JPS6347891Y2 - - Google Patents
Info
- Publication number
- JPS6347891Y2 JPS6347891Y2 JP1981064232U JP6423281U JPS6347891Y2 JP S6347891 Y2 JPS6347891 Y2 JP S6347891Y2 JP 1981064232 U JP1981064232 U JP 1981064232U JP 6423281 U JP6423281 U JP 6423281U JP S6347891 Y2 JPS6347891 Y2 JP S6347891Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- integrated circuit
- circuit board
- printed circuit
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003973 paint Substances 0.000 claims description 8
- 239000005011 phenolic resin Substances 0.000 claims description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 230000007257 malfunction Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
【考案の詳細な説明】
本考案は廉価で高品質の、駆動回路を有した表
示装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an inexpensive, high-quality display device having a drive circuit.
古くから基板の一面又は両面に表示部と駆動用
の集積回路とを載置し小型で使いやすい表示装置
を組み立てていたが、それらの表示装置の基板は
概ねセラミツク基板であつた。ところがセラミツ
ク基板は高価である上に割れやすい。そこで近年
第１図に示すように積層樹脂基台からなるプリン
ト基板２０１を利用する試みがなされているが、
遮光体と熱膨張係数との関係から、製作後誤動作
とか素子剥離等の不良が大量に生じていた。 For a long time, small and easy-to-use display devices have been assembled by mounting a display section and a driving integrated circuit on one or both sides of a substrate, but the substrates of these display devices were generally ceramic substrates. However, ceramic substrates are expensive and break easily. Therefore, in recent years, attempts have been made to use a printed circuit board 201 made of a laminated resin base as shown in FIG.
Due to the relationship between the light shield and the coefficient of thermal expansion, many defects such as malfunctions and element peeling occurred after manufacturing.
この不良を詳細に説明する。駆動回路を形成す
る集積回路は、すでにモールドされた例えばフラ
ツトパツケージ体のものを用いるよりも、第１図
の如く集積回路素子２３１をプリント基板２０１
に直接載置した方が小さくできるし機能の選択を
行ないやすい。ところが、表示部２０２（露出し
た状態でパネル等に取りつけられる）が近いの
で、外光がもれて集積回路素子２３１にあたり、
その光エネルギーで回路が誤動作する。これを防
ぐのに、表側は樹脂モールド等するが、樹脂モー
ルドするとその樹脂とプリント基板との熱膨張係
数の差から集積回路素子に応力が加わり、機械的
不良（例えば断線や素子剥離）を生じやすい。そ
こで図示した如く遮光枠体２３３等で覆うとこの
欠点を解消できる。一方裏側には黒色基板を用い
るとよい。ところがプリント基板２０１が黒色ガ
ラスエポキシ基板の時は特性に問題はないが汎用
プリント基板の倍以上高価である。そこで廉価な
フエノール樹脂系の基板を黒色にすると、プリン
ト基板２０１が小さいうちはいいが、一辺が７cm
以上になると基板が反り、特に集積回路素子２３
１の配線（ワイヤボンド）ができなくなる。基板
そのものを黒色にするのでなく、集積回路素子２
３１の載置された反対の面全面にレジスト又はテ
ープを貼ると、基板そのものを黒色にした時より
ももつと反つてしまい不都合である。 This defect will be explained in detail. Rather than using an integrated circuit that forms the drive circuit in a flat package, for example, which has already been molded, the integrated circuit element 231 is mounted on the printed circuit board 201 as shown in FIG.
If it is placed directly on the screen, it can be made smaller and it is easier to select functions. However, since the display section 202 (attached to a panel or the like in an exposed state) is close, external light leaks and hits the integrated circuit element 231.
