JPS6348689Y2 - - Google Patents

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Publication number
JPS6348689Y2
JPS6348689Y2 JP15268685U JP15268685U JPS6348689Y2 JP S6348689 Y2 JPS6348689 Y2 JP S6348689Y2 JP 15268685 U JP15268685 U JP 15268685U JP 15268685 U JP15268685 U JP 15268685U JP S6348689 Y2 JPS6348689 Y2 JP S6348689Y2
Authority
JP
Japan
Prior art keywords
plating
plating liquid
weir plate
hoop
plating tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15268685U
Other languages
Japanese (ja)
Other versions
JPS6260257U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15268685U priority Critical patent/JPS6348689Y2/ja
Publication of JPS6260257U publication Critical patent/JPS6260257U/ja
Application granted granted Critical
Publication of JPS6348689Y2 publication Critical patent/JPS6348689Y2/ja
Expired legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)
  • Control Of Non-Electrical Variables (AREA)

Description

【考案の詳細な説明】 「産業上の利用分野」 本考案は、例えば電気機械器具のコネクターの
ような部品が串の歯状に連なつたフープ状の材料
の一部にメツキするメツキ槽において、該メツキ
槽のメツキ液面を一定のレベルに調整するための
メツキ液面制御装置に関するものである。即ち、
このようなフープ状材料は、その全面にでなく先
端の一部にのみメツキする必要がある場合が少な
くなく、このような場合には、メツキする必要が
ある下端部分を一定の長さだけメツキ液に浸さな
ければならず、しかもフープ状材料によつてメツ
キ液に浸すべき部分の長さが異なるので、メツキ
液面の調整が必要となるのである。
[Detailed description of the invention] "Industrial application field" The present invention is applied to a plating tank in which a part of a hoop-shaped material, such as a connector of an electrical machine appliance, is plated in a row like the teeth of a skewer. This invention relates to a plating liquid level control device for adjusting the plating liquid level in the plating tank to a constant level. That is,
It is often necessary to plate only a part of the tip of such a hoop-shaped material, rather than the entire surface, and in such cases, it is necessary to plate only a certain length of the lower end that needs to be plated. Since the length of the part to be immersed in the plating solution differs depending on the hoop-shaped material, the level of the plating solution must be adjusted.

「従来の技術」 この主のメツキ槽は、メツキすべきフープ状材
料を略水平状態でメツキ槽内を通過させ、メツキ
槽内にメツキ液を供給しながら主として前記フー
プ状材料の通過方向に沿う側壁より前記メツキ液
をオーバーフローさせることにより、フープ状材
料の通過姿勢における所要の部分をメツキ液に浸
すように構成されている。
``Prior Art'' This main plating tank allows a hoop-shaped material to be plated to pass through the plating tank in a substantially horizontal state, and while supplying a plating liquid into the plating tank, the hoop-shaped material is passed mainly along the passing direction of the hoop-shaped material. By overflowing the plating liquid from the side wall, a required portion of the hoop-shaped material in the passing posture is immersed in the plating liquid.

従来のメツキ液面の制御は、メツキ液をオーバ
ーフローさせる側壁のオーバーフローレベルと、
フープ状材料の通過レベルを一定にしておき、メ
ツキ液の槽をジヤツキ等で少しく上昇又は下降さ
せることにより、フープ状材料がメツキ液に浸さ
れる部分の深さ(長さ)を調節したり、メツキ液
をオーバーフローさせる側壁へせき板を水平に取
付けるガイドを設け、僅かに高さの異なるせき板
を数種類用意し、このせき板をその都度交換する
ことによりメツキ液面を調節していた。
Conventional plating liquid level control is based on the overflow level of the side wall that causes the plating liquid to overflow,
By keeping the passage level of the hoop-shaped material constant and slightly raising or lowering the plating liquid tank with a jack, etc., the depth (length) of the part where the hoop-shaped material is immersed in the plating liquid can be adjusted. A guide was provided to horizontally attach the weir plate to the side wall where the plating liquid overflowed, and several types of weir plates with slightly different heights were prepared, and the plating liquid level was adjusted by replacing the weir plate each time.

