JPS6337588A - Panel heater - Google Patents
Panel heaterInfo
- Publication number
- JPS6337588A JPS6337588A JP18217586A JP18217586A JPS6337588A JP S6337588 A JPS6337588 A JP S6337588A JP 18217586 A JP18217586 A JP 18217586A JP 18217586 A JP18217586 A JP 18217586A JP S6337588 A JPS6337588 A JP S6337588A
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- metal
- mica
- silica
- alumina fibers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 39
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 239000010445 mica Substances 0.000 claims description 14
- 229910052618 mica group Inorganic materials 0.000 claims description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 12
- 239000000835 fiber Substances 0.000 claims description 11
- 239000000945 filler Substances 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 239000000377 silicon dioxide Substances 0.000 description 8
- 238000010292 electrical insulation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 210000003298 dental enamel Anatomy 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- -1 etc. Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical class [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical class [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052796 boron Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- OLLFKUHHDPMQFR-UHFFFAOYSA-N dihydroxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](O)(O)C1=CC=CC=C1 OLLFKUHHDPMQFR-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- XCLIHDJZGPCUBT-UHFFFAOYSA-N dimethylsilanediol Chemical compound C[Si](C)(O)O XCLIHDJZGPCUBT-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 235000019256 formaldehyde Nutrition 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920001558 organosilicon polymer Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920003216 poly(methylphenylsiloxane) Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Surface Heating Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電気エネルギーを利用する面状発熱体に関す
るもので、暖房器、調理器、乾燥機などの熱利用機器の
熱源、とくに輻射加熱源を提供するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a planar heating element that utilizes electrical energy, and is suitable for use as a heat source for heat utilization equipment such as heaters, cookers, and dryers, particularly as a radiant heating source. This is what we provide.
従来の技術
従来の技術の多くは、マイカなどの絶縁基板に電熱線を
巻回した構造のものが用いられている。BACKGROUND OF THE INVENTION Most conventional technologies use a structure in which a heating wire is wound around an insulating substrate such as mica.
また最近では、アルミナ等の陶磁器質焼成ブロック中に
、導電回路を所望形状に埋設した面状発熱体もある。Recently, there are also planar heating elements in which a conductive circuit is embedded in a desired shape in a ceramic fired block such as alumina.
更には、ホクロク用金属基板にホウａり層によって被覆
して、面状発熱導電体を結合した面状発熱体が提案され
ている。例えば、特開昭６０−２５１７６号公報。Furthermore, a planar heating element has been proposed in which a metal substrate for moles is coated with an aluminium layer and a planar heating conductor is bonded thereto. For example, Japanese Patent Application Laid-Open No. 60-25176.
その他、この種の面状発熱体としては、蛇行状、渦巻き
状等の所望回路形状に形成した、アルミニウム、銅、ニ
ッケル、ステンレススチール、鉄、等の面状全屈発熱体
の片面もしくは両面にポリエステルフィルム、ポリイミ
ドフィルム、ポリカーボネートフィルム等の合成樹脂絶
縁フィルムを接着したものが広く採用されている。In addition, this type of planar heating element includes a sheet heating element made of aluminum, copper, nickel, stainless steel, iron, etc., which is formed into a desired circuit shape such as a serpentine or spiral shape, on one or both sides. Insulating films made of synthetic resins such as polyester films, polyimide films, and polycarbonate films are widely used.
発明が解決しようとする問題点
しかしながら、従来の技術では、以下のような問題点が
あった。Problems to be Solved by the Invention However, the conventional technology has the following problems.
マイカヒータの場合は、電熱線を基板に巻回するのに手
間がかかる上に、マイカと電熱線との接触が悪くなると
電熱線が空焼きとなり高温になって断線し易いこと。ま
た電熱線が封口されていないため、耐熱性に導電があっ
た。またマイカ自体の熱伝導率が低いため、ヒータ温度
と高温となり、劣化し易いという問題があった。In the case of mica heaters, it takes time and effort to wind the heating wire around the board, and if the contact between the mica and the heating wire deteriorates, the heating wire becomes dry and becomes hot, making it easy to break. Also, since the heating wire was not sealed, it had heat resistance and conductivity. Furthermore, since the thermal conductivity of mica itself is low, there is a problem in that it becomes high in temperature with the heater temperature and is susceptible to deterioration.
