JPS63286423A - Resin composition for sealing - Google Patents
Resin composition for sealingInfo
- Publication number
- JPS63286423A JPS63286423A JP12017187A JP12017187A JPS63286423A JP S63286423 A JPS63286423 A JP S63286423A JP 12017187 A JP12017187 A JP 12017187A JP 12017187 A JP12017187 A JP 12017187A JP S63286423 A JPS63286423 A JP S63286423A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy
- resin composition
- lauroyl
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 title claims description 17
- 239000011342 resin composition Substances 0.000 title claims description 16
- 239000003822 epoxy resin Substances 0.000 claims abstract description 14
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 14
- 239000011256 inorganic filler Substances 0.000 claims abstract description 11
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 11
- 229920003986 novolac Polymers 0.000 claims abstract description 11
- 239000005011 phenolic resin Substances 0.000 claims abstract description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 4
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 4
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 3
- 239000010680 novolac-type phenolic resin Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 15
- 239000004472 Lysine Substances 0.000 abstract description 8
- 229910002026 crystalline silica Inorganic materials 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 5
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 5
- 238000005336 cracking Methods 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 239000012778 molding material Substances 0.000 description 9
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000005350 fused silica glass Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000004843 novolac epoxy resin Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- -1 and among these Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- QSSXJPIWXQTSIX-UHFFFAOYSA-N 1-bromo-2-methylbenzene Chemical compound CC1=CC=CC=C1Br QSSXJPIWXQTSIX-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical class [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 125000005480 straight-chain fatty acid group Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、耐湿性に優れ、クラックの発生やワイヤオー
プンのない、成形性、熱的特性のよい、半導体装置等の
封止用樹脂組成物に関する。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention provides semiconductor devices, etc., which have excellent moisture resistance, no cracking or open wires, good moldability, and good thermal characteristics. The present invention relates to a sealing resin composition.
（従来の技術）
従来、ダイオード、トランジスタ、集積回路などの電子
部品を熱硬化性樹脂を用いて封止する方法が行われてき
た。 この樹脂封止は、ガラス、金属、セラミックを用
いたハーメチックシール方式に比較して経済的に有利な
ために広く実用化されている。 封止用樹脂としては、
熱硬化性樹脂が使用され、その中でも信頼性および価格
の点からエポキシ樹脂が最も一般的に用いられている。(Prior Art) Conventionally, methods have been used to seal electronic components such as diodes, transistors, and integrated circuits using thermosetting resins. This resin sealing is widely put into practical use because it is economically advantageous compared to hermetic sealing methods using glass, metal, or ceramic. As a sealing resin,
Thermosetting resins are used, of which epoxy resins are most commonly used because of their reliability and cost.
エポキシ樹脂は酸無水物、芳香族アミン、ノボラック型
フェノール樹脂等の硬化剤が用いられている。 これら
の中でもノボラック型フェノール樹脂を硬化剤としたエ
ポキシ樹脂は、他の硬化剤を使用したものに比べて、成
形性、耐湿性に優れ、毒性がなく、かつ安価であるため
半導体封止材料として広く用いられている。For epoxy resins, curing agents such as acid anhydrides, aromatic amines, and novolac-type phenolic resins are used. Among these, epoxy resins using novolac type phenolic resin as a curing agent have excellent moldability and moisture resistance, are non-toxic, and are inexpensive compared to those using other curing agents, so they are used as semiconductor encapsulation materials. Widely used.
