JPS634961A - Wire dot printing head and its preparation - Google Patents
Wire dot printing head and its preparationInfo
- Publication number
- JPS634961A JPS634961A JP14711886A JP14711886A JPS634961A JP S634961 A JPS634961 A JP S634961A JP 14711886 A JP14711886 A JP 14711886A JP 14711886 A JP14711886 A JP 14711886A JP S634961 A JPS634961 A JP S634961A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- coil
- solenoid
- wire dot
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims abstract description 71
- 239000011347 resin Substances 0.000 claims abstract description 71
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 230000009477 glass transition Effects 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 10
- 229920000515 polycarbonate Polymers 0.000 abstract description 6
- 239000004417 polycarbonate Substances 0.000 abstract description 6
- 238000007789 sealing Methods 0.000 abstract description 5
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 abstract description 4
- 125000006850 spacer group Chemical group 0.000 abstract description 3
- 238000001746 injection moulding Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000005266 casting Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/22—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material
- B41J2/23—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material using print wires
- B41J2/27—Actuators for print wires
Landscapes
- Impact Printers (AREA)
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明 −
〔発明の目的〕
（産業上の利用分野）
この発明は、ワイヤドツトプリンタヘッドおよびその製
作方法に関する。Detailed Description of the Invention 3. Detailed Description of the Invention - [Object of the Invention] (Field of Industrial Application) The present invention relates to a wire dot printer head and a manufacturing method thereof.
（従来の技術）
ワイヤドツトプリンタヘッドは、第６図に示すように、
アルミニウムからなる環状の放熱体（１）と、その内側
に配設されたソレノイド（２）と、このソレノイド（２
）の背面側に配設されて一部が放熱体（１）の外側に延
出した回路基板（３）とを有する。(Prior art) As shown in FIG. 6, the wire dot printer head has
An annular heat dissipating body (1) made of aluminum, a solenoid (2) disposed inside it, and this solenoid (2).
) and a circuit board (3) that is disposed on the back side of the heat sink (3) and has a portion extending outside the heat sink (1).
しかして、上記ソレノイド（２）は、環状に配列された
複数のコアピン（４）を有する環状のコア（５）と、各
コアピン（４）にボビンを介して各別に装着された複数
のコイル（６）とを有し、これらコイル（６）が回路基
板（３）に形成された回路パターンに接続されている。Thus, the solenoid (2) has a ring-shaped core (5) having a plurality of core pins (4) arranged in a ring, and a plurality of coils (5) each separately attached to each core pin (4) via a bobbin. 6), and these coils (6) are connected to a circuit pattern formed on a circuit board (3).
なお、（７）は、各コアピン（４）の先端面上に各別に
配設される複数のアマチュアピンの一つを示したもので
ある。Note that (7) shows one of the plurality of armature pins separately arranged on the tip end surface of each core pin (4).
従来、このワイヤドツトプリンタヘッドの製作は、放熱
体（１）、ソレノイド（２）および回路基板（３）を所
定の関係に組立てたのち、注型法により各部品間に熱硬
化性エポキシ樹脂を充填して一体化することによりおこ
なわれていた。Conventionally, this wire dot printer head was manufactured by assembling the heat sink (1), solenoid (2), and circuit board (3) in a predetermined relationship, and then filling the spaces between each component with thermosetting epoxy resin using a casting method. This was done by integrating the two.
しかし、このエポキシ注型法は、樹脂充填時の粘度が低
いため、わづかな隙間にも入りこみ、樹脂パリを生ずる
。また、この注型法では、コアピン（４）の先端面と同
一平面まで樹脂が充填されるので、この樹脂がプリンタ
ヘッド動作時の態度上昇により、コアピン（４）より大
きく膨張してアマチュアピン（７）を誤動作させること
がある。さらに、エポキシ注型法は、樹脂が硬化するま
でに時間がかかり、生産性が低いなどの問題点がある。However, in this epoxy casting method, since the viscosity of the resin is low when it is filled, the resin can get into even small gaps, causing resin cracks. In addition, in this casting method, the resin is filled to the same level as the tip surface of the core pin (4), so the resin expands more than the core pin (4) due to the increase in attitude during printer head operation, and the armature pin (4). 7) may malfunction. Furthermore, the epoxy casting method has problems such as it takes time for the resin to harden and productivity is low.
