JPS633043A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPS633043A JPS633043A JP14505786A JP14505786A JPS633043A JP S633043 A JPS633043 A JP S633043A JP 14505786 A JP14505786 A JP 14505786A JP 14505786 A JP14505786 A JP 14505786A JP S633043 A JPS633043 A JP S633043A
- Authority
- JP
- Japan
- Prior art keywords
- density polyethylene
- resin composition
- low
- weight
- breakdown voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 17
- 229920001903 high density polyethylene Polymers 0.000 claims abstract description 23
- 239000004700 high-density polyethylene Substances 0.000 claims abstract description 23
- 229920001684 low density polyethylene Polymers 0.000 claims abstract description 16
- 239000004702 low-density polyethylene Substances 0.000 claims abstract description 16
- 238000002156 mixing Methods 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 230000015556 catabolic process Effects 0.000 abstract description 14
- 238000002844 melting Methods 0.000 abstract description 6
- 230000008018 melting Effects 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 239000003431 cross linking reagent Substances 0.000 abstract description 2
- 229940099514 low-density polyethylene Drugs 0.000 abstract 2
- 229920013716 polyethylene resin Polymers 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920003020 cross-linked polyethylene Polymers 0.000 description 3
- 239000004703 cross-linked polyethylene Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000012962 antiaging additive Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は樹脂組成物に関し、更に詳しくは電線の被覆絶
縁樹脂組成物として極めて好適な樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin composition, and more particularly to a resin composition that is extremely suitable as an insulating resin composition for covering electric wires.
電線就中特に電カケープルの被覆絶縁樹脂組成物として
は各種の樹脂を主成分とするものが使用されているが、
優れた耐破壊電圧性を存する架橋ポリエチレンが漸次主
流となって来ている。Insulating resin compositions containing various resins as main components are used as coating insulating resin compositions for electric wires, especially electric cables.
Crosslinked polyethylene, which has excellent breakdown voltage resistance, is gradually becoming mainstream.
しかしながら最近の技術分野の向上により、この種を線
就中電カケープルに於いても、益々高性能が要求され、
耐破壊電圧についてもより一層優れたものが強く要求さ
れるようになって来た。However, with recent improvements in the technical field, even in this type of line-based electric cable, higher performance is required.
There has also been a strong demand for even better breakdown voltage.
本発明が解決しようとする問題点は、上記要求に応えう
る新しい樹脂組成物を開発することであり、更に詳しく
は、従来の架橋ポリエチレンから成る樹脂組成物よりも
、更に一層優れた耐破壊電圧性を有する樹脂組成物を開
発することである。The problem to be solved by the present invention is to develop a new resin composition that can meet the above requirements. The objective is to develop a resin composition that has the following properties.
この問題点は、高密度ポリエチレンと低密度ポリエチレ
ンとを好ましくはある特定割合で１昆合したものを樹脂
成分として使用することにより達成される。即ち本発明
は高密度ポリエチレンと低密度ポリエチレンとを含有し
て成り、高密度ポリエチレンと低密度ポリエチレンとの
混合比が前者９５〜５重量％、後者５〜９５重量％であ
る樹脂組成物に係るものである。This problem can be solved by using a mixture of high density polyethylene and low density polyethylene, preferably in a certain ratio, as the resin component. That is, the present invention relates to a resin composition containing high-density polyethylene and low-density polyethylene, in which the mixing ratio of the former is 95 to 5% by weight and the latter is 5 to 95% by weight. It is something.
本発明者の研究に依ると、高密度ポリエチレンは、架橋
ポリエチレンや低密度ポリエチレンに比し、破壊電圧就
中インパルス破壊電圧が高いという優れた性質を有する
ことが判明した。しかしながらこの高密度ポリエチレン
は、高融点並びに高結晶化度を有し、特に高結晶性であ
るがために可撓性に乏しく、電線就中型カケープルの絶
縁被覆用組成物としては、このままでは実用上支障があ
ることが判明した。According to research conducted by the present inventors, it has been found that high-density polyethylene has an excellent property of having a high breakdown voltage, especially impulse breakdown voltage, as compared to cross-linked polyethylene and low-density polyethylene. However, this high-density polyethylene has a high melting point and a high degree of crystallinity, and because of its particularly high crystallinity, it has poor flexibility, so it is not practical as it is as a composition for insulation coating of electric wires and medium-sized cables. It turned out that there was a problem.