「考案が解決しようとする問題点」 前記従来の手段において、メツキ槽をジヤツキ
等で水平姿勢のまま昇降させるのは設備費が高価
につく欠点があり、また、せき板をその都度交換
するのは手間がかかるとともに面倒であり、せき
板を数種類用意するのでそれだけ高価につく欠点
があつた。
``Problems to be Solved by the Invention'' In the conventional means described above, raising and lowering the plating tank in a horizontal position using jacks or the like has the drawback of high equipment costs, and the need to replace the weir plates each time. This method is time-consuming and troublesome, and has the disadvantage that it is expensive because several types of weir boards are prepared.

本考案の目的は、より簡単な設備で容易にメツ
キ液面を調節することができる制御装置を安価で
提供することにある。
An object of the present invention is to provide an inexpensive control device that can easily adjust the plating liquid level with simpler equipment.

「問題点を解決するための手段」 メツキ液をオーバーフローさせるメツキ槽の側
壁へ接してスライド可能なせき板を取つけ、該せ
き板へ略水平方向にメツキ液のオーバーフロー部
を設け、前記せき板をスライドさせて前記オーバ
ーフロー部のレベルを調整するように構成したこ
とである。
"Means for solving the problem" A slideable weir plate is installed in contact with the side wall of the plating tank in which the plating liquid overflows, an overflow portion of the plating liquid is provided in the approximately horizontal direction on the weir plate, and the weir plate The level of the overflow portion is adjusted by sliding the overflow portion.

「作用」 せき板を下げるとメツキ液面のレベルは下つた
レベルに保たれ、フープ状材料の下端部のメツキ
液に沈む深さ(長さ)は小さくなり、せき板を上
げるとメツキ液面のレベルは上昇したレベルに保
たれ、フープ材料の下端部のメツキ液に沈む深さ
は大きくなる。
"Function" When the weir plate is lowered, the plating liquid level is maintained at a lower level, and the depth (length) of the lower end of the hoop-shaped material submerged in the plating liquid becomes smaller, and when the weir plate is raised, the plating liquid level is kept at a lower level. is maintained at an elevated level and the depth of the lower end of the hoop material submerged in the plating liquid is increased.

「実施例」 以下図面を参照して本考案の好適な実施例を説
明する。
"Embodiments" Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

1は合成樹脂製のメツキ槽で、底部にドレン孔
21(第2図)を有する合成樹脂製の外槽2の内
部にやや浮上した状態で略水平に据えられてい
る。
Reference numeral 1 denotes a plating tank made of synthetic resin, which is placed substantially horizontally in a slightly floating state inside an outer tank 2 made of synthetic resin which has a drain hole 21 (FIG. 2) at the bottom.

メツキ槽1及び外槽2には、フープ状材料(通
電コネクターや端子等の肉薄の部品が串の歯状に
連なつた帯状の材料)aの通過方向と交差する壁
部12,22に切欠きによる材料通過部13,2
3がそれぞれ形成されている。これらの通過部1
3,23は、切欠きでなく窓孔状のものでもよ
い。
The plating tank 1 and the outer tank 2 have walls 12 and 22 cut into walls 12 and 22 that intersect with the passing direction of the hoop-shaped material (a band-shaped material in which thin parts such as current-carrying connectors and terminals are connected in the shape of skewer teeth). Material passing portions 13 and 2 due to chipping
3 are formed respectively. These passage parts 1
3 and 23 may be window holes instead of notches.