しかしながら、ノボラック型フェノール樹脂を硬化剤と
したエポキシ樹脂は、電子部品の高密度化に伴う厳しい
耐湿性や耐熱性に対する信頼性に劣るという欠点がある
。 こうした樹脂を使用した成形品は、温寒サイクルテ
ストを行うと、ボンディングワイヤのオープンや、樹脂
クラック、ベレットクラックが発生し、電子部品として
機能が果せず、また耐湿性試験を行うと、上記と同様な
現象が発生し、また同様に機能が果せなくなるという欠
点があった。 また近年は、放熱フィンを封止用樹脂で
完全に覆ってしまう絶縁タイプのパッケージが多くなっ
ているが、その場合に樹脂を通して熱放散しなくてはな
らないため、λ；５５Ｘ１０−’ Ｃａｌ／ＣＩ−Ｓｅ
ｃ ・’Ｃ以上とすることが要求されていた。 しかし
、以λ＝５５ｘｌＯ−’ ｃａｌ／ｃ＋ｇ・ｓｅｃ ・
℃以上にするなめには、充填剤を多量にしなくてはなら
ないため、成形時にピンホールが発生する等の欠点があ
った。 更に最近の封止用樹脂は、半導体の高密度化の
要求から低応力処方が一般的になっている。 このため
、熱膨張係数を下げて応力を下げる方法がとられるが、
その場合、充填剤を多電に混入するため成形の流動性に
劣り、ワイヤオープン等の生ずる欠点があった。However, epoxy resins using novolac-type phenolic resin as a curing agent have a drawback of being inferior in reliability with respect to moisture resistance and heat resistance, which are severe as electronic components become more dense. When molded products using such resins are subjected to hot and cold cycle tests, open bonding wires, resin cracks, and pellet cracks occur, making them unable to function as electronic components, and when moisture resistance tests are conducted, the above-mentioned problems occur. A similar phenomenon occurred, and there was also the drawback that the same function could not be achieved. In addition, in recent years, there are many insulation type packages in which the radiation fins are completely covered with sealing resin, but in this case, heat must be dissipated through the resin, so λ; 55X10-' Cal/CI -Se
c ・A rating of 'C or higher was required. However, since λ=55xlO-' cal/c+g・sec ・
In order to achieve a temperature higher than 0.degree. C., a large amount of filler must be used, which has the disadvantage of causing pinholes during molding. Furthermore, recent sealing resins have generally been formulated with low stress due to the demand for higher density semiconductors. For this reason, methods are used to reduce stress by lowering the coefficient of thermal expansion.
In this case, since the filler is mixed into the polyconductor, the fluidity of molding is poor, and there are drawbacks such as wire opening.
（発明が解決しようとする問題点）
本発明は、これらの欠点を解消するためになされたもの
で、無機質充填剤を多電に混入しなくても、成形性がよ
く、耐湿性に優れ、ボンディングワイヤのオープンやク
ラックの発生がなく、また、高熱伝導性もしくは熱膨張
係数の低い封止用樹脂組成物を提供しようとするもので
ある。(Problems to be Solved by the Invention) The present invention has been made to eliminate these drawbacks, and it has good moldability, excellent moisture resistance and The present invention aims to provide a sealing resin composition that does not cause open bonding wires or cracks, and has high thermal conductivity or a low coefficient of thermal expansion.
［発明の構成］
（問題点を解決するための手段）
本発明者らは、上記の目的を達成しようと鋭意研究を重
ねた結果、Ｎ′−ラウロイル−し−リジンを配合するこ
とによって、優れた耐湿性、成形性を有し、高熱伝導性
もしくは熱膨張係数の低い樹脂組成物が得られることを
見いだし、本発明を完成したものである。 すなわち、
本発明は、（Ａ）エポキシ樹脂、
（Ｂ）ノボラック型フェノール樹脂
（Ｃ）Ｎ’−ラウロイル−し−リジンおよび。[Structure of the Invention] (Means for Solving the Problems) As a result of intensive research aimed at achieving the above object, the present inventors have discovered an excellent solution by incorporating N'-lauroyl-cyno-lysine. The present invention was completed based on the discovery that a resin composition having excellent moisture resistance and moldability, high thermal conductivity, or a low coefficient of thermal expansion can be obtained. That is,
The present invention provides (A) an epoxy resin, (B) a novolac type phenolic resin, (C) N'-lauroyl-cys-lysine, and
（Ｄ）無機質充填剤
を必須成分とし、前記無機質充填剤を全体の樹脂組成物
に対して２５〜９０重量％の割合で含有することを特徴
とする封止用樹脂組成物である。(D) A sealing resin composition comprising an inorganic filler as an essential component and containing the inorganic filler in a proportion of 25 to 90% by weight based on the entire resin composition.
本発明に用いる（Ａ）エポキシ樹脂としては、その分子
中にエポキシ基を少なくとも２個有する化合物である限
り分子構造、分子量などに特に制限はなく、一般に封止
材料に使用されているものを広く包含することができる
。 例えばビスフェノール型の芳香族系、シクロヘキサ
ン誘導体等の脂環族系、さらに次の一般式で示されるエ
ポキシノボラック系等の樹脂が挙げられる。The epoxy resin (A) used in the present invention is not particularly limited in molecular structure, molecular weight, etc. as long as it is a compound having at least two epoxy groups in its molecule, and a wide variety of epoxy resins that are generally used in sealing materials can be used. can be included. Examples include aromatic resins such as bisphenol type, alicyclic resins such as cyclohexane derivatives, and epoxy novolak resins represented by the following general formula.
