JPS63286424A - Epoxy resin composition for sealing semiconductor - Google Patents
Epoxy resin composition for sealing semiconductorInfo
- Publication number
- JPS63286424A JPS63286424A JP12275687A JP12275687A JPS63286424A JP S63286424 A JPS63286424 A JP S63286424A JP 12275687 A JP12275687 A JP 12275687A JP 12275687 A JP12275687 A JP 12275687A JP S63286424 A JPS63286424 A JP S63286424A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- phenol
- component
- type epoxy
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 24
- 239000000203 mixture Substances 0.000 title claims abstract description 13
- 239000004065 semiconductor Substances 0.000 title claims description 7
- 238000007789 sealing Methods 0.000 title 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229920003986 novolac Polymers 0.000 claims abstract description 20
- 150000002989 phenols Chemical class 0.000 claims abstract description 13
- 239000007859 condensation product Substances 0.000 claims abstract description 9
- 229930003836 cresol Natural products 0.000 claims abstract description 9
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000011256 inorganic filler Substances 0.000 claims abstract description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 6
- LSYXXLMBRSSBGS-UHFFFAOYSA-N 2,4,6-tris(hydroxymethyl)phenol Chemical compound OCC1=CC(CO)=C(O)C(CO)=C1 LSYXXLMBRSSBGS-UHFFFAOYSA-N 0.000 claims abstract 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract 2
- 238000005538 encapsulation Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- 125000005843 halogen group Chemical group 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 abstract description 9
- 239000000843 powder Substances 0.000 abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 5
- 239000005350 fused silica glass Substances 0.000 abstract description 3
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- RIWRFSMVIUAEBX-UHFFFAOYSA-N n-methyl-1-phenylmethanamine Chemical compound CNCC1=CC=CC=C1 RIWRFSMVIUAEBX-UHFFFAOYSA-N 0.000 abstract 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 15
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 13
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 8
- 239000000047 product Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000006482 condensation reaction Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 235000006408 oxalic acid Nutrition 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000001256 steam distillation Methods 0.000 description 4
- -1 Epicort 828 Chemical compound 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- 238000004821 distillation Methods 0.000 description 3
- 239000012153 distilled water Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- LLPKQRMDOFYSGZ-UHFFFAOYSA-N 2-methyl-4-methylimidazole Natural products CC1=CN=C(C)N1 LLPKQRMDOFYSGZ-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 229920003319 Araldite® Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007429 general method Methods 0.000 description 2
- JYGXADMDTFJGBT-VWUMJDOOSA-N hydrocortisone Chemical compound O=C1CC[C@]2(C)[C@H]3[C@@H](O)C[C@](C)([C@@](CC4)(O)C(=O)CO)[C@@H]4[C@@H]3CCC2=C1 JYGXADMDTFJGBT-VWUMJDOOSA-N 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 238000007086 side reaction Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- XOUAQPDUNFWPEM-UHFFFAOYSA-N 2,3,4-tris(hydroxymethyl)phenol Chemical compound OCC1=CC=C(O)C(CO)=C1CO XOUAQPDUNFWPEM-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- GZFGOTFRPZRKDS-UHFFFAOYSA-N 4-bromophenol Chemical compound OC1=CC=C(Br)C=C1 GZFGOTFRPZRKDS-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 235000004431 Linum usitatissimum Nutrition 0.000 description 1
- 240000006240 Linum usitatissimum Species 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 150000001447 alkali salts Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000004426 flaxseed Nutrition 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229940100630 metacresol Drugs 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- CQRYARSYNCAZFO-UHFFFAOYSA-N salicyl alcohol Chemical compound OCC1=CC=CC=C1O CQRYARSYNCAZFO-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、耐熱性、耐湿性および速硬化性の優れた半
導体封止用エポキシ樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) This invention relates to an epoxy resin composition for semiconductor encapsulation that has excellent heat resistance, moisture resistance, and fast curing properties.
（従来の技術）
半導体封止材料には、電気回路を外部環境から保護する
ために様々な厳しい特性が要求される。(Prior Art) Semiconductor encapsulation materials are required to have various strict properties in order to protect electrical circuits from the external environment.
中でも、耐熱性と耐湿性が重要である。Among these, heat resistance and moisture resistance are important.