メツキ槽1のフープ状材料aの通過方向に沿う
側壁11の上端11aは、槽1内のメツキ液をオ
ーバーフローさせるためにその大半部が材料aの
通過レベル(第1図のフープ状材料aの下端)と
略同じか又はそれよりやや低く形成され、その外
側面には、水平方向へスリツト状のオーバーフロ
ー部30を有するせき板3がスライド可能に取付
けられている。このオーバーフロー部30は、せ
き板3の上下方向中央よりやや上方に形成するの
が望ましく、また、液切りを良くするため外側へ
断面末広状に形成するのが望ましい。
The upper end 11a of the side wall 11 along the passage direction of the hoop-shaped material a of the plating tank 1 is located at the level where the plating solution in the plating tank 1 overflows. A weir plate 3 having a horizontally slit-shaped overflow portion 30 is slidably attached to its outer surface. This overflow portion 30 is preferably formed slightly above the center of the weir plate 3 in the vertical direction, and is preferably formed in a cross-sectional shape that widens outward to improve drainage.

前記せき板3は、側壁11の両端部の立上り部
14へ垂直に形成された相対する溝状のガイド3
1へその両端が案内された状態に設けられ、ガイ
ド31に沿つて上下にスライドするようになされ
ている。せき板3には所定間隔に吊ボルト32が
固定され、この吊ボルト32を前記立上り部14
の上端にねじ止めされた支持フレーム33の孔3
4に通し、支持フレーム33の上面に突出した部
分にナツト35をねじ合せ、このナツト35をい
ずれかの方向へ回すことにより、せき板3が上昇
又は下降するように構成されている。
The weir plate 3 has opposing groove-shaped guides 3 formed perpendicularly to the rising portions 14 at both ends of the side wall 11.
Both ends of the umbilicus 1 are guided and are configured to slide up and down along a guide 31. Hanging bolts 32 are fixed to the weir plate 3 at predetermined intervals, and these hanging bolts 32 are connected to the rising portion 14.
Hole 3 of support frame 33 screwed to the upper end of
4, and a nut 35 is screwed onto a portion protruding from the upper surface of the support frame 33, and by turning this nut 35 in either direction, the weir plate 3 is raised or lowered.

せき板3のオーバーフロー部30は、前記のよ
うにスリツ状でなく、上方へ向けてU字状に切欠
いたものでも実施することができる。更に、一方
の側壁11の上端11a高レベルに設定し、上端
11aを低レベルに設定した他方の側壁11にの
みせき板3を設けても実施することができる。
The overflow portion 30 of the sheathing 3 may be U-shaped notched upward instead of being slit-shaped as described above. Furthermore, the sheathing 3 may be provided only on the side wall 11 whose upper end 11a is set at a high level and whose upper end 11a is set at a low level.

メツキ液は、図示しないタンクからポンプによ
り、外槽2及びメツキ槽1の底部を貫通した配管
4、メツキ槽1の底に位置するL形管継手5を介
して供給管6へ供給され、供給管6へ所定の狭い
ピツチでやや下向きに形成された多数のノズル6
1よりメツキ槽1内に供給され、槽1内を上昇し
ながら槽内1に略水平に設けられた孔開き板7
(又は網)によりその勢いが緩和された状態で所
定の液面レベルbに達する。そして、槽1内のメ
ツキ液は、せき板3のオーバーフロー部30のレ
ベルによつて規定された所定の液面レベルbを維
持しながら、順次オーバーフロー部30より外槽
2へオーバーフローし、外槽2のドレン孔21、
図示しないドレン配管を経てもとのタンクに還流
される。
The plating liquid is supplied from a tank (not shown) to a supply pipe 6 via a pipe 4 penetrating the outer tank 2 and the bottom of the plating tank 1, and an L-shaped pipe joint 5 located at the bottom of the plating tank 1. A large number of nozzles 6 are formed slightly downwardly at a predetermined narrow pitch into the pipe 6.
A perforated plate 7 is supplied into the plating tank 1 from 1 and is provided approximately horizontally in the tank 1 while rising inside the tank 1.
The predetermined liquid level b is reached in a state where the force is relaxed by the liquid (or the net). Then, the plating liquid in the tank 1 sequentially overflows from the overflow part 30 to the outer tank 2 while maintaining a predetermined liquid level b defined by the level of the overflow part 30 of the weir plate 3. 2 drain hole 21,
The water is returned to the original tank via a drain pipe (not shown).