（式中、Ｒ１は水素原子、ハロゲン原子又はアルキル基
を、Ｒ２は水素原子又はアルキル基を、ｎは１以上の整
数を表す）。(In the formula, R1 represents a hydrogen atom, a halogen atom, or an alkyl group, R2 represents a hydrogen atom or an alkyl group, and n represents an integer of 1 or more).
これらは単独もしくは２種以上の混合系として使用する
。These may be used alone or in combination of two or more.
本発明に用いる（Ｂ）ノボラック型フェノール樹脂とし
ては、フェノール、アルキルフェノール等のフェノール
類とホルムアルデヒドあるいはパラホルムアルデヒドを
反応させて得られるノボラック型フェノール樹脂および
これらの変性樹脂、例えばエポキシ化もしくはブチル化
ノボラック型フェノール樹脂等が挙げられ、これらは単
独もしくは２種以上混合して使用する。The (B) novolak type phenolic resin used in the present invention includes novolak type phenol resins obtained by reacting phenols such as phenol and alkylphenols with formaldehyde or paraformaldehyde, and modified resins thereof, such as epoxidized or butylated novolak types. Examples include phenol resins, which may be used alone or in combination of two or more.
前記（Ａ）エポキシ樹脂と（Ｂ）ノボラック型フェノー
ル樹脂の配合割合は、エポキシ樹脂のエポキシ基（ａ
）と（Ｂ）ノボラック型フェノール樹脂のフェノール性
水酸基（ｂ ）との当量比［（ａ）／（ｂ）］が０．１
〜１０の範囲内にあることが望ましい、 この当量比が
０．１未満もしくは１０を超えると、耐湿性、成形作業
性および硬化物の電気特性が悪くなり、いずれの場合も
好ましくない、 従って、上記の範囲内に限定するのが
よい。The blending ratio of the above (A) epoxy resin and (B) novolac type phenol resin is based on the epoxy group (a
) and the phenolic hydroxyl group (b) of the novolac type phenolic resin (B) [(a)/(b)] is 0.1.
It is desirable that the equivalent ratio be within the range of ~10. If this equivalence ratio is less than 0.1 or exceeds 10, the moisture resistance, molding workability, and electrical properties of the cured product will deteriorate, which is undesirable in either case. It is best to limit it within the above range.
本発明に用いる（Ｃ）Ｎ’−ラウロイル−し−リジンと
しては、次の構造式を有するものが使用される。As (C)N'-lauroyl-lysine used in the present invention, one having the following structural formula is used.
具体的な化合物としては、例えばアミホープＬＬ（味の
素社製、商品名）を挙げることができる。As a specific compound, for example, Amihope LL (manufactured by Ajinomoto Co., Ltd., trade name) can be mentioned.
本発明に用いる（Ｄ）無機質充填剤としては、広く一般
に使用されているものが包含される。The inorganic filler (D) used in the present invention includes those that are widely and generally used.
例えばシリカ、アルミナ、三酸化アンチモン、タルク、
炭酸カルシウム、チタンホワイト、クレー、マイカ、ベ
ンガラ、ガラス繊維、炭素繊維等が挙げられ、これらの
中でも溶融シリカ、結晶性シリカが好ましく用いられる
。 成形性良好で高熱伝導性の封止用樹脂組成物の場合
は結晶性シリカ、成形性良好で熱膨張係数の低い封止用
樹脂組成物の場合は溶融シリカを用いる。 或いは両方
を混合使用してもよい。For example, silica, alumina, antimony trioxide, talc,
Examples include calcium carbonate, titanium white, clay, mica, red iron oxide, glass fiber, carbon fiber, and among these, fused silica and crystalline silica are preferably used. Crystalline silica is used in the case of a sealing resin composition with good moldability and high thermal conductivity, and fused silica is used in the case of a sealing resin composition with good moldability and a low coefficient of thermal expansion. Alternatively, a mixture of both may be used.
これらの無機質充填剤は単独もしくは２種以上混合して
使用する。 無機質充填剤の配合割合は、全体の樹脂組
成物に対して、２５〜９０重量％含有することが望まし
い、 その割合が２５重量％未満では耐湿性、耐熱性お
よび機械的特性、更に成形性に効果なく、また９０重量
％を超えるとカサバリが大きくなり成形性が悪く実用に
適さない。These inorganic fillers may be used alone or in combination of two or more. The blending ratio of the inorganic filler is preferably 25 to 90% by weight based on the entire resin composition. If the ratio is less than 25% by weight, moisture resistance, heat resistance, mechanical properties, and moldability will deteriorate. There is no effect, and if it exceeds 90% by weight, the bulk will be large and the moldability will be poor, making it unsuitable for practical use.
