JPS634351B2 - - Google Patents
Info
- Publication number
- JPS634351B2 JPS634351B2 JP11760680A JP11760680A JPS634351B2 JP S634351 B2 JPS634351 B2 JP S634351B2 JP 11760680 A JP11760680 A JP 11760680A JP 11760680 A JP11760680 A JP 11760680A JP S634351 B2 JPS634351 B2 JP S634351B2
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- fins
- mounting block
- element mounting
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 244000126211 Hericium coralloides Species 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
本発明はフインの取付け構造を改良したヒート
パイプ式ヒートシンクに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat pipe type heat sink with an improved fin mounting structure.
一般にヒートパイプは各種の発熱機器や冷却機
器に用いられているが、近年半導体の冷却装置と
してヒートパイプ式のヒートシンクが用いられる
ようになつて来た。 Generally, heat pipes are used in various heat generating devices and cooling devices, but in recent years, heat pipe type heat sinks have come to be used as cooling devices for semiconductors.
このヒートパイプ式ヒートシンクはヒートパイ
プの一端側に発熱体取付けブロツクを接続し、他
端側に複数枚のフインを取付けた構造のものが多
く用いられている。 This heat pipe type heat sink often has a structure in which a heating element mounting block is connected to one end of the heat pipe and a plurality of fins are attached to the other end.
しかしながら、このような構造のヒートシンク
ではヒートパイプの長手方向に沿つて加熱部と放
熱部とが形成されているため全体の長さが長くな
り装置が大型化する問題がある。 However, in a heat sink having such a structure, since the heating part and the heat radiation part are formed along the longitudinal direction of the heat pipe, there is a problem that the overall length becomes long and the device becomes large.
このため発熱体取付けブロツクを接続した加熱
部の外部空間を有効に利用して小型化を図つたヒ
ートパイプ式ヒートシンクが従来開発されてい
る。 For this reason, a heat pipe type heat sink has been developed which is designed to be miniaturized by effectively utilizing the external space of the heating section to which the heating element mounting block is connected.
このヒートパイプ式ヒートシンクは第１図に示
すようにフイン１にヒートパイプ２を圧入又は拡
管などで挿着して所定のピツチで複数枚のフイン
１を取付け、このヒートパイプ２を、くし歯形に
形成した発熱体取付けブロツク３の凹溝４に、嵌
入した熱伝導性の接着性の接着剤で固定したもの
である。 As shown in Fig. 1, this heat pipe type heat sink consists of inserting heat pipes 2 into fins 1 by press-fitting or expanding them, attaching a plurality of fins 1 at a predetermined pitch, and forming the heat pipes 2 into a comb shape. It is fixed with a thermally conductive adhesive that is fitted into the groove 4 of the heat generating element mounting block 3 that has been formed.
しかるに、この従来構造では、フイン１の下部
を差入れるため発熱体取付けブロツク３に切込み
５を入れてくし歯形に形成しなければならず、極
めて加工がめんどうでコストが高くなり、しかも
ヒートパイプ２に所定のピツチでフイン１を取付
ける作業がめんどうで組立作業性に劣る欠点があ
つた。 However, in this conventional structure, in order to insert the lower part of the fin 1, it is necessary to make a notch 5 in the heating element mounting block 3 and form it into a comb tooth shape, which is extremely troublesome and increases the cost. The disadvantage was that the work of installing the fins 1 at a predetermined pitch was troublesome and the assembly workability was poor.
本発明は、かかる点に鑑み種々研究を行なつた
結果、加工が容易でコストが安く、しかも組立作
業性に優れたヒートパイプ式ヒートシンクを開発
したものである。 The present invention has been made as a result of various studies in view of the above points, and has resulted in the development of a heat pipe type heat sink that is easy to process, low in cost, and has excellent assembly workability.
即ち本発明は、一面に凹溝を形成した発熱体取
付けブロツクの前記凹溝に、ヒートパイプの周方
向に沿つた一部を嵌入すると共に、凹溝から突出
したヒートパイプの外周に、これと密着する鍔部
を設けてフインを所定のピツチで配置し、且つ前
記フインの挿通孔を開口した押え板を、フインの
鍔部を挾持するように発熱体取付けブロツクに固
定してなるヒートパイプ式ヒートシンクである。 That is, in the present invention, a part of the heat pipe along the circumferential direction is fitted into the groove of a heat generating element mounting block having a groove formed on one surface thereof, and a part of the heat pipe along the circumferential direction protrudes from the groove. A heat pipe type in which the fins are arranged at a predetermined pitch with a flange that fits closely, and a holding plate with an insertion hole for the fin is fixed to a heating element mounting block so as to hold the fin flange. It's a heat sink.
以下本発明を図面に示す実施例を参照して詳細
に説明する。 The present invention will be described in detail below with reference to embodiments shown in the drawings.
第２図および第３図は本発明の一実施例を示す
もので、発熱体取付けブロツク６は直方体状をな
す銅やアルミニウム等の金属ブロツクの上面に、
その長手方向に沿つて連続した断面半円形状の凹
溝４が形成されている。 FIGS. 2 and 3 show an embodiment of the present invention, in which a heating element mounting block 6 is mounted on the top surface of a rectangular parallelepiped-shaped metal block made of copper, aluminum, etc.