液面レベルbを第1図の場合より上方へ調整す
るには、ナツト35を回してせき板3を上昇さ
せ、また、下方へ調整するにはナツト35を逆に
回してせき板3を下降させればよい。
To adjust the liquid level b upwards from the case shown in Fig. 1, turn the nut 35 to raise the weir plate 3, and to adjust it downward, turn the nut 35 in the opposite direction to lower the weir plate 3. Just let it happen.

側壁11又はせき板3には、フープ状材料aの
通過レベル(第1図の材料aの下端)からオーバ
ーフロー部30のレベルまでの高さが何ミリであ
るかを示す図示しない目盛を表示するのが好まし
く、その場合には、該目盛が外槽2の外側から見
えるように構成する。
A scale (not shown) is displayed on the side wall 11 or the weir plate 3 to indicate how many millimeters is the height from the passage level of the hoop-shaped material a (the lower end of the material a in FIG. 1) to the level of the overflow part 30. It is preferable that the scale be visible from the outside of the outer tank 2.

8はメツキ槽1における材料aの通過部13に
設けられた材料の走行ガイドで、材料1が接する
部分81は断面円弧状に形成された耐摩耗部材
(ガラス、陶磁製部材)より構成されている。
Reference numeral 8 denotes a material traveling guide provided in the passage section 13 of the material a in the plating tank 1, and the portion 81 in contact with the material 1 is made of a wear-resistant member (glass, ceramic member) formed with an arcuate cross section. There is.

「考案の効果」 本考案に係るメツキ液面制御装置は、メツキ液
をオーバーフローさせるメツキ槽の側壁へ接して
スライド可能なせき板を取つけ、該せき板へ略水
平方向にメツキのオーバーフロー部を設け、前記
せき板をスライドさせて前記オーバーフロー部の
レベルを調整するように構成したものであるか
ら、簡単かつ安価に製造することができるととも
に、メツキ液面の変更調節が正確にかつ極めて簡
単に行なわれ、液面レベル変更の都度せき板を交
換する必要がない。
"Effect of the invention" The plating liquid level control device according to the present invention has a slideable weir plate attached in contact with the side wall of the plating tank where the plating liquid overflows, and the overflow part of the plating is applied to the weir plate in a substantially horizontal direction. Since the structure is such that the level of the overflow part is adjusted by sliding the weir plate, it can be easily and inexpensively manufactured, and the liquid level can be adjusted accurately and extremely easily. There is no need to replace the weir plate every time the liquid level changes.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る液面制御装置の一例を示
す縦断面図、第2図は第1図の装置の中央部を縦
断した一部断面図、第3図はせき板を支持するた
めのフレームを除いた状態の一部平面図である。 図中主要符号の説明、1はメツキ槽、11は側
壁、13は材料通過部、14は立上り部、3はせ
き板、30はオーバーフロー部、31は溝状のガ
イド、32は吊ボルト、33は支持フレーム、3
5はナツト、aはフープ状材料、bはメツキ液面
レベルである。
Fig. 1 is a vertical cross-sectional view showing an example of a liquid level control device according to the present invention, Fig. 2 is a partial cross-sectional view taken longitudinally through the center of the device shown in Fig. 1, and Fig. 3 is a vertical cross-sectional view showing an example of a liquid level control device according to the present invention. FIG. 3 is a partial plan view with the frame removed. Explanation of main symbols in the figure: 1 is the plating tank, 11 is the side wall, 13 is the material passage part, 14 is the rising part, 3 is the weir plate, 30 is the overflow part, 31 is the groove-shaped guide, 32 is the hanging bolt, 33 is the support frame, 3
5 is a nut, a is a hoop-shaped material, and b is a plating liquid level.