また陶磁器を用いるヒータの場合には、陶磁器焼成プＣ
１７りの機械的強度が低いため厚みが厚くなって熱容量
が大きくなるため、速熱性が悪く、また焼結温度が高い
ため、接点材料の酸化・溶融などにより、電極の取出し
に間匣があった。In addition, in the case of a heater using ceramics, ceramic firing process C
Due to the low mechanical strength of 17, the thickness increases and the heat capacity increases, resulting in poor heating speed and high sintering temperature, which may cause oxidation and melting of the contact material, resulting in a gap when taking out the electrode. Ta.
更にホウロウヒータの場合には、その製造法が極めて複
雑で手間がかかる上に、ホウロウ層の電気絶縁性の観点
からすると、ホウロウ層を緻密に、Ｎａ、になどのアル
カリ分を少なく、ホウロウ層の厚みを厚くすることが望
ましいが、逆に、耐熱性の面では、耐熱性が低下する方
向となり、両者のバランスを考慮すると３００℃以上の
高温での使用は困錐であった。Furthermore, in the case of enamel heaters, the manufacturing method is extremely complicated and time-consuming, and from the viewpoint of electrical insulation of the enamel layer, it is difficult to make the enamel layer dense, with less alkali content such as Na, Although it is desirable to increase the thickness, conversely, in terms of heat resistance, the heat resistance tends to decrease, and when considering the balance between the two, it is difficult to use it at high temperatures of 300° C. or higher.
また、シリコン摺り旨、ポリイミド樹脂などのフィルム
を用いるヒータの場合には、その使用温度が絶縁フィル
ムの耐熱温度に左右されてしまうところから、例えば２
５０℃以上に発熱させた場合は、絶縁フィルムに損傷を
きたす欠点があった。In addition, in the case of heaters that use films such as silicone paste or polyimide resin, the operating temperature depends on the heat resistance temperature of the insulating film, so for example 2
When heat is generated above 50° C., there is a drawback that the insulating film is damaged.
本発明はかかる従来の問題点を解消するもので、約６０
０℃までの表明温度で使用可能な薄型かつコンパクトな
面状発熱体を提供することを目的としている。The present invention solves such conventional problems and
The object of the present invention is to provide a thin and compact planar heating element that can be used at an expressed temperature of up to 0°C.
また生産性に優れ、安価に製造できる面状発熱体を提供
することも本発明の目的である。Another object of the present invention is to provide a planar heating element that has excellent productivity and can be manufactured at low cost.
問題点を解決するための手段
上記１問題点を解決するため、本発明は、シリカ・アル
ミナ繊維および集成マイカの混合物を基体として、ボロ
シロキサン重合体および充填剤を含有して成るプリプレ
の硬化体の層の間に金属発熱体を加熱・加圧接着し、全
体を金属グーヌ内に保持して用いる。Means for Solving the Problems In order to solve the above-mentioned problem 1, the present invention provides a cured prepreg product comprising a mixture of silica-alumina fibers and aggregated mica as a base, and containing a borosiloxane polymer and a filler. A metal heating element is bonded between the layers under heat and pressure, and the whole is held within the metal goonu.
作 用 上記構成により、優れた高温型面状発熱体が得られる。For production With the above configuration, an excellent high-temperature sheet heating element can be obtained.
本発明に使用し得る金属発熱体としては、アルミナ繊維
、銅、ニッケル、ステンレススチール、鉄および合金等
があり、蛇行状、渦巻き状等の所望の形状に加工できる
箔等がある。Metal heating elements that can be used in the present invention include alumina fibers, copper, nickel, stainless steel, iron, alloys, etc., and foils that can be processed into desired shapes such as meandering and spiral shapes.