一般に耐熱性を上げようとして、硬化剤に高分子量のノ
ボラック樹脂を用いると、エポキシ樹脂との相溶性が低
下して、硬化性や耐湿性が低下する。一方平均分子量が
４００〜５００の通常のフェノールノボラック樹脂は、
２核体を５〜２０重ｆ％含有するため、これが妨げとな
って充分な耐熱性が得られない。そこで、特開昭６０−
１３３０１７号記載の真空水蒸気蒸溜法や、溶剤を用い
た分別沈澱法等によって２核体を低減する方法もあるが
。Generally, when a high molecular weight novolac resin is used as a curing agent in an attempt to improve heat resistance, the compatibility with the epoxy resin decreases, resulting in a decrease in curability and moisture resistance. On the other hand, ordinary phenolic novolac resins with an average molecular weight of 400 to 500,
Since it contains 5 to 20 weight percent of dinuclear bodies, this hinders the ability to obtain sufficient heat resistance. Therefore, JP-A-60-
There are also methods for reducing binuclear bodies, such as the vacuum steam distillation method described in No. 133017 and the fractional precipitation method using a solvent.
これらの場合硬化物の耐熱性は向上するが２歩留が低下
してコストが高くなるだけでなく、場合によっでは軟化
点が高くなったり、溶剤に溶けにくくなる等著しく作業
性が低下する。In these cases, the heat resistance of the cured product improves, but not only does the yield drop and the cost rise, but in some cases, the softening point becomes high and it becomes difficult to dissolve in solvents, resulting in a significant decrease in workability. .
このような点から、耐熱性、耐湿性に優れ、コストや作
業性の面でも優れた。バランスのよい硬化剤が強く要望
されていた。From these points, it has excellent heat resistance and moisture resistance, and is also excellent in terms of cost and workability. There was a strong demand for a well-balanced curing agent.
（発明が解決しようとする問題点） この発明はこれらの要求を満足させる耐熱性。(Problem to be solved by the invention) This invention has heat resistance that satisfies these requirements.
耐湿性さらには速硬化性を兼ね備えた半導体封止用エポ
キシ樹脂組成物を提供するものである。The object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation that has both moisture resistance and rapid curing properties.
（問題点を解決するための手段）
本発明は、下記（ａ）〜（ｄ）の成分を含むことを特徴
とする半導体封止用エポキシ樹脂組成物に関する。(Means for Solving the Problems) The present invention relates to an epoxy resin composition for semiconductor encapsulation characterized by containing the following components (a) to (d).
（ａｌ ノボラック型エポキシ樹脂
（ｂ）一般式
フェノールと、フェノール、クレゾール、あるいはハロ
ゲン化フェノールとの縮合生成物１（Ｃ） 硬化促進
剤
（ｄｌ 無機質充填剤
本発明における（ａ）成分のノボラック型エポキシ樹脂
としては９例えば下記のものが挙げられる。(al Novolak type epoxy resin (b) Condensation product of general formula phenol and phenol, cresol, or halogenated phenol 1 (C) Curing accelerator (dl) Inorganic filler Novolac type epoxy resin as component (a) in the present invention Examples of the resin include the following.
（１）クレゾールノボラック型エポキシ樹脂；例えばチ
バ社のアラルダイトＥＣＮ１２３５．同１２７３、同１
２８０．住友化学工業社のＥＳＣＮ−２２０，日本化某
社のＥＯＣＮ−１０３８，油化シェルエポキシ社のエピ
コート１８１ （以上いずれも商品名）等。(1) Cresol novolak type epoxy resin; for example, Ciba's Araldite ECN1235. 1273, 1
280. ESCN-220 from Sumitomo Chemical Co., Ltd., EOCN-1038 from Nippon Kaisha, Epicoat 181 from Yuka Shell Epoxy Co., Ltd. (all of the above are trade names), and the like.
（ＩＩ） フェノールノボラック型エポキシ樹脂；例
えばダウケミカル社のＤＥＮ４３８．同４４８゜油化シ
ェルエポキシ社のエピコート１５２．同１５４、チパ社
のアラルダイトＥＰＮＩ １３８゜同１１３９ （以上
いずれも商品名）等。(II) Phenol novolak type epoxy resin; for example, DEN438 from Dow Chemical Company. 448° Epicoat 152 from Yuka Shell Epoxy Co., Ltd. 154, Chipa's Araldite EPNI 138° 1139 (all of the above are product names), etc.
（ｉｉｉ） ビスフェノールＡノボラック型エポキシ
樹脂：例えば大日本インキ社のエビクロンＮ８６５゜同
８８０（以上いずれも商品名）等。(iii) Bisphenol A novolak type epoxy resin: For example, Ebicuron N865°880 (all trade names) from Dainippon Ink Co., Ltd.
Ｏｖ）臭素化フェノールノボラックエポキシ樹脂；例え
ば日本化某社のブレン（商品名）等。Ov) Brominated phenol novolak epoxy resin; for example, Blen (trade name) manufactured by Nippon Kaisha.
しかして（ａ）成分としては１以上（：）ないしく１ｖ
）から選ばれる１または２以上のノボラック型エポキシ
樹脂が使用される。However, the component (a) is 1 or more (:) or 1v
) One or more novolac type epoxy resins are used.