かかる問題点を解決するため、本出願人は、射出成形法
でワイヤドツトプリンタヘッドを製作する方法を開発し
た。この製作方法は、樹脂封入金型のキャビティ上で各
部品を所定の関係に組立てたのち、そのキャビティに封
止樹脂を射出充填して一体に固着する方法である。In order to solve these problems, the applicant has developed a method of manufacturing a wire dot printer head by injection molding. This manufacturing method involves assembling each component in a predetermined relationship on a cavity of a resin-filled mold, and then injecting and filling the cavity with a sealing resin to fix them together.
しかし、この方法は、通常ソレノイドに装着されるコイ
ルの線径が０．ｌｉａｍ程度であるため、高温高圧で射
出される樹脂との接触により、コイル（６）が断線しや
すいという問題点がある。However, in this method, the wire diameter of the coil attached to the solenoid is usually 0. liam, there is a problem that the coil (6) is likely to break due to contact with the resin injected at high temperature and high pressure.
（発明が解決しようとする問題点）
上記のようにワイヤドツトプリンタヘッドの各部品を所
定の関係に組立て、これに射出成形法により樹脂を充填
してそれらを一体に固着しようとすると、コイルが断線
しやすいという問題点がある。(Problem to be Solved by the Invention) When the parts of the wire dot printer head are assembled in a predetermined relationship as described above, and an attempt is made to fill them with resin by injection molding and fix them together, the coil breaks. The problem is that it is easy to do.
この発明は、上記問題点を解決するためになされたもの
であり、射出成形法によりワイヤドツトプリンタヘッド
を製作するに際し、コイルに断線を生じないようにする
ことを目的とする。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to prevent wire breakage from occurring in the coil when manufacturing a wire dot printer head by injection molding.
（問題点を解決するための手段）
射出成形法によりワイヤドツトプリンタヘッドを製作す
るに際し、コイルに封入樹脂よりガラス転移点の低い樹
脂層を形成してこれをソレノイドのコアピンに装着し、
このソレノイドを他の部品とともに樹脂封入成形金型の
キャビティに装着して、上記封入樹脂を射出して一体に
固着するようにした。(Means for solving the problem) When manufacturing a wire dot printer head using the injection molding method, a resin layer with a glass transition point lower than that of the encapsulating resin is formed on the coil, and this is attached to the core pin of the solenoid.
This solenoid and other parts were installed in a cavity of a resin-filled mold, and the above-mentioned encapsulating resin was injected to fix them together.
（作 用）
上記のようにあらかじめコイルに封入樹脂よりガラス転
移点の低い樹脂層を形成して上記封入樹脂を射出すると
、樹脂層の断熱作用と、封入樹脂との接触防止作用とに
より、コイルの断線を防止することができる。(Function) When a resin layer with a glass transition point lower than that of the encapsulating resin is formed on the coil in advance as described above and the encapsulating resin is injected, the resin layer has a heat insulating effect and a contact prevention effect with the encapsulating resin to prevent the coil from forming. It is possible to prevent wire breakage.
（実施例）
以下、図面を参照してこの発明を実施例に基づいて説明
する。(Example) Hereinafter, the present invention will be described based on an example with reference to the drawings.
まず第１図および第２図によりこの発明の一実施例であ
るワイヤドツトプリンタヘッドを説明する。このワイヤ
ドツトプリンタヘッドは、内側に環状の中空部が形成さ
れ、外周に放熱フィンが形成されたほぼ四角形状をなす
アルミニウムからなる環状の放熱体（１）と、この放熱
体（１）の内側中空部内に装着されたソレノイド（１０
）と、このソレノイド（ｌＯ）の背面側に配置されて一
部が放熱体（１）の外側に延出している回路基板（３）
と、この回路基板（３）の背面側に配設されたリアスペ
ーサ（１１）とを有する。上記ソレノイド（１０）は、
断面り形の環状コア（５）の環状壁に沿って環状に配列
された複数のコアピン（４）に各別にボビン（１２）を
介して複数のコイル（１３）を装着したものであり、各
コイル（１３）は、上記回路基板（３）に形成された回
路パターンに接続されている。しかして、上記各部品は
、後述する射出成形法により、放熱体（１）の内側に射
出充填されたポリカーボネートなどからなる封入樹脂（
１４）により一体に固着され、特にコイル（１３）につ
いては、第２図に示すように、この封入樹脂（１４）よ
りガラス転移点の低い樹脂層（１５）を介して固着され
ている。なお、第２図において、（１６）は、コイル（
１３）を回路基板（３）の回路パターンに接続するため
に、絶縁ボビン（１２）に植設された接続ピンである。First, a wire dot printer head, which is an embodiment of the present invention, will be explained with reference to FIGS. 1 and 2. This wire dot printer head consists of an annular heat dissipating body (1) made of aluminum and having an approximately rectangular shape with an annular hollow part formed inside and heat dissipating fins formed on the outer periphery, and a hollow space inside the heat dissipating body (1). Solenoid installed inside the unit (10
) and a circuit board (3) placed on the back side of this solenoid (lO) with a portion extending outside of the heat sink (1).