A concave groove 4 having a continuous semicircular cross section is formed along its longitudinal direction.
ヒートパイプ１は銅管、アルミニウム管など金
属管の内壁面に図示しないメツシユ等のウイツク
を密着して取付けると共に、内部を減圧して作動
液を封入したものである。 The heat pipe 1 is a metal pipe such as a copper pipe or an aluminum pipe, with a mesh or other device (not shown) tightly attached to the inner wall surface of the pipe, and the inside of the heat pipe 1 is depressurized and a working fluid is sealed therein.
１は例へば方形状をなすフインで、このフイン
１の下部を直角に折曲して鍔部７を形成し、この
鍔部７の中央を、ヒートパイプ２の外径とほぼ等
しい内径の半円形状に湾曲させたものである。 For example, fin 1 has a rectangular shape. The lower part of fin 1 is bent at a right angle to form a flange 7, and the center of this flange 7 is formed into a semicircle with an inner diameter approximately equal to the outer diameter of heat pipe 2. It is curved in shape.
８は押え板で、長方形状をなす金属板の長手方
向に沿つた両端を折曲し、中央部に所定のピツチ
で前記フイン１を通すスリツト状の挿通孔９が開
口されていると共に、これら挿通孔９の間に、中
央部が半円形状に湾曲した押え部１０を形成した
ものである。 Reference numeral 8 denotes a holding plate, which is formed by bending both longitudinal ends of a rectangular metal plate, and has slit-like insertion holes 9 opened at a predetermined pitch in the center, through which the fins 1 are passed. A presser portion 10 is formed between the insertion holes 9, the center portion of which is curved in a semicircular shape.
次に組立方法について簡単に説明すると、押え
板８を第２図の状態から反転し、これに開口され
たスリツト状の挿通孔９に、同様にフイン１を反
転させて順次差込み、押え板８の押え部１０と、
フイン１の鍔部７とを重ねる。次いで反転した状
態のまま、鍔部７の半円形状に湾曲した部分にヒ
ートパイプ２を嵌入し、更にこのヒートパイプ２
の突出した部分に発熱体取付けブロツク６の凹溝
４を嵌入して重ね合せた後、反転して元に戻し、
フイン１に設けた鍔部７を挾持するように押え板
８と発熱体取付けブロツク６とをビス１１で固定
して第３図に示す如きヒートパイプ式ヒートシン
クを組立てるものである。 Next, to briefly explain the assembly method, the presser plate 8 is reversed from the state shown in FIG. a presser foot 10;
Overlap the fin 1 and the flange 7. Next, in the inverted state, the heat pipe 2 is inserted into the semicircularly curved part of the flange 7, and then the heat pipe 2 is
After fitting the concave groove 4 of the heating element mounting block 6 into the protruding part and overlapping them, turn it over and return it to its original position.
A heat pipe type heat sink as shown in FIG. 3 is assembled by fixing a retaining plate 8 and a heating element mounting block 6 with screws 11 so as to sandwich a flange 7 provided on the fin 1.
従つて上記構造のヒートパイプ式ヒートシンク
は、発熱体取付けブロツク６を従来の如く、くし
歯形に加工する必要がなく、上面に凹溝４を形成
させるだけなので加工が容易でコストも安い。更
にヒートパイプ２とフイン１の取付けを、従来は
フインピツチを調整しながら圧入挿着しており、
寸法の管理がめんどうであつたが、本発明は押え
板８に予め所定のピツチで開口したスリツト状の
挿通孔９にフイン１を差込むだけでピツチ調整が
でき、しかも押え板８と発熱体取付けブロツク３
との間で鍔部７を挾持してフイン１を接合するた
め、組立作業性にも優れている。 Therefore, in the heat pipe type heat sink having the above structure, there is no need to process the heating element mounting block 6 into a comb tooth shape as in the conventional case, and the groove 4 is simply formed on the top surface, so that the process is easy and the cost is low. Furthermore, the heat pipe 2 and fin 1 are conventionally attached by press-fitting while adjusting the fin pitch.
Managing the dimensions was troublesome, but with the present invention, the pitch can be adjusted simply by inserting the fins 1 into the slit-shaped insertion holes 9 that are opened in advance at a predetermined pitch in the presser plate 8. Mounting block 3
Since the fins 1 are joined by sandwiching the flange 7 between them, the assembly workability is also excellent.
なお上記実施例では発熱体取付けブロツク６を
１個取付けた構造のものについて示したが、複数
個並設して取付けたものでも良く、また各発熱体
取付けブロツク６の取付け方向を夫々変えた構造
のものでも良い。更に押え板８と発熱体取付けブ
ロツク６の接合は、上記の如くビス１１に限らず
熱伝導性の接着剤で接合した構造のものでも良
い。 Although the above embodiment shows a structure in which one heat generating element mounting block 6 is mounted, a structure in which a plurality of heat generating element mounting blocks 6 are mounted in parallel may also be used, or a structure in which the mounting direction of each heat generating element mounting block 6 is changed. It could be something like that. Further, the connection between the presser plate 8 and the heat generating element mounting block 6 is not limited to the screws 11 as described above, but may be a structure in which they are joined using a thermally conductive adhesive.
