JPS6341524U - - Google Patents
Info
- Publication number
- JPS6341524U JPS6341524U JP13501286U JP13501286U JPS6341524U JP S6341524 U JPS6341524 U JP S6341524U JP 13501286 U JP13501286 U JP 13501286U JP 13501286 U JP13501286 U JP 13501286U JP S6341524 U JPS6341524 U JP S6341524U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- recess
- lead frame
- resin
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000013013 elastic material Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図Ａは、本考案によるリードフレームをク
ランプした状態での金型の側断面図、第１図Ｂは
第１図Ａのａ―ｂによる側断面図、第２図は本考
案による金型によつて製造された半導体装置の仕
上がり側断面図、第３図Ａは従来の金型のリード
フレームをクランプした状態での側断面図、第３
図Ｂは第３図Ａのｃ―ｄによる側断面図、第４図
は従来の金型によつて製造された半導体装置の仕
上がり側面図である。
１…半導体素子、２…リードフレーム、３…樹
脂成形金型（下型）、４…樹脂成形金型（上型）
、５…耐熱弾性材、６…リードフレーム凹部、７
…成形樹脂、８…樹脂成形凹部、９…リードフレ
ームと金型の隙間、１０…バリ。
FIG. 1A is a side cross-sectional view of the mold with the lead frame according to the present invention clamped, FIG. 1B is a side cross-sectional view taken along line a-b of FIG. 1A, and FIG. Figure 3A is a finished side sectional view of a semiconductor device manufactured using a mold, and Figure 3A is a side sectional view of a conventional mold with the lead frame clamped.
FIG. B is a side sectional view taken along line c-d in FIG. 3A, and FIG. 4 is a finished side view of a semiconductor device manufactured using a conventional mold. 1... Semiconductor element, 2... Lead frame, 3... Resin molding mold (lower mold), 4... Resin molding mold (upper mold)
, 5... Heat-resistant elastic material, 6... Lead frame recess, 7
... Molding resin, 8... Resin molding recess, 9... Gap between lead frame and mold, 10... Burr.
Claims (1)
収納する凹部、及び前記半導体素子を封止し、所
定の形に樹脂成形する凹部を持つた樹脂成形用金
型において、前記リードフレーム収納凹部、成形
凹部、及び対向して接する上下金型の平面が耐熱
弾性材で被覆されている事を特徴とする半導体素
子の樹脂成形金型。 In a resin molding mold having a recess for storing a lead frame having a semiconductor element on a tab, and a recess for sealing the semiconductor element and molding the semiconductor element into a predetermined shape with resin, the lead frame storage recess, the molding recess, and a resin molding mold for a semiconductor element, characterized in that the flat surfaces of the upper and lower molds, which face each other in contact with each other, are covered with a heat-resistant elastic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13501286U JPS6341524U (en) | 1986-09-03 | 1986-09-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13501286U JPS6341524U (en) | 1986-09-03 | 1986-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6341524U true JPS6341524U (en) | 1988-03-18 |
Family
ID=31036790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13501286U Pending JPS6341524U (en) | 1986-09-03 | 1986-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6341524U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02145306A (en) * | 1988-11-28 | 1990-06-04 | Idec Izumi Corp | Molding die for epoxy bonding |
-
1986
- 1986-09-03 JP JP13501286U patent/JPS6341524U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02145306A (en) * | 1988-11-28 | 1990-06-04 | Idec Izumi Corp | Molding die for epoxy bonding |
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