またこの（ａ’）成分に、ビスフェノールＡより誘導さ
れるエポキシ樹脂（例えば油化シェルエポキシ社製のエ
ピコート８２８．エピコート１００１゜エピコー）１０
０４等）、あるいはテトラブロムビスフェノールＡより
誘導される臭素化エポキシ樹脂（例えば住友化学工業社
製のＥＳＢ−４００等）を必要量加えても良い。In addition, 10 epoxy resins derived from bisphenol A (e.g., Epicort 828, Epicort 1001° manufactured by Yuka Shell Epoxy Co., Ltd.) are added to this (a') component.
04, etc.) or a brominated epoxy resin derived from tetrabromobisphenol A (for example, ESB-400 manufactured by Sumitomo Chemical Co., Ltd.) may be added in the required amount.
次に９本発明における（ｂｌ成分の２．４．６−）＋７
メチロールト、フェノール、クレゾールアルイハノ・ロ
ゲン化フェノールとの縮合生成物は一般式公知のもので
あり、λ４．６−）リメチロールフェノールと、フェノ
ール、クレゾールあるいはハロゲン化フェノールとを縮
合反応させることにより得られる。Next, 9 in the present invention (2.4.6- of bl component) + 7
The condensation product of methylolphenol, phenol, and cresol alihano/halogenated phenol has a known general formula, and is produced by condensation reaction of λ4.6-)limethylolphenol and phenol, cresol, or halogenated phenol. can get.
２．４．６−）リメチロールフェノールは、ジャーナル
オブ アメリカン ケミカル ンサエテイ（Ｊｏｕｒ
ｎａｌ ｏｆ Ａｍｅｒｉｃａｎ Ｃｈｅｍｉｃ
ａｌ ５ｏｃｉｅｔｙ）を第７４巻、６２５７−６２
６０頁（１９５２年）に示されるように９例えばフェノ
ールとホルムアルデヒドを、アルカリ触媒の存在下、溶
媒に水を用いて、適当な反応条件下で反応させた後、酸
で触媒を中和することによ＃）得られる。アルカリ触媒
としては、リチウム、カリウム、ナトリウム、カルシウ
ム等のアルカリ金属またはアルカリ土類金属の酸化物、
あるいは水酸化物が用いられる。ホルムアルデヒドは、
その水溶液、パラホルム、ホルマリン等の形態で使用す
ることができる。また中和する際に用いる酸は、硫酸、
塩酸、リン酸等の無機酸、酢酸、蓚酸等の有機酸を使用
することができる。2.4.6-) Limethylolphenol is described in the Journal of American Chemical Science.
nal of American Chemistry
al 5ociety), Volume 74, 6257-62
As shown on page 60 (1952), for example, phenol and formaldehyde are reacted in the presence of an alkaline catalyst using water as a solvent under appropriate reaction conditions, and then the catalyst is neutralized with an acid. #) Obtained. As the alkali catalyst, oxides of alkali metals or alkaline earth metals such as lithium, potassium, sodium, and calcium;
Alternatively, hydroxides are used. Formaldehyde is
It can be used in the form of an aqueous solution, paraform, formalin, etc. The acids used for neutralization include sulfuric acid,
Inorganic acids such as hydrochloric acid and phosphoric acid, and organic acids such as acetic acid and oxalic acid can be used.
フェノールに対するホルムアルデヒドの仕込み時のモル
比は３．０〜３．５が好ましいが９反応条件によっては
必ずしもこの範囲にこだわる必要はない。また反応温度
は１５℃〜４０℃が副反応を抑制する点から好ましいが
、この範囲の反応温度を採用すると、トリメチロールフ
ェノールの収率を上げるためには５０〜２００時間を要
するので。The molar ratio of formaldehyde to phenol at the time of charging is preferably 3.0 to 3.5, but it is not necessarily limited to this range depending on the reaction conditions. Further, the reaction temperature is preferably 15°C to 40°C from the viewpoint of suppressing side reactions, but if the reaction temperature is within this range, it will take 50 to 200 hours to increase the yield of trimethylolphenol.
工業的には副反応物質の生成量が多少増えても。Industrially, even if the amount of side reaction substances produced increases somewhat.
反応温度を４０℃以上１００℃以下にして短時間で合成
する方法が適当である。It is appropriate to use a method in which the reaction temperature is set at 40° C. or higher and 100° C. or lower and the synthesis is carried out in a short time.
なお１反応液から未反応フェノール、未反応ホルムアル
デヒド、水および中和塩を除去する必要がある。その際
に、溶媒による洗浄、蒸溜による留去環一般的な方法が
用いられるが、留去の場合には縮合物の温度を６０℃以
下で行なうことが好ましい。このようにして得られたス
４，６−ドリメチロールフエノールはフェノール類との
縮合反応に供される。Note that it is necessary to remove unreacted phenol, unreacted formaldehyde, water, and neutralized salt from the reaction solution. At this time, general methods of removing the ring by washing with a solvent and distillation are used, but in the case of distillation, it is preferable to carry out the condensate at a temperature of 60° C. or lower. The 4,6-dorimethylolphenol thus obtained is subjected to a condensation reaction with phenols.