and a rear spacer (11) disposed on the back side of the circuit board (3). The above solenoid (10) is
A plurality of coils (13) are attached to a plurality of core pins (4) arranged annularly along the annular wall of a cross-sectional annular core (5) through separate bobbins (12). The coil (13) is connected to a circuit pattern formed on the circuit board (3). Therefore, each of the above-mentioned parts is made of an encapsulating resin (made of polycarbonate, etc.) that is injected and filled inside the heat sink (1) by the injection molding method described later.
14), and in particular, the coil (13) is fixed via a resin layer (15) whose glass transition point is lower than that of the encapsulating resin (14), as shown in FIG. In addition, in FIG. 2, (16) is the coil (
13) to the circuit pattern of the circuit board (3), this is a connection pin implanted in the insulating bobbin (12).
つぎに、このワイヤドツトプリンタヘッドをポリカーボ
ネートを封入樹脂（１４）として射出成形法で製作する
方法について述べる。Next, a method of manufacturing this wire dot printer head by injection molding using polycarbonate as the encapsulating resin (14) will be described.
まず第３図に示すように、ボビン（１２）に巻装された
コイル（１３）の外側に、ポリカーボネートよりガラス
転移点の低いたとえば塩化ビニルのテープを巻付けて樹
脂層（１５ａ）を形成する。つぎに、このコイル（１３
）をコア（５）の複数のコアビン（４）に各別に装着し
て、ソレノイド（ｌＯ）を仮組立てし、さらに、この仮
組立てされたソレノイド（１０）の各コイル（１３）を
回路基板（３）の回路パターンに接続する。First, as shown in FIG. 3, a resin layer (15a) is formed by wrapping a tape made of vinyl chloride, which has a lower glass transition point than polycarbonate, around the outside of the coil (13) wound around the bobbin (12). . Next, this coil (13
) are individually attached to the plurality of core bins (4) of the core (5), the solenoid (lO) is temporarily assembled, and each coil (13) of the temporarily assembled solenoid (10) is attached to the circuit board ( Connect to the circuit pattern in 3).
しかるのち、第４図に示すように、樹脂封入成形金型の
たとえば可動側型板（１７）に設けられたキャビティ内
に、順次リアスペーサ（１１）、回路基板（３）に接続
されたソレノイド（１０）および放熱体（１）を、所定
の関係に位置決め装着する。その後、この可動側型板（
１７）を固定側型板（１８）と組合せて、上記キャビテ
ィに装着された放熱体（１）の内側に封入樹脂（１４）
を射出充填する。なお、（１９）は、ソレノイド（１０
）の上端面を成形するための固定側型板（１８）に設け
られた入子である。Thereafter, as shown in FIG. 4, a solenoid (connected to the rear spacer (11) and the circuit board (3) is sequentially placed in a cavity provided in, for example, the movable side mold plate (17) of the resin-filled molding die. 10) and the heat sink (1) are positioned and mounted in a predetermined relationship. After that, this movable side template (
17) with the fixed side mold plate (18), and seal the resin (14) inside the heat sink (1) installed in the cavity.
injection filling. Note that (19) is the solenoid (10
) is a nest provided on the fixed side mold plate (18) for molding the upper end surface of the mold.
なお、所要のワイヤドツトプリンタヘッドは、上記射出
充填された封入樹脂（１４）が十分に硬化したのちに、
型開きして金型から取出すことにより得られる。In addition, the required wire dot printer head is manufactured after the injection-filled encapsulating resin (14) has sufficiently hardened.
It is obtained by opening the mold and removing it from the mold.