また、本発明におけるボロシロキサン重合体としてはケ
イ素、酸素、ホウ素を主要骨格とする高分子化合物はど
れも用いることができる。しかしながら、耐熱性等の点
からとくに、ジメチルシリコンオイルやメチルフェニル
シリコンオイルのようなシリコンオイルを溶剤とし、ジ
フェニルジヒドロキシシランやジメチルジヒドロキシシ
ランのようなヒドロキシシラン、およびホウ酸化合物を
縮重合させて得られた重合体を用いることが望ましい。Further, as the borosiloxane polymer in the present invention, any polymer compound having a main skeleton of silicon, oxygen, or boron can be used. However, from the point of view of heat resistance, etc., it is preferable to use a silicone oil such as dimethyl silicone oil or methylphenyl silicone oil as a solvent to condensate a hydroxysilane such as diphenyldihydroxysilane or dimethyldihydroxysilane, and a boric acid compound. It is desirable to use a polymer that is
ボロシロキサン重合体に化わる樹脂成分として、ポリチ
タノカルボシランを主成分とする有機ケイ素重合体を用
いることもできる。シリカ・アルミナ線維および集成マ
イカの混合物は、両者の混合物を抄造して、シートを作
成して用いる。シリカ・アルミナ繊維と集成マイカを積
層する状態で抄造する方法および両者を完全に混合して
抄造する方法のいずれの方法も用いることかできる。An organosilicon polymer containing polytitanocarbosilane as a main component can also be used as the resin component to be converted into the borosiloxane polymer. A mixture of silica-alumina fibers and aggregated mica is used by making a sheet from a mixture of both. Either of the following methods can be used: a method in which silica/alumina fibers and aggregated mica are laminated in a laminated state, and a method in which the two are completely mixed.
このようなシートを用いて、これに充填剤を含有するボ
ロシロキサン重合体接着剤液を含浸させた後、半乾き状
態（すなわちプリプレグ）として、この２枚のプリプレ
グの間に所望回路形状に形成した金属発熱体をはさみ金
属ケースの中に保持し、これを加熱・加圧接着して面ヒ
ータを得る。マイカの独自の構造に基ずく、優れた絶縁
特性と、耐水蒸気浸透性とシリカ・アルミナ繊維の柔軟
性と加工性に優れた点を生かして、薄型で、熱伝達性が
良好で、絶縁信頼性に優れた面ヒータが得られる。Using such a sheet, after impregnating it with a borosiloxane polymer adhesive solution containing a filler, a desired circuit shape is formed between the two sheets of prepreg in a semi-dry state (i.e., prepreg). The heated metal heating element is sandwiched and held in a metal case, and then bonded under heat and pressure to obtain a surface heater. Mica has excellent insulation properties based on its unique structure, water vapor permeation resistance, and the flexibility and processability of silica and alumina fibers, making it thin, with good heat transfer, and reliable insulation. A surface heater with excellent properties can be obtained.
充填剤は、ボロシロキサン重合体の耐熱接着性を改善す
るために用いる。ボロシロキサン重合体と充填剤との配
合比は、ボロシロキサン重合体に対して０．５以上３以
下の範囲が望ましい。０．５以下の場合も０．３以上の
場合も接着力が低下するためである。Fillers are used to improve the heat resistant adhesion properties of borosiloxane polymers. The blending ratio of the borosiloxane polymer to the filler is preferably in the range of 0.5 or more and 3 or less relative to the borosiloxane polymer. This is because the adhesive strength decreases both when it is 0.5 or less and when it is 0.3 or more.
充填剤の種類として、絶縁材であって、化学的に安定で
、熱伝導率が良好な多くの無機化合物を用いることがで
きる。炭化ケイ素、窒化ケイ素、窒化アルミニウム、二
酸化ケイ素、アルミナ、酸化マグネシウムなどがとくに
良好である。As the type of filler, many inorganic compounds that are insulating materials, chemically stable, and have good thermal conductivity can be used. Particularly suitable are silicon carbide, silicon nitride, aluminum nitride, silicon dioxide, alumina, magnesium oxide, and the like.