次にフェノール類と２．４．６−トリメチロールフェノ
ールとの縮合反応について説明する。ス４，６−ドリメ
チロールフエノール１モルに対し、フェノール類を１〜
５０モル、好ましくは６〜３０モルの割合で、酸性触媒
の存在下に２通常５０〜１６０℃、好ましくは５０〜１
２０℃の温度で。Next, a condensation reaction between phenols and 2.4.6-trimethylolphenol will be explained. 1 to 1 mole of 4,6-dorimethylolphenol contains phenols.
50 mol, preferably 6 to 30 mol, in the presence of an acidic catalyst, usually 50 to 160°C, preferably 50 to 1
At a temperature of 20°C.
１〜８時間反応させることによシ得られる。なお酸性触
媒は９反応終了後そのままの形、あるいはアルカリ塩を
加えて中和塩としてから、水洗等の方法で系外に除去さ
れる。また脱水および脱フエノール類には、溶媒による
洗浄、蒸溜による留去環一般的な方法が用いられるが、
微量残存するフェノール類を除去するには水蒸気蒸溜法
を用いるのが好ましい。It is obtained by reacting for 1 to 8 hours. Note that after the completion of the 9 reactions, the acidic catalyst is removed from the system as it is, or after adding an alkali salt to form a neutralized salt, by washing with water or the like. In addition, for dehydration and removal of phenols, general methods such as washing with a solvent and removing the ring by distillation are used.
Steam distillation is preferably used to remove trace amounts of phenols remaining.
上記フェノール類としてはフェノール、オルソクレゾー
ル、メタクレゾール、パラクレゾール。The above phenols include phenol, orthocresol, metacresol, and paracresol.
メタ・パラ混合のクレゾール、４−クロロフェノール、
４ブロモフエノール等のモノハロケン化フェノールを用
いることができる。また酸性触媒は。Meta/para mixed cresol, 4-chlorophenol,
Monohalokenated phenols such as 4-bromophenol can be used. Also, acidic catalysts.
硫酸、塩酸、リン酸等の無機酸、酢酸、蓚酸等の有機酸
を用いることができ、その使用量はフェノール１００重
量部に対して０．１〜１０重ｉ％が好ましい。Inorganic acids such as sulfuric acid, hydrochloric acid, and phosphoric acid, and organic acids such as acetic acid and oxalic acid can be used, and the amount used is preferably 0.1 to 10% by weight based on 100 parts by weight of phenol.
なお、この縮合反応は特に溶媒がなくても進行するが、
水、トルエン等の不活性な溶媒を用いても差し支えない
。また２、４．６−）リメチロールフェノールとフェノ
ール類とを最初から仕込むことも可能であるが、水、メ
タノール、エタノール等の溶剤に溶かして２滴下させな
がら反応させることが好ましい。Note that this condensation reaction proceeds even in the absence of a solvent, but
There is no problem in using an inert solvent such as water or toluene. It is also possible to prepare 2,4.6-)limethylolphenol and phenols from the beginning, but it is preferable to dissolve them in a solvent such as water, methanol, ethanol, etc. and allow them to react while dropping two drops.
また（ｂ）成分と併用する硬化剤は、ジアミノジフェニ
ルメタン、ジンアンジアミド等のアミン系硬化剤、ヘキ
サヒドロ無水フタル酸、テトラヒドロ無水フタル酸、メ
チルテトラヒドロ無水フタル酸。Further, curing agents used in combination with component (b) include amine curing agents such as diaminodiphenylmethane and dianediamide, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, and methyltetrahydrophthalic anhydride.
メチルへキサヒドロ無水フタル酸等の酸無水物系硬化剤
、フェノールノボラック樹脂、クレゾールノボラック樹
脂、ビスフェノールＡノボラック樹脂等のノボラック型
樹脂等、一般にエポキシ樹脂と架橋する通常の硬化剤か
ら選ばれる１または２以上を選択して用いることができ
るが、（ｂ）成分と相溶性が良好で耐熱性、耐湿性を損
わないノボラック型樹脂が好ましい。1 or 2 selected from ordinary curing agents that generally crosslink with epoxy resins, such as acid anhydride curing agents such as methylhexahydrophthalic anhydride, novolac type resins such as phenol novolac resins, cresol novolak resins, and bisphenol A novolak resins. Although the above can be selected and used, a novolak type resin that has good compatibility with component (b) and does not impair heat resistance and moisture resistance is preferred.
