JPS6331538U - - Google Patents
Info
- Publication number
- JPS6331538U JPS6331538U JP12558086U JP12558086U JPS6331538U JP S6331538 U JPS6331538 U JP S6331538U JP 12558086 U JP12558086 U JP 12558086U JP 12558086 U JP12558086 U JP 12558086U JP S6331538 U JPS6331538 U JP S6331538U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- cavity
- utility
- model registration
- small hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 1
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図、第２図は本考案の実施例を示す断面図
である。第３図は熱可塑性樹脂を用いた半導体パ
ツケージの構造を模式的に示す断面図である。左
側は封止前の各部品の関係を示し、右側は封止後
の状態を示す。第４図は封止後に形成されるキヤ
ビテイ内の状況を拡大した形で示す断面図である
。
符号の説明、１……上側シエル、２……下側シ
エル、３……ガラス・リツド、４……リード・フ
レーム、５……半導体チツプ、６……ボンデイン
グ・ワイヤ、７……キヤビテイ、８……はり出し
た樹脂、９……パーテイクル、１０……上側シエ
ル、１１……下側シエル、１２……ガラス・リツ
ド、１３……リードフレーム、１４……半導体チ
ツプ、１５……ボンデイング・ワイヤ、１６……
貫通孔、１７……加熱棒、１８……キヤビテイ。
1 and 2 are sectional views showing an embodiment of the present invention. FIG. 3 is a cross-sectional view schematically showing the structure of a semiconductor package using thermoplastic resin. The left side shows the relationship between the parts before sealing, and the right side shows the state after sealing. FIG. 4 is an enlarged sectional view showing the inside of the cavity formed after sealing. Explanation of symbols, 1... Upper shell, 2... Lower shell, 3... Glass lid, 4... Lead frame, 5... Semiconductor chip, 6... Bonding wire, 7... Cavity, 8 ... Protruding resin, 9 ... Particles, 10 ... Upper shell, 11 ... Lower shell, 12 ... Glass lid, 13 ... Lead frame, 14 ... Semiconductor chip, 15 ... Bonding wire , 16...
Through hole, 17... heating rod, 18... cavity.
Claims (1)
、下のシエルの封止面を熱溶融させ、リードフレ
ームをはさみ込む形でキヤビテイを形成する構造
の半導体用パツケージにおいて、封止時に内部に
生じたパーテイクルを真空で吸い出すことを目的
とした小孔をあらかじめ上、下のシエルの片方又
は両方にキヤビテイに連通する形で形成したこと
を特徴とする半導体用樹脂パツケージ。 ２ パーテイクルを吸い出した後、熱溶融でふさ
ぐようにした構造を有する小孔を設けたことを特
徴とする実用新案登録請求の範囲第１項記載の半
導体用樹脂パツケージ。[Claims for Utility Model Registration] 1. In a semiconductor package having a structure in which a cavity is formed by heat-melting the sealing surfaces of upper and lower shells pre-molded using thermoplastic resin and sandwiching a lead frame, A resin package for a semiconductor, characterized in that a small hole is formed in advance in one or both of the upper and lower shells to communicate with the cavity for the purpose of vacuuming out particles generated inside during sealing. 2. A resin package for a semiconductor according to claim 1 of the utility model registration, characterized in that a small hole is provided having a structure that is closed by thermal melting after particles are sucked out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12558086U JPS6331538U (en) | 1986-08-18 | 1986-08-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12558086U JPS6331538U (en) | 1986-08-18 | 1986-08-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6331538U true JPS6331538U (en) | 1988-03-01 |
Family
ID=31018599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12558086U Pending JPS6331538U (en) | 1986-08-18 | 1986-08-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6331538U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09121000A (en) * | 1995-10-25 | 1997-05-06 | Nec Corp | Semiconductor device and its manufacture |
| JP2001298104A (en) * | 2000-04-11 | 2001-10-26 | Hamamatsu Photonics Kk | Semiconductor light-receiving device |
-
1986
- 1986-08-18 JP JP12558086U patent/JPS6331538U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09121000A (en) * | 1995-10-25 | 1997-05-06 | Nec Corp | Semiconductor device and its manufacture |
| JP2001298104A (en) * | 2000-04-11 | 2001-10-26 | Hamamatsu Photonics Kk | Semiconductor light-receiving device |