以上説明した如く本発明に係わるヒートパイプ
式ヒートシンクによれば、加工が容易でコストが
安く、しかも組立作業性に優れているなど顕著な
効果を有するものである。 As explained above, the heat pipe type heat sink according to the present invention has remarkable effects such as easy processing, low cost, and excellent assembly workability.
第１図は従来のヒートパイプ式ヒートシンクを
示す斜視図、第２図は本発明の一実施例に係わる
ヒートシンクを分解して示す斜視図、第３図は組
立後の状態を示すヒートシンクの正面図である。
１……フイン、２……ヒートパイプ、３，６…
…発熱体取付けブロツク、４……凹部、５……切
込み、７……鍔部、８……押え板、９……挿通
孔、１０……押え部。
FIG. 1 is a perspective view showing a conventional heat pipe type heat sink, FIG. 2 is an exploded perspective view of a heat sink according to an embodiment of the present invention, and FIG. 3 is a front view of the heat sink after assembly. It is. 1... Fin, 2... Heat pipe, 3, 6...
... Heating element mounting block, 4... Recess, 5... Notch, 7... Flange, 8... Holding plate, 9... Insertion hole, 10... Holding part.
Claims (1)
の前記凹溝に、ヒートパイプの周方向に沿つた一
部を嵌入すると共に、凹溝から突出したヒートパ
イプの外周に、これと密着する鍔部を設けたフイ
ンを所定のピツチで配置し、且つ前記フインの挿
通孔を開口した押え板を、フインの鍔部を挾持す
るように発熱体取付けブロツクに固定してなるヒ
ートシンク式ヒートパイプ。1. A part of the heat pipe along the circumferential direction is fitted into the groove of the heat generating element mounting block which has a groove formed on one side, and a flange part that comes into close contact with the outer periphery of the heat pipe protruding from the groove. A heat sink type heat pipe, in which fins provided with fins are arranged at a predetermined pitch, and a presser plate having insertion holes for the fins is fixed to a heating element mounting block so as to sandwich the flange of the fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11760680A JPS5742154A (en) | 1980-08-26 | 1980-08-26 | Heat pipe type heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11760680A JPS5742154A (en) | 1980-08-26 | 1980-08-26 | Heat pipe type heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5742154A JPS5742154A (en) | 1982-03-09 |
| JPS634351B2 true JPS634351B2 (en) | 1988-01-28 |
Family
ID=14715929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11760680A Granted JPS5742154A (en) | 1980-08-26 | 1980-08-26 | Heat pipe type heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5742154A (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59140447U (en) * | 1983-03-08 | 1984-09-19 | 古河電気工業株式会社 | Heat pipe type heat sink |
| US6009936A (en) * | 1997-04-17 | 2000-01-04 | Sanyo Electric Co., Ltd. | Heat exchanger |
| US6006827A (en) * | 1998-12-28 | 1999-12-28 | Hon Hai Precision Ind. Co., Ltd. | Cooling device for computer component |
| US5964285A (en) * | 1999-02-12 | 1999-10-12 | Yung-Tsai Chu | Heat sink |
| JP3273505B2 (en) | 1999-08-18 | 2002-04-08 | 古河電気工業株式会社 | Heat sink provided with heat radiation fins and method of fixing heat radiation fins |
| US6742573B2 (en) | 1999-08-18 | 2004-06-01 | The Furukawa Electric Co., Ltd. | Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin |
| US7165603B2 (en) * | 2002-04-15 | 2007-01-23 | Fujikura Ltd. | Tower type heat sink |
| US7140422B2 (en) | 2002-09-17 | 2006-11-28 | Hewlett-Packard Development Company, L.P. | Heat sink with heat pipe in direct contact with component |
| US7143819B2 (en) | 2002-09-17 | 2006-12-05 | Hewlett-Packard Development Company, L.P. | Heat sink with angled heat pipe |
| US6894900B2 (en) * | 2002-09-17 | 2005-05-17 | Hewlett-Packard Development Company, L.P. | Heat sink with heat pipe and base fins |
| JP3851875B2 (en) * | 2003-01-27 | 2006-11-29 | 株式会社東芝 | Cooling device and electronic equipment |
| US7347251B2 (en) | 2005-12-21 | 2008-03-25 | International Business Machines Corporation | Heat sink for distributing a thermal load |
| US8230908B2 (en) | 2006-01-05 | 2012-07-31 | International Business Machines Corporation | Heat sink for dissipating a thermal load |
| TW201103414A (en) * | 2009-07-01 | 2011-01-16 | Young Bright Technology Corp | Heat dissipation module |
-
1980
- 1980-08-26 JP JP11760680A patent/JPS5742154A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5742154A (en) | 1982-03-09 |
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