しかして（ｂ）成分の全硬化剤中に占める割合は３０重
量％以上であり、好ましくは５０重量％以上である。３
０重量％に満たない場合には２本発明の特徴である硬化
性、耐熱性、耐湿性といった諸機能が充分に発揮されな
い。The proportion of component (b) in the total curing agent is 30% by weight or more, preferably 50% by weight or more. 3
If the amount is less than 0% by weight, the two characteristics of the present invention, such as curability, heat resistance, and moisture resistance, will not be fully exhibited.
なお、硬化剤の総量は、エポキシ樹脂１当量に対して０
．５〜１．５当量とするのが好ましい。０．５当量未満
だと硬化速度が著しく遅くなり、逆に１．５当量を越え
ると混合時にゲル化が起こることがあり好ましくない。The total amount of curing agent is 0 per equivalent of epoxy resin.
．． It is preferable to set it as 5-1.5 equivalent. If the amount is less than 0.5 equivalents, the curing speed will be extremely slow, and if it exceeds 1.5 equivalents, gelation may occur during mixing, which is not preferable.
次に本発明における（Ｃ１成分の硬化促進剤とじては、
従来公知のものを′いずれも使用でき９例えばベンジル
ジメチルアミン、トリエチルアミン等の第３級アミン類
、２−メチル−４−メチルイミダゾール、２−エチル−
４−メチルイミダゾール。Next, in the present invention, the curing accelerator for the C1 component is as follows:
Any conventionally known amines can be used.9 For example, tertiary amines such as benzyldimethylamine and triethylamine, 2-methyl-4-methylimidazole, 2-ethyl-
4-Methylimidazole.
２−フェニルイミダゾール等のイミダゾール類。Imidazoles such as 2-phenylimidazole.
トリフェニルホスフィン等のホスフィン類等が挙げられ
、その添加量としては９通常エポキシ樹脂１００重量部
に対し０．１〜５重量部置部の割合で用いられる。Examples include phosphines such as triphenylphosphine, and the amount thereof added is usually 0.1 to 5 parts by weight per 100 parts by weight of the epoxy resin.
本発明において使用される（ｄｌ成分の無機充填剤とし
ては９通常無機充填剤として使用されているものをいず
れも使用することができる。例えば。As the inorganic filler of the dl component used in the present invention, any of those commonly used as inorganic fillers can be used. For example.
溶融シリカ粉、結晶性シリカ粉９石英ガラス粉。Fused silica powder, crystalline silica powder, 9 quartz glass powder.
アルミナ粉、タルク粉、炭酸カルシウム粉、ケイ酸カル
シウム粉、硫酸バリウム粉、ガラス繊維等が挙げられ、
これらから選ばれる１または２以上のものが使用される
。またその配合量としては。Examples include alumina powder, talc powder, calcium carbonate powder, calcium silicate powder, barium sulfate powder, glass fiber, etc.
One or more selected from these are used. Also, the amount of the mixture.
樹脂組成中に５０〜８０重ｆｊｋ％であることが好まし
い。５０重ｔｓ未満であると線膨張率が大きくなり、逆
に８０重量％を越えると、樹脂組成物の流動性が低下す
る。It is preferable that the amount is 50 to 80% by weight fjk in the resin composition. If it is less than 50 wts, the coefficient of linear expansion will increase, and if it exceeds 80 wt%, the fluidity of the resin composition will decrease.
本発明においては、必要に応じてさらに離型剤。In the present invention, a mold release agent is further used as necessary.
着色剤、カップリング剤、ま九は難燃剤等を添加するこ
とができる。Colorants, coupling agents, flame retardants, etc. can be added.
かくして９本発明の樹脂組成物はロールやニーダ等の慣
用の加熱混線装置を用いて容易に調整することができ、
その混合順序は特に限定されるものではない。Thus, the resin composition of the present invention can be easily prepared using a conventional heating mixing device such as a roll or a kneader.
The mixing order is not particularly limited.
（実施例＃＃Ｊ＃、）
次に２本発明の実施例を挙げてさらに具体的に説明する
が、これらの実施例は例示であシ９本発明はこれら実施
例によって制限されるものではない。(Example ##J#,) Next, the present invention will be explained in more detail by giving two examples, but these examples are merely illustrative.9 The present invention is not limited by these examples. do not have.
まず本発明の構成成分である（ｂ）成分の製造例につい
て説明する。First, a manufacturing example of component (b), which is a constituent component of the present invention, will be explained.