The light energy causes the circuit to malfunction. To prevent this, the front side is molded with resin, etc., but when resin molded, stress is applied to the integrated circuit element due to the difference in thermal expansion coefficient between the resin and the printed circuit board, resulting in mechanical failure (for example, wire breakage or element peeling). Cheap. Therefore, this drawback can be overcome by covering it with a light-shielding frame 233 or the like as shown. On the other hand, it is preferable to use a black substrate on the back side. However, when the printed circuit board 201 is a black glass epoxy board, there is no problem with the characteristics, but it is more than twice as expensive as a general-purpose printed circuit board. Therefore, if the inexpensive phenolic resin board is made black, it will be fine as long as the printed circuit board 201 is small, but the side length is 7 cm.
If the temperature exceeds the limit, the board will warp, especially the integrated circuit element 23.
1 wiring (wire bond) will not be possible. Rather than making the board itself black, the integrated circuit element 2
If a resist or tape is applied to the entire surface opposite to that on which the board 31 is placed, it is inconvenient that it will warp more easily than if the board itself was made black.
本考案はこのような点を考慮してなされたもの
で、以下実施例に基づいて本考案を詳細に説明す
る。 The present invention has been developed with these points in mind, and will be described in detail below based on examples.
第２図は本考案実施例の表示装置の断面図で、
１は銅箔１１，１１，…，１１を積層した紙フエ
ノール樹脂基台からなるプリント基板で、両端に
はピン１２，１２を貫通させる事で端子部を形成
している。２は発光ダイオード２２を光源として
表示部で、発光ダイオード２２をプリント基板１
上に載置固着し、白色樹脂等からなる反射枠２１
で囲み、光拡散シート２３を敷設する事で表示面
一杯に均一な輝度としている。３は回路部で、シ
リコン等からなる集積回路素子３１をプリント基
板１の上に載置固着し、金属細線３２，３２で配
線を施こし、セラミツク等の遮光性の枠体３３で
覆つてある。４は遮光性被膜で、集積回路素子３
１の背面に対応するプリント基板１の面に印刷し
てある。この遮光性被膜４は集積回路素子３１を
載置してある銅箔１１の近傍の、銅箔がない部分
１３，１３の真下を覆うように設けられ、例えば
厚さ0.8mmのプリント基板１において、集積回路
素子３１を載置してある銅箔１１が直径８mmの円
形をなし、銅箔がない部分１３，１３の巾が２mm
である場合、遮光性被膜４は内径２mm外径18mmの
ドーナツ形をなしている。またこの遮光性被膜４
は厚みが7μｍのブチルセロソルブアセテートか
らなる黒色のスタンプ塗料で、この表示装置の品
番等と共に、表示装置の組立完成後スタンプ印刷
される。このようなスタンプ塗料は、厚みがうす
くても一見黒くは見えるが、レジストと異なり遮
光性が変化する。スタンプ塗料を用いる場合は黒
色、緑色、赤色のいずれかを用いる事が好ましい
が、必ず5μｍ以上の厚みを設けないと、外光が
強い時に集積回路素子３１が誤動作する。スタン
プ印刷以外でも塗布できないわけではないが、上
述の如く部分的に塗布するので、マスク等を必要
とするから、好ましくない。これにより表示部近
傍から入射してきた外光がプリント基板１を通過
して枠体３３の内部に侵入しようとすると遮光性
被膜４若しくは銅箔１１により遮ぎられ、集積回
路素子３１が誤動作する程の光量（又は光の強
さ）には至らない。また遮光性被膜４は基板面に
対し部分的にしか設けられていないので、遮光性
被膜４のために基板１が反ることもない。 FIG. 2 is a sectional view of a display device according to an embodiment of the present invention.
Reference numeral 1 denotes a printed circuit board consisting of a paper phenol resin base on which copper foils 11, 11, . . . 2 is a display section using a light emitting diode 22 as a light source; the light emitting diode 22 is connected to a printed circuit board 1;
A reflective frame 21 made of white resin or the like is placed and fixed on top.
