JPS6329957A - Sealing type of semiconductor device - Google Patents
Sealing type of semiconductor deviceInfo
- Publication number
- JPS6329957A JPS6329957A JP17314786A JP17314786A JPS6329957A JP S6329957 A JPS6329957 A JP S6329957A JP 17314786 A JP17314786 A JP 17314786A JP 17314786 A JP17314786 A JP 17314786A JP S6329957 A JPS6329957 A JP S6329957A
- Authority
- JP
- Japan
- Prior art keywords
- rubber
- package base
- sealing
- base material
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 10
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 238000012856 packing Methods 0.000 claims abstract 4
- 238000000034 method Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置の封止形態に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a sealing form of a semiconductor device.
従来、半導体装置の封止形態は第２図に示す如き形態を
とるのが通例であつ之。すなわち、銅合金等から成るリ
ード・フレーム１１がセラミックあるいはプラスチック
あるいは金属等から成るパッケージ基体１２に形成され
、該リード・７レーム１１の一部にイメージ・センサー
等の集積回路（ＩＣ）チップ１３がリード線１４と共に
組立て配線され、前記パッケージ基材１２の表面に例え
ばエポキシ樹脂等から成る接着剤１５により、ガラスあ
るいはプラスチックあるいはセラミックあるいは金属等
から成るフタ（キャップ）１６が封着されて成る。Conventionally, the sealing form of a semiconductor device has generally been as shown in FIG. That is, a lead frame 11 made of copper alloy or the like is formed on a package base 12 made of ceramic, plastic, metal, etc., and an integrated circuit (IC) chip 13 such as an image sensor is mounted on a part of the lead frame 11. It is assembled and wired together with lead wires 14, and a lid (cap) 16 made of glass, plastic, ceramic, metal, etc. is sealed to the surface of the package base material 12 with an adhesive 15 made of, for example, epoxy resin.
しかし、上記従来技術によると、通常接着剤による封着
時には高温（２００℃〜５００℃）での封着を行なうた
め、接着剤に空気抜は穴が生じたり、接着剤そのものに
気泡が発生し、耐温性が劣るという問題点があった。However, according to the above-mentioned conventional technology, when sealing with adhesives, sealing is usually performed at high temperatures (200°C to 500°C), so air venting in the adhesive may create holes or bubbles may occur in the adhesive itself. However, there was a problem that the temperature resistance was poor.
本発明は、かかる従来技術の問題点をなくし、気密性の
良好な半導体装置の封止形態を提供する事を目的とする
。It is an object of the present invention to eliminate the problems of the prior art and to provide a sealed form of a semiconductor device with good airtightness.
上記間珈点を解決する之めに、本発明は、パッケージ基
材とフタ（キャップ）とをゴム・バンキングにより気密
封止する手段をとる４４を基本とする。In order to solve the above-mentioned problems, the present invention is based on a method 44 in which the package base material and the lid (cap) are hermetically sealed by rubber banking.
以下、実施例により本発明を詳述する。 Hereinafter, the present invention will be explained in detail with reference to Examples.
第１図は本発明の一実施例を示すバンキング封止ＩＣの
断面図である。すなわち、リード・フレーム１がパッケ
ージ基材２に形成され、該リードフレーム１の一部に、
ＩＣチップ３がリード線４と共に組立てられ、前記パッ
ケージ基材２の表面には、溝が形成されると共に、配溝
にテフロン・ゴムかう１ｆｆｌるゴム・バンキング５が
はめ込まれ、フタ（キャップ）６がその側面に於てゴム
・バンキング５と気密封止されるべく押し込まれて形成
されて成る。FIG. 1 is a sectional view of a banking-sealed IC showing one embodiment of the present invention. That is, a lead frame 1 is formed on a package base material 2, and a part of the lead frame 1 includes:
The IC chip 3 is assembled together with the lead wires 4, a groove is formed on the surface of the package base material 2, a rubber banking 5 made of Teflon rubber is fitted into the groove, and a lid (cap) 6 is fitted. is formed by being pressed into its side surface to be hermetically sealed with the rubber banking 5.
本発明の如く、ゴム・バンキング封止ＩＣでは、気密性
の高い封止が可能となる効果があυ、耐温性、耐水性に
すぐれたＩＣが提供できる効果がある。As in the present invention, the rubber banking sealed IC has the effect of enabling highly airtight sealing and providing an IC with excellent temperature resistance and water resistance.
第１図は本発明の一実施例を示すバンキング封止ＩＣの
断面図、第２図は従来技術による接着封止ＩＣの断面図
である。
１．１１・・・・・・リード・フレーム２、１２・・・
・・・パッケージ基材
５．１３・・・・・ｒ ｃチップ
４．１４・・・・・・リード線
５、・・・・・・・・・・・・ゴム・バンキング１５、
・・・・・・・・・接着剤
６．１６・・・・・・フタ（キャップ）０以上FIG. 1 is a sectional view of a banking-sealed IC according to an embodiment of the present invention, and FIG. 2 is a sectional view of an adhesive-sealed IC according to the prior art. 1.11... Lead frame 2, 12...
...Package base material 5.13...Rc chip 4.14...Lead wire 5,...Rubber banking 15,
・・・・・・Adhesive 6.16・・・・・・Lid (cap) 0 or more
Claims (1)
半導体装置が組立てられ、旦つ前記パッケージ基体には
フタ（キャップ）がゴム・パッキングを介して封止され
て成る事を特徴とする半導体装置の封止形態。The package base on which the lead frame is formed has a
1. A method of sealing a semiconductor device, characterized in that, after the semiconductor device is assembled, a lid (cap) is sealed to the package base via a rubber packing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17314786A JPS6329957A (en) | 1986-07-23 | 1986-07-23 | Sealing type of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17314786A JPS6329957A (en) | 1986-07-23 | 1986-07-23 | Sealing type of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6329957A true JPS6329957A (en) | 1988-02-08 |
Family
ID=15954975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17314786A Pending JPS6329957A (en) | 1986-07-23 | 1986-07-23 | Sealing type of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6329957A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102254878A (en) * | 2010-05-19 | 2011-11-23 | 三菱电机株式会社 | Semiconductor device |
-
1986
- 1986-07-23 JP JP17314786A patent/JPS6329957A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102254878A (en) * | 2010-05-19 | 2011-11-23 | 三菱电机株式会社 | Semiconductor device |
| JP2011243798A (en) * | 2010-05-19 | 2011-12-01 | Mitsubishi Electric Corp | Semiconductor device |
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