Claims (1)

【実用新案登録請求の範囲】 (1) メツキすべきフープ状材料を略水平状態でメ
ツキ槽内を通過させ、メツキ槽内にメツキ液を
供給しながら主として前記フープ状材料の通過
方向に沿う側壁より前記メツキ液をオーバーフ
ローさせることにより、フープ状材料の通過姿
勢における所要の部分をメツキ液に浸すように
構成されたメツキ槽において、メツキ液をオー
バーフローさせる前記側壁へ接してスライド可
能なせき板を取つけ、該せき板へ略水平方向に
メツキ液のオーバーフロー部を設け、前記せき
板をスライドさせて前記オーバーフロー部のレ
ベルを調整するごとく構成したことを特徴とす
るメツキ槽におけるメツキ液面制御装置。 (2) メツキ液をメツキ槽におけるフープ状材料の
通過方向に沿う両側壁よりオーバーフローさせ
る、実用新案登録請求の範囲第1項に記載のメ
ツキ槽におけるメツキ液面制御装置。 (3) 側壁の両端部分の一方の面へ相対向した溝状
のガイドを垂直方向に設け、前記溝状のガイド
へせき板の両端を案内させ、該せき板に吊ボル
トを固定し、該吊ボルトを上方へ設けられた支
持フレームに形成された孔に通して該支持フレ
ームの上方へ突出させ、この突出した部分にナ
ツトをねじ合せた、実用新案登録請求の範囲第
1項に記載のメツキ槽におけるメツキ液面制御
装置。 (4) せき板のオーバーフロー部が水平方向へ形成
されたスリツトである、実用新案登録請求の範
囲第1項に記載のメツキ槽におけるメツキ液面
制御装置。
[Claims for Utility Model Registration] (1) A hoop-shaped material to be plated is passed through a plating tank in a substantially horizontal state, and while a plating liquid is supplied into the plating tank, a side wall mainly extends along the passing direction of the hoop-shaped material. In a plating tank configured to immerse a required portion of the hoop-shaped material in the plating liquid in a passing posture by causing the plating liquid to overflow, a weir plate that is slidable in contact with the side wall where the plating liquid overflows is provided. A plating liquid level control device in a plating tank, characterized in that an overflow part of the plating liquid is provided in the weir plate in a substantially horizontal direction, and the level of the overflow part is adjusted by sliding the weir plate. . (2) A plating liquid level control device in a plating tank according to claim 1, which causes the plating liquid to overflow from both side walls along the passage direction of the hoop-shaped material in the plating tank. (3) Provide groove-shaped guides facing each other in the vertical direction on one surface of both end portions of the side wall, guide both ends of the weir plate to the groove-shaped guide, fix hanging bolts to the shear plate, and A utility model according to claim 1, wherein a hanging bolt is passed through a hole formed in a support frame provided upward and projects upward from the support frame, and a nut is screwed into this projecting portion. A plating liquid level control device in a plating tank. (4) The plating liquid level control device in a plating tank according to claim 1 of the utility model registration claim, wherein the overflow portion of the weir plate is a slit formed in the horizontal direction.
JP15268685U 1985-10-06 1985-10-06 Expired JPS6348689Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15268685U JPS6348689Y2 (en) 1985-10-06 1985-10-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15268685U JPS6348689Y2 (en) 1985-10-06 1985-10-06

Publications (2)

Publication Number Publication Date
JPS6260257U JPS6260257U (en) 1987-04-14
JPS6348689Y2 true JPS6348689Y2 (en) 1988-12-14

Family

ID=31070887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15268685U Expired JPS6348689Y2 (en) 1985-10-06 1985-10-06

Country Status (1)

Country Link
JP (1) JPS6348689Y2 (en)

Also Published As

Publication number Publication date
JPS6260257U (en) 1987-04-14

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