上記ワイヤドツトプリンタヘッドの製作方法において、
ポリカーボネートを封止樹脂とするときは、射出時の樹
脂温度が約３２０℃になるように加熱される。この高温
に加熱された樹脂の射出充填−７＝
により、第５図（Ａ）図に拡大して示すように、最初コ
イル（１３）の外側にテープを巻付けて形成されたポリ
カーボネートよりガラス転移点の低い塩化ビニルからな
る樹脂層（１５ａ）は、（Ｂ）図に示すように、溶融ま
たは軟化してコイル（１３）に密着した樹脂層（１５）
となる。In the above wire dot printer head manufacturing method,
When polycarbonate is used as the sealing resin, the resin is heated to a temperature of about 320° C. during injection. This injection filling of the resin heated to a high temperature causes a glass transition from the polycarbonate formed by wrapping the tape around the outside of the coil (13), as shown in the enlarged view in Figure 5(A). As shown in figure (B), the resin layer (15a) made of vinyl chloride with a low point melts or softens and becomes a resin layer (15) that is in close contact with the coil (13).
becomes.
したがって、上記のようにワイヤドツトプリンタヘッド
を製作すると、あらかじめコイル（１３）の外側に設け
られた樹脂層（１５ａ）が高温高圧で射出充填される封
止樹脂とコイル（１３）との直接的な接触を防止し、か
つ封止樹脂の高温を断熱してコイル（１３）を保護する
ので、コイル（１３）に断線をおこさない樹脂封止をお
こなうことができる。また、上記のように構成されたワ
イヤドツトプリンタヘッドは、樹脂層（１５）がコイル
（１３）に密着しているので、通常動作時１００℃以上
になるコイル温度を有効に放熱する。Therefore, when the wire dot printer head is manufactured as described above, the resin layer (15a) provided in advance on the outside of the coil (13) is directly connected to the sealing resin that is injected and filled at high temperature and pressure. Since the coil (13) is protected by preventing contact and insulating the high temperature of the sealing resin, it is possible to seal the coil (13) with the resin without causing wire breakage. Further, in the wire dot printer head constructed as described above, since the resin layer (15) is in close contact with the coil (13), heat is effectively radiated from the coil temperature which reaches 100° C. or higher during normal operation.
以上、この発明の一実施例について説明したが、コイル
外側の樹脂層は、塩化ビニルに限定されるものでなく、
封入樹脂よりガラス転移点の低い樹脂ならば他の樹脂で
もよい。Although one embodiment of the present invention has been described above, the resin layer on the outside of the coil is not limited to vinyl chloride.
Other resins may be used as long as they have a lower glass transition point than the encapsulating resin.
また、この樹脂層は、あらかじめテープを巻付けて形成
するだけでなく、たとえば樹脂を塗布するなど他の方法
で形成してもよい。Further, this resin layer may be formed not only by wrapping a tape in advance, but also by other methods such as applying a resin.
射出成形法によりワイヤドツトプリンタヘッドを製作す
るに際し、コイルに各部品を一体に固着する封入樹脂よ
りガラス転移点の低い樹脂層を設けて封入樹脂を射出す
るようにしたので、コイルと高温高圧で射出される封入
樹脂との直接的な接触が防止され、かつ封止樹脂の高温
が断熱されてコイルを保護することができるため、ワイ
ヤドツトプリンタヘッドの製作過程におけるコイルの断
線をなくすことができる。また、製作されたワイヤドツ
トプリンタヘッドは、封入樹脂の加熱により樹脂層が溶
融または軟化してコイルに密着しているので、動作時の
コイルの発熱を有効に放熱して、プリンタヘッドの誤動
作を防止する効果がある。When manufacturing the wire dot printer head using the injection molding method, we created a resin layer with a lower glass transition point than the encapsulating resin that fixes each part to the coil, and then injected the encapsulating resin. This prevents direct contact with the encapsulating resin and protects the coil by insulating the high temperature of the encapsulating resin, thereby eliminating the possibility of coil breakage during the manufacturing process of the wire dot printer head. In addition, in the manufactured wire dot printer head, the resin layer melts or softens due to heating of the encapsulated resin and adheres closely to the coil, so heat generated by the coil during operation is effectively dissipated, preventing printer head malfunction. It has the effect of
第１図ないし第５図はこの発明の詳細な説明図で、第１
図（Ａ）および（Ｂ）図はそれぞれワイヤドツトプリン
タヘッドの構成を示す平面図および断面で示した正面図
、第２図はその一部を拡大して示した断面図、第３図は
製作工程における樹脂層を設けたコイルの図、第４図は
封入樹脂の射出充填を説明するための工程図、第５図（
Ａ）および（Ｂ）図は樹脂の作用を説明するための図、
第６図（Ａ）および（Ｂ）図はそれぞれ従来のワイヤド
ツトプリンタヘッドの構成を示す一部切欠平面図および
断面で示した正面図である。Figures 1 to 5 are detailed explanatory diagrams of this invention.
