent/JPS6352968A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02124262A (en) * | 1988-08-31 | 1990-05-11 | Digital Equip Corp <Dec> | Electric guide for strictly accurate working |
| US7914362B2 (en) | 2005-11-30 | 2011-03-29 | Hitachi Global Storage Technologies, Netherlands B.V. | Method of evaluating the quality of a lapping plate |
| US8047894B2 (en) | 2005-11-30 | 2011-11-01 | Hitachi Global Storage Technologies, Netherlands, B.V. | Apparatus for evaluating the quality of a lapping plate |
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