実施例 本発明の実施例を添付図面に基づいて説明する。Example Embodiments of the present invention will be described based on the accompanying drawings.
図は本発明の１実施例の断面図である。図において、１
はステンレス（ｓｕｓ４３０ ）を所望回路形状に形成
したものである。１００〜２００μｍ程度の厚みのステ
ンレス箔から、プレスにて打抜いて作成する。または、
少々高価になるが、１００μｍ以下の箔から、エラキン
グにて回路パターンを作成しても良い。２がシリカ、ア
ルミナ線維および集成マイカの混合物を基体として、ボ
ロシロキサン重合体および充填剤を含有して成るプリプ
レグの硬化体である。プリプレグの硬化体２は、シリカ
、アルミナ繊維および集成マイカの混合物を抄造したシ
ートに下記、接着剤（即ち
を分散機にて、分散させたもの）
を含浸させたのち、２００℃で１分間乾燥させて得るプ
リプレグ２’、２’の間に、金属発熱体１をはさみ、そ
の全体をステンレスなどの金属ケース３、内に保持し、
加熱（約２００℃）、加圧（１００ｋｑ／ｃｎｌ）接着
して、面状発熱体を得る。面状発熱体のケース３の外側
には、輻射加熱に利用する場合、赤外線輻射コーチイン
グなどを施して、用いるのが良い。The figure is a sectional view of one embodiment of the present invention. In the figure, 1
This is made of stainless steel (sus430) and formed into a desired circuit shape. It is made by punching out stainless steel foil with a thickness of about 100 to 200 μm using a press. or
Although it is a little more expensive, it is also possible to create a circuit pattern using ElaKing from a foil of 100 μm or less. 2 is a cured prepreg comprising a mixture of silica, alumina fibers and aggregated mica as a base, and containing a borosiloxane polymer and a filler. Cured prepreg body 2 is obtained by impregnating a sheet made from a mixture of silica, alumina fibers and mica with the following adhesive (i.e., dispersed using a dispersion machine), and then drying it at 200°C for 1 minute. A metal heating element 1 is sandwiched between the prepregs 2' and 2' obtained by the above process, and the whole is held in a metal case 3 made of stainless steel or the like,
A planar heating element is obtained by bonding by heating (approximately 200° C.) and applying pressure (100 kq/cnl). When the outside of the case 3 of the planar heating element is used for radiant heating, it is preferable to apply infrared radiation coaching or the like.
このようにして製作した面状発熱体は、ヒータエレメン
トから、外枠ケースまで一体となった構造で、薄型であ
るため、温度の立上りが速く、電気絶縁信頼性に優れて
いる。ヒータエレメント（即ち金属発熱体）とプリプレ
グおよびプリプレグと金属ケースとは、完全に接着した
状態にある。The planar heating element manufactured in this manner has an integrated structure from the heater element to the outer frame case, and is thin, so the temperature rises quickly and the electrical insulation reliability is excellent. The heater element (that is, the metal heating element) and the prepreg, and the prepreg and the metal case are in a completely bonded state.
シリカ、アルミナ繊維と集成マイカを混合する状態は、
両者がランダムに混合した状態から、層を形成する状態
まで色々と可能であるが、金属発熱体側をシリカ、アル
ミナ繊維が多く、金属ケース側を集成マイカが多い状態
が、熱伝導率が大きく、相反する特性の電気絶縁性も大
きく有利な状態が得られる。プリプレグの２’、２’の
厚みを０．５−とした場合の金属発熱体と金属ケースの
間の電気絶縁性を室温および５００℃で評価したところ
、絶縁抵抗は、室温、５００℃とも２Ｘ１０９（０）以
上、絶縁耐圧は、室温、５０００Ｃとも３ＫＶ以上であ
った。The state of mixing silica, alumina fiber and laminated mica is as follows:
Various possibilities are possible, from a random mixture of the two to a layered state, but a state where the metal heating element side has a lot of silica and alumina fibers, and the metal case side has a lot of aggregated mica has a high thermal conductivity. A highly advantageous state can also be obtained in electrical insulation, which has contradictory characteristics. When the electrical insulation between the metal heating element and the metal case was evaluated at room temperature and 500℃ when the thickness of 2' and 2' of the prepreg was 0.5-, the insulation resistance was 2X109 at both room temperature and 500℃. (0) The dielectric strength voltage was 3 KV or more at both room temperature and 5000C.