By surrounding the screen with a light diffusing sheet 23, uniform brightness is achieved over the entire display surface. 3 is a circuit section, in which an integrated circuit element 31 made of silicon or the like is placed and fixed on the printed circuit board 1, wired with thin metal wires 32, 32, and covered with a light-shielding frame 33 made of ceramic or the like. . 4 is a light-shielding film that covers the integrated circuit element 3;
1 is printed on the surface of the printed circuit board 1 corresponding to the back surface of the printed circuit board 1. This light-shielding film 4 is provided so as to cover directly below the parts 13, 13 where there is no copper foil near the copper foil 11 on which the integrated circuit element 31 is mounted. , the copper foil 11 on which the integrated circuit element 31 is placed has a circular shape with a diameter of 8 mm, and the width of the parts 13, 13 where there is no copper foil is 2 mm.
In this case, the light-shielding coating 4 has a donut shape with an inner diameter of 2 mm and an outer diameter of 18 mm. In addition, this light-shielding coating 4
is a black stamp paint made of butyl cellosolve acetate with a thickness of 7 μm, and is stamped together with the product number of the display device after the display device is assembled. Stamp paints like this look black at first glance even if they are thin, but unlike resists, their light-shielding properties change. When using stamp paint, it is preferable to use either black, green, or red, but if the thickness is not necessarily 5 μm or more, the integrated circuit element 31 will malfunction under strong external light. Although it is not possible to apply by other methods than stamp printing, it is not preferable because it is applied partially as described above and requires a mask or the like. As a result, if external light entering from near the display section passes through the printed circuit board 1 and attempts to enter the frame 33, it will be blocked by the light-shielding coating 4 or the copper foil 11, causing the integrated circuit element 31 to malfunction. The amount of light (or light intensity) cannot be reached. Furthermore, since the light-shielding coating 4 is provided only partially on the substrate surface, the substrate 1 will not warp due to the light-shielding coating 4.
第３図は本考案の他の実施例を示す表示装置の
断面図である。１０１は第２図と同様紙フエノー
ル樹脂からなるプリント基板である。１０２は
TN型の液晶表示器１２４を有した表示部で、導
電ゴム１２５，１２５によつて液晶表示器１２４
とプリント基板１０１との電気的接続を行なつて
おり、外枠１２６，１２６によつて相互に固定さ
れている。１３１は集積回路素子、１３３はその
集積回路素子１３１を覆う枠体で、接着剤１３
４，１３４によりプリント基板１０１上に固着し
てある。１３５はコンデンサ、１３６は水晶振動
子で、いずれも集積回路素子１３１に付属する電
子部品である。１０４は遮光性被膜であるが、こ
れはエチルセロソルブアセテートからなる黒色の
スタンプ塗料で、枠体１３３の背面に対応するプ
リント基板１の面に印刷されているが、印刷直後
の生乾き状態において水晶振動子１３６を密着さ
せる事により、水晶振動子１３６の固定を行なつ
ている。 FIG. 3 is a sectional view of a display device showing another embodiment of the present invention. 101 is a printed circuit board made of paper phenol resin as in FIG. 102 is
The display unit has a TN type liquid crystal display 124, and the liquid crystal display 124 is connected by conductive rubber 125, 125.
and the printed circuit board 101, and are fixed to each other by outer frames 126, 126. 131 is an integrated circuit element; 133 is a frame that covers the integrated circuit element 131;
4,134 is fixed on the printed circuit board 101. 135 is a capacitor, and 136 is a crystal resonator, both of which are electronic components attached to the integrated circuit element 131. The light-shielding film 104 is a black stamp paint made of ethyl cellosolve acetate, and is printed on the surface of the printed circuit board 1 corresponding to the back surface of the frame 133. The crystal resonator 136 is fixed by bringing the child 136 into close contact with the crystal resonator 136.