本発明の封止用樹脂組成物は、エポキシ樹脂、ノボラッ
ク型フェノール樹脂、Ｎ′−ラウロイル−し−リジンお
よび無機質充填剤を必須成分とするが、必要に応じて例
えば天然ワックス類１合成ワックス類、直鎖脂肪酸の金
属塩、酸アミド、エステル類、パラフィン類などの離型
剤、塩素化パラフィン、ブロムトルエン、ヘキサブロム
ベンゼン、三酸化アンチモンなどの難燃剤、カーボンブ
ラック、ベンガラなどの着色剤、シランカップリング剤
、種々の硬化促進剤等を適宜添加配合することができる
。The sealing resin composition of the present invention contains an epoxy resin, a novolac type phenol resin, N'-lauroyl-cys-lysine, and an inorganic filler as essential components, but may optionally contain natural waxes, synthetic waxes, etc. , metal salts of straight chain fatty acids, acid amides, esters, mold release agents such as paraffins, flame retardants such as chlorinated paraffins, bromotoluene, hexabromobenzene, antimony trioxide, coloring agents such as carbon black, red iron, A silane coupling agent, various curing accelerators, etc. can be added and blended as appropriate.
本発明の封止用樹脂組成物を成形材料として製造する場
合の一般的な方法は、前述したエポキシ樹脂、ノボラッ
ク型フェノール樹脂、Ｎ４−ラウロイル−し−リジン、
無機質充填剤、その他の所定の組成比に選んだ原料組成
分をミキサー等によって充分均一に混合した後、更に熱
ロールによる溶融混合処理、又はニーダ等による混合処
゛理を行い、次いで冷却固化させ、適当な大きさに粉砕
して成形材料とする。 こうして得られた成形材料は電
子部品又は電気部品の封止、被覆、絶縁等に適用すれば
、優れた特性および高い信頼性を付与することができる
。A general method for producing the sealing resin composition of the present invention as a molding material includes the above-mentioned epoxy resin, novolac type phenol resin, N4-lauroyl-cylysine,
After thoroughly and uniformly mixing the inorganic filler and other raw materials selected in a predetermined composition ratio using a mixer, etc., the mixture is further melted and mixed using heated rolls or mixed using a kneader, etc., and then cooled and solidified. , crush it to an appropriate size and use it as a molding material. The molding material thus obtained can provide excellent properties and high reliability when applied to sealing, covering, insulating, etc. electronic or electrical components.
（作用）
Ｎ６−ラウロイル−し−リジンを特に溶融シリカ又は結
晶性シリカとともに用いることによって、樹脂組成物に
良好な成形性、耐湿性を与え、また高熱伝導性もしくは
低い熱膨張係数の樹脂組成物が得られるものである。(Function) By using N6-lauroyl-cyo-lysine, especially in conjunction with fused silica or crystalline silica, the resin composition can be given good moldability and moisture resistance, and also have high thermal conductivity or a low coefficient of thermal expansion. is obtained.
（実施例）
次に本発明を実施例によって具体的に説明するが、本発
明はこれらの実施例によって限定されるものでない、
以下の実施例および比較例おいてｒ％」とあるのは「重
量％」を意味する。(Examples) Next, the present invention will be specifically explained by examples, but the present invention is not limited by these examples.
In the following Examples and Comparative Examples, "r%" means "wt%".
実施例 １
クレゾールノボラックエポキシ樹脂（フェノール当量２
１５） １１％に、ノボラック型フェノール樹脂（フェ
ノール当量１０７） ６％、Ｎ′−ラウロイル−し−リ
ジン０．３％、結晶性シリカ粉末８０％、その他２．７
％を常温で混合し、次いで９０〜９５℃で混練して冷却
した後、粉砕して成形材料を製造した。 得られた成形
材料をタブレット化し予熱して、トランスファー成形で
１７０℃に加熱した金型内に注入し、硬化させて成形品
（封止品）を得た。Example 1 Cresol novolac epoxy resin (phenol equivalent 2
15) 11%, novolak type phenol resin (phenol equivalent: 107) 6%, N'-lauroyl-cyno-lysine 0.3%, crystalline silica powder 80%, others 2.7
% were mixed at room temperature, then kneaded at 90-95°C, cooled, and pulverized to produce a molding material. The obtained molding material was made into a tablet, preheated, injected into a mold heated to 170° C. by transfer molding, and cured to obtain a molded product (sealed product).