よって更に研究を続けるうち、この高密度ポリエチレン
を低密度ポリエチレンと併用するときは、特にこれ等両
者を特定の配合割合で併用するときは優れたインパルス
破壊電圧と、実用上支障の無い程度の可撓性とを具備す
るに至ることを見出し、これに基づき本発明を完成した
ものである。Therefore, as we continued our research, we found that when this high-density polyethylene is used in combination with low-density polyethylene, especially when these two are used together in a specific proportion, it has an excellent impulse breakdown voltage and a level that does not cause any practical problems. The present invention was completed on the basis of this discovery.
本発明の樹脂組成物は、基本的には高密度ポリエチレン
と低密度ポリエチレンとを含有して成るものであり、更
に好ましくは、これ等両者またはそのいずれか一方が更
に架橋されたものである。The resin composition of the present invention basically contains high-density polyethylene and low-density polyethylene, and more preferably, both or one of them is further crosslinked.
本発明で使用する高密度ポリエチレン自体は従来から知
られたものであり、通常密度０．９３５ｇ／ａＪ以上好
ましくは０．９５０ｇ／−以上のものである。この高密
度ポリエチレンは高融点で高い結晶化度を有するもので
あり、通常融点１３０℃以上、結晶化度７０％以上のも
のを好ましく使用することができる。The high-density polyethylene itself used in the present invention is conventionally known, and usually has a density of 0.935 g/aJ or more, preferably 0.950 g/aJ or more. This high-density polyethylene has a high melting point and a high degree of crystallinity, and usually those having a melting point of 130° C. or higher and a crystallinity of 70% or higher are preferably used.
また本発明に於いて使用する低密度ポリエチレンとして
もこれ自体は従来から良く知られたものであり、その密
度が０．９３５ｇ／ｃＩｌに達しないものが使用され、
好ましくはその密度０．９２０ｇ／−以下のものである
。Furthermore, the low-density polyethylene used in the present invention is well known in the past, and the one whose density does not reach 0.935 g/cIl is used.
Preferably, the density is 0.920 g/- or less.
これ等両者の配合割合は、高密度ポリエチレンが５〜９
５重量％、低密度ポリエチレンが９５〜５重量％の範囲
好ましくは前者２０〜８０重量％、後者８０〜２０重量
％の範囲から適宜に決定される。これ等の配合割合の変
化により、若干インパルス破壊電圧並びに可撓性が変化
するが、上記範囲内特に好ましいとされる上記範囲内で
は実用上支障の無い可撓性と優れた破壊電圧が発揮され
る。The blending ratio of these two is 5 to 9 for high density polyethylene.
5% by weight, low density polyethylene in the range of 95 to 5% by weight, preferably 20 to 80% by weight of the former, and 80 to 20% of the latter. The impulse breakdown voltage and flexibility will change slightly due to changes in these blending ratios, but within the above range, which is considered particularly preferable, flexibility and excellent breakdown voltage that will not cause any practical problems will be exhibited. Ru.
たとえば可撓性については、たとえば第１図に示す通り
、降伏点応力は、高密度ポリエチレンの配合量が増加す
るにつれて比例的に上昇するが、伸びについては該配合
量が２０〜３０重量％程度で急激に低下する傾向がある
。従ってこれ等両者がとくに要求される場合には、高密
度ボ、リエチレンが２０〜３０重量％の範囲が好ましく
、また伸びがあまり要求されない場合には、高密度ポリ
エチレンの含有量は、降伏点応力を填塞して５〜９５重
量％の広い範囲が使用できる。For example, regarding flexibility, as shown in Figure 1, the yield stress increases proportionally as the amount of high-density polyethylene increases, but regarding elongation, the amount increases by about 20 to 30% by weight. tends to decline rapidly. Therefore, if both of these are particularly required, the content of high-density polyethylene is preferably in the range of 20 to 30% by weight, and if elongation is not so required, the content of high-density polyethylene should be adjusted to the yield point stress. A wide range of 5 to 95% by weight can be used.
またインパルス破壊電圧については第２図に示す通り、
その使用温度によって配合割合を変えることが好ましい
。たとえば室温では高密度ポリエチレンの配合割合を５
〜９５重債％好ましくは２０〜８０重量％とすることが
好ましく、また加温された状態たとえば９０℃程度では
高密度ポリエチレンの配合割合を５〜４０重量％、また
は６０〜９５重量％程度とすることが好ましい。As for the impulse breakdown voltage, as shown in Figure 2,
It is preferable to change the blending ratio depending on the usage temperature. For example, at room temperature, the blending ratio of high density polyethylene is 5
It is preferable to set the amount to 95% by weight, preferably 20 to 80% by weight, and in a heated state, for example, at about 90°C, the blending ratio of high density polyethylene is about 5 to 40% by weight, or about 60 to 95% by weight. It is preferable to do so.