以上の如く本考案は、フエノール樹脂系のプリ
ント基板と、そのプリント基板の面又は前面に設
けられた表示部と、プリント基板に載置固着され
た枠体等で覆われた集積回路素子と、プリント基
板の集積回路が固着された反対側の面であつて集
積回路素子の背面に対応する位置、言い換えると
少なくとも集積回路素子の近傍であつて導体等の
遮光物が存在しない部分に対応する基板裏面であ
つてかつ基板の全面に及ばない様部分的に設けら
れた遮光性被膜とを具備した表示装置であるか
ら、光の侵入を防ぎしかも基板の反りがないの
で、廉価であるにもかかわらず誤動作等の不良を
生じない。 As described above, the present invention includes a phenolic resin-based printed circuit board, a display section provided on the surface or front of the printed circuit board, and an integrated circuit element covered with a frame mounted and fixed on the printed circuit board. The surface of the printed circuit board on the opposite side to which the integrated circuit is fixed, and the position corresponding to the back surface of the integrated circuit element, in other words, the board corresponding to at least the part near the integrated circuit element where there is no light shielding object such as a conductor. Since the display device is equipped with a light-shielding coating that is partially provided on the back side and does not cover the entire surface of the substrate, it prevents light from entering and the substrate does not warp, so it is inexpensive. No defects such as malfunctions will occur.
第１図は従来の表示装置の断面図、第２図と第
３図は本考案実施例の表示装置の断面図である。
１，１０１……プリント基板、２，１０２……
表示部、３１，１３１……集積回路素子、３３，
１３３……枠体、４，１０４……遮光性被膜。
FIG. 1 is a sectional view of a conventional display device, and FIGS. 2 and 3 are sectional views of a display device according to an embodiment of the present invention. 1,101...Printed circuit board, 2,102...
Display section, 31, 131... integrated circuit element, 33,
133...Frame body, 4,104...Light-shielding coating.
Claims (1)
リント基板の面又は前面に設けられた表示部
と、プリント基板に載置固着され枠体等で覆わ
れた集積回路素子と、プリント基板の集積回路
素子が固着された反対側の面であつて集積回路
素子の背面に対応する位置に部分的に設けられ
た遮光性塗料被膜とを具備した事を特徴とする
表示装置。 (2) 前記遮光性塗料被膜は厚さ5μｍ以上のスタ
ンプ塗料から成る事を特徴とする前記実用新案
登録請求の範囲第１項記載の表示装置。 (3) 前記遮光性塗料被膜は前記集積回路素子に付
属する電子部品を固着する接着剤である事を特
徴とする前記実用新案登録請求の範囲第１項記
載の表示装置。[Scope of claim for utility model registration] (1) A phenolic resin printed circuit board, a display section provided on the surface or front of the printed circuit board, and an integrated circuit mounted and fixed on the printed circuit board and covered with a frame, etc. A display comprising an element and a light-shielding paint film partially provided at a position corresponding to the back surface of the integrated circuit element on the opposite side of the printed circuit board to which the integrated circuit element is fixed. Device. (2) The display device according to claim 1, wherein the light-shielding paint film is made of stamp paint with a thickness of 5 μm or more. (3) The display device according to claim 1, wherein the light-shielding paint film is an adhesive for fixing electronic components attached to the integrated circuit element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981064232U JPS6347891Y2 (en) | 1981-04-30 | 1981-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981064232U JPS6347891Y2 (en) | 1981-04-30 | 1981-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57178278U JPS57178278U (en) | 1982-11-11 |
| JPS6347891Y2 true JPS6347891Y2 (en) | 1988-12-09 |
Family
ID=29860316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981064232U Expired JPS6347891Y2 (en) | 1981-04-30 | 1981-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6347891Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52109897A (en) * | 1976-03-10 | 1977-09-14 | Hitachi Ltd | Liquid crystal display unit |
-
1981
- 1981-04-30 JP JP1981064232U patent/JPS6347891Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52109897A (en) * | 1976-03-10 | 1977-09-14 | Hitachi Ltd | Liquid crystal display unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57178278U (en) | 1982-11-11 |
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