（ｂ） 成分の製造例１
コンデンサ、温度計９滴下ロートおよび攪拌装置を備え
た反応装置内に、蒸溜水１０００９．水酸化ナトリウム
４００９（１０モル）を入れ、攪拌させながら完全に溶
解させる。装置内を冷却しながら、フェノール９４０９
（１０モル）を加え均一な溶液とする。さらに装置内の
温度を３０℃以下に保ちながら、３７％ホルマリン水溶
液２４４０９（３０モル）を徐々に滴下する。滴下終了
後、装置内の温度を２０℃に保って１週間反応を行なっ
た。この反応液を２０Ｉ！のイソブロノ（ノールに滴下
して室温で１時間攪拌後放置すると。(b) Component Production Example 1 Into a reaction apparatus equipped with a condenser, a thermometer, 9 dropping funnels, and a stirring device, 10,009 ml of distilled water was placed. Add sodium hydroxide 4009 (10 mol) and dissolve completely while stirring. While cooling the inside of the device, add phenol 9409.
(10 mol) to make a homogeneous solution. Further, while maintaining the temperature inside the apparatus at 30° C. or lower, a 37% aqueous formalin solution 24409 (30 mol) was gradually added dropwise. After the dropwise addition was completed, the temperature inside the apparatus was maintained at 20° C. and the reaction was carried out for one week. Add this reaction solution to 20I! When added dropwise to isobrono(Nol) and stirred at room temperature for 1 hour, it was left to stand.
２、４．６−ドリメチロールフエノールのナトリウム塩
が白色状の沈澱物となって得られた。この沈澱物をさら
に１２Ｊのアセトン中に分散させ、酢酸６００ｇ（１０
モル）を徐々に滴下させながら。The sodium salt of 2,4,6-dorimethylolphenol was obtained as a white precipitate. This precipitate was further dispersed in 12 J of acetone, and 600 g of acetic acid (10
mol) while gradually dropping it.
室温で充分攪拌すると、新たに酢酸ナトリウムの沈澱が
生成した。この沈澱物を濾過除去した後。When the mixture was sufficiently stirred at room temperature, a new precipitate of sodium acetate was formed. After filtering off this precipitate.
アセトンを減圧留去すると、淡黄色透明の液状物質が得
られた。When the acetone was distilled off under reduced pressure, a pale yellow transparent liquid substance was obtained.
こうして得られた生成物をＧＰＣ分析および核磁気共鳴
（ＮＭＲ）分析により確認したところ。The product thus obtained was confirmed by GPC analysis and nuclear magnetic resonance (NMR) analysis.
未反応のフェノール、モノメチロール化物、ジメチロー
ル化物はほとんど認められず、生成物の主成分はフェノ
ールのトリメチロール化物であることが判明した。Almost no unreacted phenol, monomethylolated product, or dimethylolated product was observed, and it was found that the main component of the product was trimethylolated phenol.
この生成物９２０９（５モル）を６００ｇのメタノール
に溶解し、フェノール４２３０ ｇ ＊ 蓚酸４５ｇ、
蒸溜水１５００９を仕込んで、８０℃に昇温した反応装
置内に１．５時間かけて滴下した。This product 9209 (5 mol) was dissolved in 600 g of methanol, 4230 g of phenol * 45 g of oxalic acid,
Distilled water 15009 was charged and dripped into the reactor heated to 80° C. over 1.5 hours.
滴下終了後１反応温度を１００〜１０５℃に上げて６．
０時間線合反応させることによりメチロール基を完全に
反応させた。トリエタノールアミンで蓚酸を中和した後
、水洗によシ中和塩を除去し九。After the completion of dropping, 1. Raise the reaction temperature to 100-105°C and 6.
The methylol groups were completely reacted by carrying out the linear combination reaction for 0 hours. After neutralizing oxalic acid with triethanolamine, remove the neutralized salt by washing with water.
その後１２０〜１３０℃に温度を保ちつつ減圧で水およ
びフェノールを除去し、微量残存するフェノールを水蒸
気蒸溜で除去することにより縮合生成物（Ａ）を得た。Thereafter, water and phenol were removed under reduced pressure while maintaining the temperature at 120 to 130°C, and a trace amount of remaining phenol was removed by steam distillation to obtain a condensation product (A).
（Ａ）は次式（１）に示す化合物を５６重景チ、２核体
を２．２重量％含有する平均分子ｔ４６０．分散度１．
１３．軟化点９３℃の淡黄色の樹脂であった。(A) is a compound represented by the following formula (1) with an average molecule of t460. Dispersity 1.
13. It was a pale yellow resin with a softening point of 93°C.
（ｂ） 成分の製造例２
製造例１と同様の装置にオクトクレゾール４８６０ｇｔ
蓚酸４５ｇ、蒸溜水１５００９を仕込み、８０℃に昇温
後、製造例１で得たス４，６−ドリメチロールフエノー
ル９２０９（５モル）のメタノール溶液を１．５時間か
けて滴下した。滴下終了後９反応基度を１００−１０５
℃に上げて１５時間縮合反応させることによジメチロー
ル基を完全に反応させた。トリエタノールアミンで蓚駿
を中和した後、水洗により中和塩を除去した。(b) Component Production Example 2 4860 gt of octocresol was placed in the same equipment as Production Example 1.