更に、この面状発熱体を６０℃、相対温度９５％の条件
下で１００時間放置した後、同様に電気絶縁性を評価し
たが変化はなかった。Further, after this sheet heating element was left for 100 hours at 60° C. and a relative temperature of 95%, the electrical insulation properties were evaluated in the same manner, but no change was found.
発明の効果
以上本発明によれば、従来のこの種の面状発熱体に比較
して、金属基板と金属発熱体との間の電気絶縁性に優れ
、とくに耐湿劣化に強く、安定である。また、面状発熱
体自身が薄型であるので、設置場所をとらず、色々の機
器に組込んで用いるのに便利である。とくに、金属発熱
体とプリプレグの硬化体およびプリプレグの硬化体と金
属ケースの間が、熱伝導性が良好な充填剤を介して、６
００°Ｃ以上の高温でも十分に接着されているので、熱
抵抗が少なく、熱伝達が良好で、温度分布も均一にでき
る。Effects of the Invention According to the present invention, compared to conventional planar heating elements of this type, the electrical insulation between the metal substrate and the metal heating element is excellent, and the heating element is particularly resistant to moisture deterioration and is stable. Furthermore, since the planar heating element itself is thin, it does not take up much space and is convenient to be incorporated into various devices. In particular, between the metal heating element and the cured prepreg body, and between the cured prepreg body and the metal case, 6
Since the bonding is sufficient even at high temperatures of 00°C or higher, thermal resistance is low, heat transfer is good, and temperature distribution can be made uniform.
という利点がある。更に、金属ケースの外側に、赤外線
高輻射体を塗布して用いるみ、有効な面輻射加熱源とな
る。There is an advantage. Furthermore, by coating the outside of the metal case with an infrared high radiant material, it becomes an effective surface radiant heating source.
図は本発明の一実施例の面状発熱体の拡大断面図である
。
１・−・・・金属発熱体、２・・シリカ・アルミナ繊維
および集成マイカの混合物を基体として、ボロシロキサ
ン重合体および充填剤を含有して成るプリプレグの硬化
体。
３・・・・金属ケース。The figure is an enlarged sectional view of a planar heating element according to an embodiment of the present invention. 1. A cured prepreg comprising a metal heating element, 2. A mixture of silica/alumina fibers and aggregated mica as a base, and containing a borosiloxane polymer and a filler. 3...Metal case.
Claims (1)
として、ボロシロキサン重合体および充填剤を含有して
成るプリプレグの硬化体の層の間に金属発熱体を加熱・
加圧接着し、全体を金属ケース内に保持した面状発熱体
。A metal heating element is heated between layers of a cured prepreg made of a mixture of silica-alumina fibers and aggregated mica, and containing a borosiloxane polymer and a filler.
A sheet heating element that is bonded under pressure and held entirely within a metal case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18217586A JPS6337588A (en) | 1986-08-01 | 1986-08-01 | Panel heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18217586A JPS6337588A (en) | 1986-08-01 | 1986-08-01 | Panel heater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6337588A true JPS6337588A (en) | 1988-02-18 |
Family
ID=16113652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18217586A Pending JPS6337588A (en) | 1986-08-01 | 1986-08-01 | Panel heater |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6337588A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0454190U (en) * | 1990-09-14 | 1992-05-08 |
-
1986
- 1986-08-01 JP JP18217586A patent/JPS6337588A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0454190U (en) * | 1990-09-14 | 1992-05-08 |
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