JPS6344439U - - Google Patents
Info
- Publication number
- JPS6344439U JPS6344439U JP13822286U JP13822286U JPS6344439U JP S6344439 U JPS6344439 U JP S6344439U JP 13822286 U JP13822286 U JP 13822286U JP 13822286 U JP13822286 U JP 13822286U JP S6344439 U JPS6344439 U JP S6344439U
- Authority
- JP
- Japan
- Prior art keywords
- section
- wafer
- drying device
- dicing
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001035 drying Methods 0.000 claims description 8
- 238000001291 vacuum drying Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 5
- 238000000034 method Methods 0.000 claims 3
- 238000004140 cleaning Methods 0.000 claims 2
- 239000008188 pellet Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 230000032258 transport Effects 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第１図は本案に係る乾燥装置を備えたダイシン
グ装置の各機構部の配置例を示す平面図、第２図
は本案乾燥装置の構成例図である。
１・１２：カセツトエレベータ部、２・１１：
コンベア部、３：ローデイング部、４：ウエーハ
載置テーブル、５：フアインアライメント部、６
：切断エリア、８：洗浄・水切り部、９：真空乾
燥部、１０：アンローデイング部、９１ａ：乾燥
容器本体、９２：ウエーハ載置ステージ、９３：
真空ポンプ、９４：ヒータ、Ｗ：ウエーハ。
FIG. 1 is a plan view showing an example of the arrangement of mechanical parts of a dicing device equipped with a drying device according to the present invention, and FIG. 2 is a diagram showing an example of the configuration of the drying device according to the present invention. 1/12: Cassette elevator section, 2/11:
Conveyor section, 3: Loading section, 4: Wafer mounting table, 5: Fine alignment section, 6
: Cutting area, 8: Washing/draining section, 9: Vacuum drying section, 10: Unloading section, 91a: Drying container body, 92: Wafer mounting stage, 93:
Vacuum pump, 94: Heater, W: Wafer.
Claims (1)
、洗浄・水切り部により該ウエーハの洗浄付着水
を水切りし、後工程に搬送するようにしたダイシ
ング装置において、該洗浄・水切り部を一次乾燥
装置とすると共に該乾燥装置の次工程部に真空引
きによりウエーハ乾燥を行なう真空乾燥部とした
二次乾燥装置を設けたことを特徴とするダイシン
グ装置。 (2) 二次乾燥装置にはヒータを併設させてなる
実用新案登録請求の範囲第１項記載のダイシング
装置。 (3) ヒータはウエーハ載置ステージに一体的に
設けてなる実用新案登録請求の範囲第２項記載の
ダイシング装置。[Scope of Claim for Utility Model Registration] (1) In a dicing machine that cuts a semiconductor wafer into pellets, removes the water adhering to the wafer from the cleaning process using a cleaning/draining section, and transports the wafer to a subsequent process. - A dicing apparatus characterized in that a secondary drying device is provided, in which a draining section serves as a primary drying device, and a subsequent process section of the drying device serves as a vacuum drying section for drying wafers by vacuuming. (2) The dicing device according to claim 1, wherein the secondary drying device is provided with a heater. (3) The dicing apparatus according to claim 2, wherein the heater is integrally provided with the wafer mounting stage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13822286U JPS6344439U (en) | 1986-09-09 | 1986-09-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13822286U JPS6344439U (en) | 1986-09-09 | 1986-09-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6344439U true JPS6344439U (en) | 1988-03-25 |
Family
ID=31043005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13822286U Pending JPS6344439U (en) | 1986-09-09 | 1986-09-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6344439U (en) |
-
1986
- 1986-09-09 JP JP13822286U patent/JPS6344439U/ja active Pending
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