Figures (A) and (B) are a plan view and a front view showing the configuration of the wire dot printer head, respectively, Figure 2 is a cross-sectional view showing a part of it enlarged, and Figure 3 is the manufacturing process. Figure 4 is a diagram of a coil provided with a resin layer, Figure 4 is a process diagram for explaining the injection filling of the encapsulating resin, and Figure 5 is a diagram of a coil provided with a resin layer.
A) and (B) are diagrams for explaining the action of resin,
FIGS. 6A and 6B are a partially cutaway plan view and a sectional front view showing the structure of a conventional wire dot printer head, respectively.
Claims (4)
複数のコアピンに各別にボビンを介して装着された複数
コイルを有し、上記放熱体の内側に配設されるソレノイ
ドと、上記複数のコイルに接続される回路パターンが形
成された回路基板と、上記複数のコアピンの先端部を突
出させて上記ソレノイドを上記回路基板および放熱体と
ともに一体に固着する封入樹脂とを具備し、上記ソレノ
イドの各コイルを上記封入樹脂よりガラス転移点の低い
樹脂層で上記封入樹脂から隔離したことを特徴とするワ
イヤドットプリンタヘッド。(1) A heat radiator, a core pin arranged in an annular shape, and a plurality of coils respectively attached to the plurality of core pins via bobbins, and a solenoid disposed inside the heat radiator, The solenoid includes a circuit board on which a circuit pattern connected to the coil is formed, and an encapsulating resin that causes the tips of the plurality of core pins to protrude and fixes the solenoid together with the circuit board and the heat sink. A wire dot printer head characterized in that each coil is isolated from the encapsulating resin by a resin layer having a glass transition point lower than that of the encapsulating resin.
複数のコイルに対して各別に封入樹脂よりガラス転移点
の低い樹脂層を形成する工程と、上記コイルを上記複数
のコアピンに装着する工程と、このコイルの装着された
ソレノイドを放熱体および回路基板とともに樹脂封入成
形金型のキャビティに装着にしたのち、上記キャビティ
に上記封入樹脂を射出して上記ソレノイドを上記放熱体
および回路基板とともに一体に固着する工程とからなる
ことを特徴とするワイヤドットプリンタヘッドの製作方
法。(2) forming a resin layer having a lower glass transition point than the encapsulating resin on each of the plurality of coils to be separately attached to the plurality of core pins of the solenoid; and a step of attaching the coils to the plurality of core pins. After the solenoid equipped with the coil is mounted together with a heat radiator and a circuit board in a cavity of a resin-filled mold, the encapsulating resin is injected into the cavity to integrate the solenoid with the heat radiator and circuit board. A method for manufacturing a wire dot printer head, characterized by comprising a step of fixing the head.
ことを特徴とする特許請求の範囲第２項記載のワイヤド
ットプリンタヘッドの製作方法。(3) A method for manufacturing a wire dot printer head according to claim 2, characterized in that the resin layer is formed by wrapping a resin tape around the coil.
した封入樹脂により溶融させることを特徴とする特許請
求の範囲第３項記載のワイヤドットプリンタヘッドの製
作方法。(4) A method for manufacturing a wire dot printer head according to claim 3, characterized in that the resin tape wound around the coil is melted by the encapsulating resin injected into the cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14711886A JPS634961A (en) | 1986-06-25 | 1986-06-25 | Wire dot printing head and its preparation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14711886A JPS634961A (en) | 1986-06-25 | 1986-06-25 | Wire dot printing head and its preparation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS634961A true JPS634961A (en) | 1988-01-09 |
| JPH0422432B2 JPH0422432B2 (en) | 1992-04-17 |
Family
ID=15422937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14711886A Granted JPS634961A (en) | 1986-06-25 | 1986-06-25 | Wire dot printing head and its preparation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS634961A (en) |
-
1986
- 1986-06-25 JP JP14711886A patent/JPS634961A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0422432B2 (en) | 1992-04-17 |
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