After charging 45 g of oxalic acid and 15009 distilled water and raising the temperature to 80° C., a methanol solution of 4,6-dorimethylolphenol 9209 (5 mol) obtained in Production Example 1 was added dropwise over 1.5 hours. After the completion of the dropwise addition, the degree of 9 reaction groups was 100-105.
The dimethylol group was completely reacted by raising the temperature to 15 hours and conducting a condensation reaction for 15 hours. After neutralizing the linseed with triethanolamine, the neutralized salt was removed by washing with water.
その後１２０〜１３０℃に温度を保ちつつ、減圧で水お
よびオルトクレゾールを除去し、微量残存するオルトク
レゾールを水蒸気蒸溜で除去することにより縮合生成物
［Ｂ］を得た。〔Ｂ〕は次式（ＩＩ）Ｋ示す化合物を６
０重ｔＬ ２核体を２０重量％含有する平均分子！に
５１０．分散度１．０６．軟化点８５℃の淡黄色樹脂で
あった。Thereafter, water and orthocresol were removed under reduced pressure while maintaining the temperature at 120 to 130°C, and a trace amount of remaining orthocresol was removed by steam distillation to obtain a condensation product [B]. [B] is a compound represented by the following formula (II)K 6
0 weight tL Average molecule containing 20% by weight of dinuclear bodies! 510. Dispersity 1.06. It was a pale yellow resin with a softening point of 85°C.
次に本発明の実施例および比較例を以下に説明する。Next, Examples and Comparative Examples of the present invention will be described below.
実施例１〜８および比較例１〜２ まず上記製造例１〜２で得た縮合生成物〔Ａ〕。Examples 1-8 and Comparative Examples 1-2 First, the condensation products [A] obtained in Production Examples 1 and 2 above.
〔Ｂ〕、ならびにフェノールノボラック樹脂（明相化成
製、軟化点８４℃）、エポキシ樹脂としてオルトクレゾ
ールノボラックエポキシ樹脂ＥＯＣＮ−１０３８（日本
化薬製：エボキシ当量２２０ Ｌフェノールノボラック
エポキシ樹脂ＤＥＮ−４３８（ダウケミカル製：エポキ
シ当量１８０）を硬化促進剤として２−エチル−４−メ
チルイミダゾールおよび溶融シリカを表に示した組成比
でそれぞれ配合した。[B], as well as phenol novolac resin (manufactured by Meisho Kasei, softening point 84°C), ortho-cresol novolac epoxy resin EOCN-1038 (manufactured by Nippon Kayaku, epoxy equivalent weight 220 L), and phenol novolac epoxy resin DEN-438 (manufactured by Nippon Kayaku, softening point 84°C) as epoxy resin. 2-ethyl-4-methylimidazole and fused silica were each blended in the composition ratio shown in the table using epoxy equivalent (manufactured by Chemical Co., Ltd.: 180) as a curing accelerator.
次に溶融混合した後、プレス成形にて１５０℃で２時間
予備硬化し、さらに１７０℃で２時間後硬化して、試験
片を作成した。Next, after melt-mixing, the mixture was precured by press molding at 150° C. for 2 hours, and then post-cured at 170° C. for 2 hours to prepare a test piece.
得られた試験片の硬化性、耐熱性９強度、吸水性等を調
べた結果１表のように本発明による樹脂組成物を用いた
場合、従来のフェノールノボラック樹脂を用いる場合に
比べ樹脂特性が極めて優れていることがわかった。The results of examining the curability, heat resistance 9 strength, water absorption, etc. of the obtained test pieces showed that as shown in Table 1, when the resin composition according to the present invention was used, the resin properties were better than when using the conventional phenol novolac resin. It turned out to be extremely good.
なお、測定は次の方法に従った。Note that the measurement was performed according to the following method.
・流 動 性： ８ＭＮ工法 スパイラルフロー・効
果 性：１７０℃ ５分硬化 ＮＱ９３５・耐 熱 性
；熱物理試験（ＴＭＡ）測定による熱膨張係数の変曲点
をＴｇと
した。・Fluidity: 8MN construction method spiral flow effect
Fruit quality: Cured at 170°C for 5 minutes NQ935/Heat resistance: The inflection point of the thermal expansion coefficient measured by thermophysical test (TMA) was defined as Tg.