また本発明に於いては、これ等高密度ポリエチレン及び
低密度ポリエチレンのいずれか一方または双方を適当な
架橋剤を、或いは電子線等を用いる通常の架橋手段で架
橋することができる。これにより更に耐熱性を向上せし
めることができる。Further, in the present invention, either or both of these high-density polyethylene and low-density polyethylene can be crosslinked by a suitable crosslinking agent or by a conventional crosslinking method using an electron beam or the like. This can further improve heat resistance.
本発明の組成物には、必要に応じて従来がらこの種組成
物に使用されて来た各種の添加剤を添加するを妨げない
、その具体例としては、たとえば各種顔料、充填剤、老
化防止剤、難燃化剤、滑剤、電圧安定剤等を例示するこ
とができる。The composition of the present invention may contain various additives that have been conventionally used in compositions of this type, as required. Specific examples thereof include various pigments, fillers, anti-aging additives, etc. Examples include additives, flame retardants, lubricants, voltage stabilizers, and the like.
また本発明の組成物には、上記特性を損なわない範囲で
他の樹脂を配合することも出来る。これ等信の樹脂とし
ては、たとえばＥＶＡＳＥＥＡ等を挙げることが出来る
。Further, other resins can be added to the composition of the present invention within a range that does not impair the above characteristics. Examples of such resins include EVASEEA.
以下に実施例を挙げて本発明を説明する。 The present invention will be explained below with reference to Examples.
実施例１
高密度ポリエチレン（融点１３４℃、密度０．９６２ｇ
／ｃｏｔ、メルトインデックス１．１０、結晶化度７３
．６重量％）と低密度ポリエチレン（融点１０８°Ｃ３
密度０．９２０ｇ／ｃ＋Ｊ、メルトインデックス１．Ｉ
Ｏ１結晶化度４４．４重量％）とを第１図に示す所定量
で混合し、第３図に示すリセスシート（リセス部属約１
１謹）に成形し試料とした。この試料についてインパル
ス破壊電圧を次の様に測定した。Example 1 High density polyethylene (melting point 134°C, density 0.962g
/cot, melt index 1.10, crystallinity 73
．． 6% by weight) and low density polyethylene (melting point 108°C3
Density 0.920g/c+J, melt index 1. I
The recess sheet shown in FIG.
It was molded into a sample. The impulse breakdown voltage of this sample was measured as follows.
１×４０μ秒負極性標準波を用い、破壊予想電圧の７０
％値から５ｋＶ／１回のステップ昇圧法にて、シリコン
オイル中容電圧で３回印加により破壊に至らしめた。Using a 1 x 40 μsec negative polarity standard wave, the expected breakdown voltage is 70
Destruction was achieved by applying the voltage in the silicone oil three times using a step voltage increase method of 5 kV/time from the % value.
また、各試料の物理特性（可撓性）は、ＩＮＮレシート
成形後、恒／ＭＬ糟付き引張試験機によって測定した。In addition, the physical properties (flexibility) of each sample were measured using a Kou/ML tensile tester after INN receipt molding.
結晶化度の算出には、データ処理装置゛付き示差熱分析
器（Ｄ Ｓ Ｃ）を用いた。A differential thermal analyzer (DSC) with a data processing device was used to calculate the degree of crystallinity.
物理特性（可撓性）の測定結果を第１図に、またインパ
ルス破壊電圧の測定結果を第２Ｕ！Ｊに示し但し第１図
中実線は降伏点応力を、また点線は伸びを示す。第１図
並びに第２図中、ＬＤＰＥ並びにＨＤＰＥは夫々低密度
ポリエチレン、高密度ポリエチレンを示す、第３図の番
号は夫々（１）がエポキシ樹脂、（２）が導電性ペイン
ト、（３）がプラス平板電極、（４）が試料、（５）が
ポリ塩化ビニル、（６）が平円板電極を示す。The measurement results of physical properties (flexibility) are shown in Figure 1, and the measurement results of impulse breakdown voltage are shown in Figure 2! In FIG. 1, the solid line indicates the stress at yield point, and the dotted line indicates elongation. In Figures 1 and 2, LDPE and HDPE represent low-density polyethylene and high-density polyethylene, respectively.The numbers in Figure 3 are (1) for epoxy resin, (2) for conductive paint, and (3) for conductive paint. A positive flat plate electrode, (4) a sample, (5) polyvinyl chloride, and (6) a flat disc electrode.
