JPS6343431U - - Google Patents
Info
- Publication number
- JPS6343431U JPS6343431U JP13525486U JP13525486U JPS6343431U JP S6343431 U JPS6343431 U JP S6343431U JP 13525486 U JP13525486 U JP 13525486U JP 13525486 U JP13525486 U JP 13525486U JP S6343431 U JPS6343431 U JP S6343431U
- Authority
- JP
- Japan
- Prior art keywords
- die
- collet
- bonding
- contact
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
第１図はこの考案の一実施例を示すダイボンデ
イングコレツトの斜視図、第２図は第１図の断面
図、第３図は従来のダイボンデイングコレツトの
斜視図、第４図は他の従来例を示す斜視図、第５
図は第４図の断面図を示す。 図において、１はダイ、２はコレツト、３は爪
、４は吸着穴、５は開口部である。なお、各図中
の同一符号は同一または相当部分を示す。
イングコレツトの斜視図、第２図は第１図の断面
図、第３図は従来のダイボンデイングコレツトの
斜視図、第４図は他の従来例を示す斜視図、第５
図は第４図の断面図を示す。 図において、１はダイ、２はコレツト、３は爪
、４は吸着穴、５は開口部である。なお、各図中
の同一符号は同一または相当部分を示す。
Claims (1)
- ダイをコレツトにより吸着し、ボンデイング点
に移送してフレーム上に固着するダイボンデイン
グコレツトにおいて、前記ダイの４辺と接触する
コレツトの爪の所要のものに、前記ダイとの接触
部分を減少せしめるための開口部分を設けたこと
を特徴とする半導体製造装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13525486U JPS6343431U (ja) | 1986-09-02 | 1986-09-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13525486U JPS6343431U (ja) | 1986-09-02 | 1986-09-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6343431U true JPS6343431U (ja) | 1988-03-23 |
Family
ID=31037264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13525486U Pending JPS6343431U (ja) | 1986-09-02 | 1986-09-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6343431U (ja) |
-
1986
- 1986-09-02 JP JP13525486U patent/JPS6343431U/ja active Pending