JPS6350109A - Filter circuit device for surface wave - Google Patents

Filter circuit device for surface wave

Info

Publication number
JPS6350109A
JPS6350109A JP19269586A JP19269586A JPS6350109A JP S6350109 A JPS6350109 A JP S6350109A JP 19269586 A JP19269586 A JP 19269586A JP 19269586 A JP19269586 A JP 19269586A JP S6350109 A JPS6350109 A JP S6350109A
Authority
JP
Japan
Prior art keywords
surface wave
substrate
wave filter
filter element
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19269586A
Other languages
Japanese (ja)
Inventor
Katsumi Hishiyama
菱山　勝己
Kiyoshi Fushimi
伏見　清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP19269586A priority Critical patent/JPS6350109A/en
Publication of JPS6350109A publication Critical patent/JPS6350109A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

Landscapes

  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PURPOSE:To make a gap between a surface wave filter body and a substrate, to improve the soldering property, and also, to prevent a migration caused by flux-up, by providing a projecting part on a part of the substrate to which a surface wave filter element is attached. CONSTITUTION:A projecting part 3 is provided on a substrate 2. Therefore, in case a gap is made between the lower face of a body of a surface wave filter element 1, and the substrate 2, and soldering has been executed by a dip system and a flow system, a solder failure is improved by allowing solder to be sucked up from a parts fitting hole 7, and also, a migration caused by flux-up is prevented. In this case, the projecting part 3 projected on the substrate 2 can be provided easily by forming it by a die at the time of pressing the substrate.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、表面波フィルタ素子２取り付ける基板の一部
に凸部を設けることにより表面波フィルタ本体と基板間
に丁きまを作り半田付は性を向上させかつ、７ラツクス
上りによるマイグレーションを防止する表面波フィルタ
回路装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a convex portion on a part of the substrate to which the surface wave filter element 2 is attached, thereby creating a gap between the surface wave filter main body and the substrate and preventing soldering. The present invention relates to a surface wave filter circuit device that improves performance and prevents migration due to 7 lux rise.

〔従来の技術〕[Conventional technology]

従来は、表面波フィルタ素子を基板にディップ方式又は
フロ一方式で半田付する場合、実公昭５６−１００２５
号のようにジャンパー線を用いるが、厚みのあるテープ
を用いて表面波フィルタと基板の）に丁きまを作り半田
の吸着を良くし半田付は不良を改善していた。Conventionally, when soldering a surface wave filter element to a substrate using a dip method or a flow method, the method was
Jumper wires were used as in the previous issue, but thick tape was used to create gaps between the surface wave filter and the board (between the surface wave filter and the board) to improve solder adsorption and improve soldering defects.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上記従来技術では、ジャンパー線又はテープ使。 The above conventional technology uses jumper wires or tape.

用による工数アップの欠点があった。The disadvantage was that the number of man-hours increased due to use.

本発明の目的は、上記欠点を解決することにある０ 〔問題点を解決するための手段〕 上記目的は、表面波フィルタ素子を取り付ける基板に凸
部を設けることにより、達成される。An object of the present invention is to solve the above-mentioned drawbacks. [Means for solving the problems] The above-mentioned object is achieved by providing a convex portion on the substrate on which the surface wave filter element is attached.

〔作用〕[Effect]

表面波フィルタ素子を取り付ける基板の基板成型時に凸
部を設けることにより、表面波フィルタ素子本体下面と
基板との間に丁きまを設はディップ方式及び７０一方式
による半田付は時、部品取り付は穴からの半田吸着を促
し半田付は不良を改善すると供にフラックス上りによる
表面波フィルタ素子足部のマイグレーションを防止する
。By providing a convex part when molding the board on which the surface wave filter element is to be attached, a gap is created between the bottom surface of the surface wave filter element body and the board, and when soldering with the dip method and the 70 one-way method, it is possible to attach the parts. promotes solder adsorption from the holes, improves soldering defects, and prevents migration of the surface wave filter element foot due to flux build-up.

〔実施例〕〔Example〕

以下、本発明の実施例を第１図により説明する。 Embodiments of the present invention will be described below with reference to FIG.

１中１は表面波フィルタ素子で、２は表面波フィルタ素
子１を取り付ける基板である。基板２に３の様な凸部を
設けることにより、表面波フィルタ素子１の本体下面と
基板２のあいだにすきま２作りディップ方式及びフロ一
方式によって半田付けをした場合、部品取り付は穴７か
らの半田吸い上げを良くして半田不良を改善し、さらに
７ラツクス上りによるマイグレーションご防止する。1 of 1 is a surface wave filter element, and 2 is a substrate to which the surface wave filter element 1 is attached. By providing a protrusion like 3 on the board 2, a gap 2 is created between the bottom surface of the main body of the surface wave filter element 1 and the board 2. When soldering is performed by the dip method or the flow method, parts can be attached through hole 7. This improves solder failure by improving solder absorption from the surface, and also prevents migration due to 7 lux rising.

ここで基板２に設けた凸部６は基板プレス時、に型によ
り成型することで容易に設けることが出来る。Here, the protrusions 6 provided on the substrate 2 can be easily provided by molding with a die when pressing the substrate.

〔発明の効果〕〔Effect of the invention〕

本発明により従来技術に比べ、ジャンパー線もしくはテ
ープの削除が可能となり工数低減を計れる０The present invention makes it possible to eliminate jumper wires or tapes compared to conventional technology, reducing man-hours.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例の基板断面図、第２曲、第６
図は従来技術による例を示す断面図である０ １・・・表面波フィルタ素子 −２・・・基板 ３・・・基板凸部 ４・・・ジャンパー線 ７・・・部品取り付は穴FIG. 1 is a cross-sectional view of a substrate according to an embodiment of the present invention, the second song, the sixth song, etc.
The figure is a cross-sectional view showing an example according to the prior art.

Claims (1)

【特許請求の範囲】[Claims] １、プリント基板の部品取付面側へ突起を設けることに
より、表面波フィルタ素子の電極リード部とプリント基
板間に空隙が生するよう構成したことを特徴とする表面
波フィルタ回路装置。1. A surface wave filter circuit device characterized in that a projection is provided on the component mounting surface side of the printed circuit board so that a gap is created between the electrode lead portion of the surface wave filter element and the printed circuit board.
JP19269586A 1986-08-20 1986-08-20 Filter circuit device for surface wave Pending JPS6350109A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19269586A JPS6350109A (en) 1986-08-20 1986-08-20 Filter circuit device for surface wave

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19269586A JPS6350109A (en) 1986-08-20 1986-08-20 Filter circuit device for surface wave

Publications (1)

Publication Number Publication Date
JPS6350109A true JPS6350109A (en) 1988-03-03

Family

ID=16295510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19269586A Pending JPS6350109A (en) 1986-08-20 1986-08-20 Filter circuit device for surface wave

Country Status (1)

Country Link
JP (1) JPS6350109A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4931755A (en) * 1987-11-20 1990-06-05 Oki Electric Industry Co., Ltd. Surface-acoustic-wave device with a capacitance coupled between input and output
JPH03106571A (en) * 1989-09-19 1991-05-07 Nippon Steel Corp Method and device for groove profiling

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4931755A (en) * 1987-11-20 1990-06-05 Oki Electric Industry Co., Ltd. Surface-acoustic-wave device with a capacitance coupled between input and output
JPH03106571A (en) * 1989-09-19 1991-05-07 Nippon Steel Corp Method and device for groove profiling

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