〔発明の効果］
本発明の組成物は、従来の架橋ポリエチレンを主体とす
る樹脂組成物よりも更に優れたインパルス破壊電圧を有
し、且つ実用上支障の無い可撓性を有するので、電線就
中電カケープルの絶縁被覆用樹脂組成物として極めて好
適なものであり、その産業上の利用性は極めて高い。[Effects of the Invention] The composition of the present invention has an impulse breakdown voltage that is even better than that of conventional resin compositions mainly composed of crosslinked polyethylene, and has flexibility that does not pose a problem in practical use. It is extremely suitable as a resin composition for insulation coating of Chuden Kacaple, and its industrial applicability is extremely high.
第１図は、樹脂組成物の混合比と物理特性との関係を示
すグラフであり、第２図は、同じくインパルス破壊電圧
との関係を示すグラフである。また第３図はりセスシー
トシステムを示す概略図である。
ｌ・・・・エポキシ樹脂
２・・・・導電性ペイント
３・・・・フ゛ラス平（反電極
４・・・・試料
５・・・・ポリ塩化ビニル
６・・・・平円板電極（プラス）
（以上）
特許出願人 大日日本電線株式会社
第１図
混合」ｔ＊FIG. 1 is a graph showing the relationship between the mixing ratio of the resin composition and physical properties, and FIG. 2 is a graph showing the relationship with impulse breakdown voltage. FIG. 3 is a schematic diagram showing a beam access sheet system. l...Epoxy resin 2...Conductive paint 3...Firth flat (counter electrode 4...Sample 5...Polyvinyl chloride 6...Flat disk electrode (positive) ) (and above) Patent applicant Dainichi Nippon Electric Cable Co., Ltd. Figure 1 Mixture"t*
Claims (3)
有して成り、高密度ポリエチレンと低密度ポリエチレン
との混合比が前者９５〜５重量％、後者５〜９５重量％
である樹脂組成物。(1) Contains high-density polyethylene and low-density polyethylene, with the mixing ratio of the former being 95-5% by weight and the latter 5-95% by weight.
A resin composition that is
％、低密度ポリエチレン２０〜８０重量％である特許請
求の範囲第１項に記載の組成物。(2) The composition according to claim 1, wherein the mixing ratio is 80 to 20% by weight of high density polyethylene and 20 to 80% by weight of low density polyethylene.
なくとも１種が架橋した架橋高密度ポリエチレン及び（
又は）架橋低密度ポリエチレンである特許請求の範囲第
１項または第２項に記載の組成物。(3) Cross-linked high-density polyethylene and (
or) the composition according to claim 1 or 2, which is crosslinked low density polyethylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14505786A JPS633043A (en) | 1986-06-20 | 1986-06-20 | Resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14505786A JPS633043A (en) | 1986-06-20 | 1986-06-20 | Resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS633043A true JPS633043A (en) | 1988-01-08 |
Family
ID=15376381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14505786A Pending JPS633043A (en) | 1986-06-20 | 1986-06-20 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS633043A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04296342A (en) * | 1991-03-27 | 1992-10-20 | Dainippon Ink & Chem Inc | Polyethylene resin composition and extrusion coating material |
| JP2009249390A (en) * | 2008-04-01 | 2009-10-29 | Sumitomo Chemical Co Ltd | Resin composition for electric wire covering or for sheath, electric wire and cable |
| JP2014500335A (en) * | 2010-09-30 | 2014-01-09 | ダウ グローバル テクノロジーズ エルエルシー | Reusable thermoplastic insulator with improved breakdown strength |
-
1986
- 1986-06-20 JP JP14505786A patent/JPS633043A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04296342A (en) * | 1991-03-27 | 1992-10-20 | Dainippon Ink & Chem Inc | Polyethylene resin composition and extrusion coating material |
| JP2009249390A (en) * | 2008-04-01 | 2009-10-29 | Sumitomo Chemical Co Ltd | Resin composition for electric wire covering or for sheath, electric wire and cable |
| JP2014500335A (en) * | 2010-09-30 | 2014-01-09 | ダウ グローバル テクノロジーズ エルエルシー | Reusable thermoplastic insulator with improved breakdown strength |
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