・曲げ強度：ＪＩＳＫ−６９１１
・吸水Ｘ：１２０℃、 １００９６．１００Ｈｒ・熱分
解温度：熱天秤測定による減量開始温度とした。・Bending strength: JISK-6911 ・Water absorption
（発明の効果）
本発明に１４リエノール類と、ス４．６− ） リメチ
ロールフェノールとの縮合生成物は、４核体を主成分と
する平均分子量が４００〜６００の樹脂であシワ２核体
含有率が極めて少なく１分散度が１．１〜１．２と極め
てシャープな分子量分布を有し。(Effect of the invention) The condensation product of the present invention with 14-lienols and 4.6-) limethylolphenol is a resin with an average molecular weight of 400 to 600 containing tetranuclear bodies as a main component and has two wrinkles. It has an extremely sharp molecular weight distribution with an extremely low molecular content and a degree of dispersion of 1.1 to 1.2.
しかもエポキシ基との反応に預かる水酸基が放射状に張
り出しているとと銹４ｈトπ１ｆ１５に一、”蓄′熱性
、耐湿性、および速硬化性に優れた半導体封止用エポキ
シ樹脂組成物を得ることができた。In addition, the hydroxyl groups that react with the epoxy groups extend out radially, which makes it possible to obtain an epoxy resin composition for semiconductor encapsulation that has excellent heat storage properties, moisture resistance, and quick curing properties. was completed.
Claims (1)
る半導体封止用エポキシ樹脂組成物。 （ａ）ノボラック型エポキシ樹脂 （ｂ）一般式 ▲数式、化学式、表等があります▼ （式中Ｘは水素原子、メチル基またはハロゲン原子を示
し、複数個のＸは同一でも異なっていてもよい）で表わ
される２，４，６−トリメチロールフェノールと、フェ
ノール、クレゾールあるいはハロゲン化フェノールとの
縮合生成物 （ｃ）硬化促進剤 （ｄ）無機質充填剤(1) An epoxy resin composition for semiconductor encapsulation characterized by containing the following components (a) to (d). (a) Novolac type epoxy resin (b) General formula ▲ Numerical formula, chemical formula, table, etc. ▼ (In the formula, X represents a hydrogen atom, methyl group, or halogen atom, and multiple Xs may be the same or different ) Condensation product of 2,4,6-trimethylolphenol represented by ) and phenol, cresol or halogenated phenol (c) Curing accelerator (d) Inorganic filler
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12275687A JPS63286424A (en) | 1987-05-20 | 1987-05-20 | Epoxy resin composition for sealing semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12275687A JPS63286424A (en) | 1987-05-20 | 1987-05-20 | Epoxy resin composition for sealing semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63286424A true JPS63286424A (en) | 1988-11-24 |
Family
ID=14843832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12275687A Pending JPS63286424A (en) | 1987-05-20 | 1987-05-20 | Epoxy resin composition for sealing semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63286424A (en) |
-
1987
- 1987-05-20 JP JP12275687A patent/JPS63286424A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2007043684A9 (en) | Phenol polymer, production method thereof and use thereof | |
| JP5012003B2 (en) | Low melt viscosity phenol novolac resin, its production method and its use | |
| JP2001055425A (en) | Resorcinol novolak resin, epoxy resin composition and its cured material | |
| JPH06184284A (en) | Phenolic aralkyl resin having low softening point and epoxy resin composition containing the resin | |
| JP3451104B2 (en) | Epoxy resin composition | |
| JPH04323214A (en) | Novolak resin, its production, epoxy resin, resin composition and its cured product | |
| JPS63286424A (en) | Epoxy resin composition for sealing semiconductor | |
| JP2004339371A (en) | Epoxy resin composition and cured product thereof | |
| JPH07173235A (en) | Allylnapththol cocondensate and epoxy resin composition | |
| JP2887214B2 (en) | Naphthol compound, its production method, epoxy compound, composition and cured product | |
| JPH08333428A (en) | Low-softening phenylphenolaralkyl resin and epoxy resin composition containing the same | |
| JPH05287053A (en) | Epoxy resin, resin composition and cured product | |
| JPH07216052A (en) | Epoxy resin and epoxy resin composition | |
| JP3325694B2 (en) | Epoxy resin and epoxy resin composition | |
| JP3704081B2 (en) | Epoxy resin, its production method and its use | |
| JPH07242727A (en) | Epoxy resin and epoxy resin composition | |
| JPH0570552A (en) | Epoxy resin composition | |
| JPS6226649B2 (en) | ||
| JPH07173234A (en) | Allylnaphthol cocondensate and epoxy resin composition | |
| JPH04316528A (en) | New compound, resin, resin composition and cured material | |
| JPH07165852A (en) | Allylnaphthol/alpha-naphthol cocondensate and epoxy resin composition | |
| JP4082668B2 (en) | Phenolic resin, epoxy resin composition and cured product thereof | |
| JPH07242728A (en) | Epoxy resin and epoxy resin composition | |
| JP2808034B2 (en) | Polyepoxy compound and epoxy resin composition | |
| JPH07224142A (en) | Epoxy resin and epoxy resin composition |