この成形品について成形性、熱伝導率、熱膨張係数等を
試験したので、その結果を第１表に示しな。This molded article was tested for moldability, thermal conductivity, coefficient of thermal expansion, etc., and the results are shown in Table 1.
本発明の顕著な効果が確認された。The remarkable effects of the present invention were confirmed.
実施例 ２
クレゾールノボラックエポキシ樹脂（エポキシ当量２１
５） １２％に、ノボラック型フェノール樹脂（フェノ
ール当ｊＬ １０７） ６％、Ｎ１−−ラウロイル−Ｌ
−リジン０．３％、シリカ粉末７５％およびその他６゜
７％を実施例１と同様に混合、混練して成形材料を製造
した。 次、いて実施例１と同様にして成形品を得、そ
の成形品について諸特性を試験したのでその結果を第１
表に示した。 特に成形性、熱伝導率、熱膨張係数に優
れており、本発明の顕著な効果が認められた。Example 2 Cresol novolac epoxy resin (epoxy equivalent weight 21
5) 12%, novolac type phenolic resin (phenol per jL 107) 6%, N1--Lauroyl-L
- 0.3% lysine, 75% silica powder and 6.7% other ingredients were mixed and kneaded in the same manner as in Example 1 to produce a molding material. Next, a molded product was obtained in the same manner as in Example 1, and various properties of the molded product were tested.
Shown in the table. In particular, it was excellent in moldability, thermal conductivity, and coefficient of thermal expansion, and the remarkable effects of the present invention were recognized.
比較例
クレゾールノボラックエポキシ樹脂（エポキシ当ｉ ２
１５） １１％に、ノボラック型フェノール樹脂（フェ
ノール当ｊｌ １Ｇ？） ６％、シリカ粉末８０．３％
、およびその他２．７％を実施例１と同様にして成形材
料を製造した。 この成形材料を用いて成形品とし、成
形品の諸特性について実施例１と同様にして試験をした
ので、その結果を第１表に示した。Comparative Example Cresol novolac epoxy resin (i 2 per epoxy
15) 11%, novolac type phenolic resin (phenol per jl 1G?) 6%, silica powder 80.3%
, and 2.7% of others were prepared in the same manner as in Example 1 to produce a molding material. This molding material was used to make a molded article, and the various properties of the molded article were tested in the same manner as in Example 1. The results are shown in Table 1.
比較例 ２
実施例２においてＮ５−ラウロイル−し−リジンを除い
た以外はすべて実施例２と同様にして成形材料、成形品
を得て、また同様に諸特性を試験したのでその結果を第
１表に示した。Comparative Example 2 A molding material and a molded article were obtained in the same manner as in Example 2 except that N5-lauroyl-cylysine was removed, and various properties were tested in the same manner. Shown in the table.
第１表
（単位）
ネ： Ｔｏ−２２０絶縁タイプ型で１００キヤビテイ
中完全に充填したキャビティ数
［発明の効果］
以上の説明および第１表から明らかなように、本発明の
封止用樹脂組成物は耐湿性に優れているため温寒サイク
ルテストを行ってもワイヤオープンや樹脂クラックの発
生がなく、また成形性、高熱伝導性に優れた、熱膨張係
数の低いもので、電子・電気部品の封止等に用いた場合
、充分な信頼性を得ることができる。Table 1 (unit) N: Number of completely filled cavities out of 100 cavities in To-220 insulation type mold [Effects of the invention] As is clear from the above explanation and Table 1, the sealing resin composition of the present invention The material has excellent moisture resistance, so there is no wire open or resin cracking even when subjected to hot and cold cycle tests.It also has excellent moldability, high thermal conductivity, and a low coefficient of thermal expansion, making it suitable for electronic and electrical parts. When used for sealing etc., sufficient reliability can be obtained.
Claims (1)
に対して２５〜９０重量％の割合で含有することを特徴
とする封止用樹脂組成物。 ２ エポキシ樹脂のエポシキ基（ａ）とノボラック型フ
ェノール樹脂のフェノール性水酸基（ｂ）との当量比［
（ａ）／（ｂ）］が０．１〜１０の範囲内にある特許請
求の範囲第１項記載の封止用樹脂組成物。[Scope of Claims] 1 (A) an epoxy resin, (B) a novolak type phenolic resin, (C) N^ε-lauroyl-L-lysine, and (D) an inorganic filler are essential components, and the inorganic filler is A sealing resin composition characterized by containing the resin composition in an amount of 25 to 90% by weight based on the entire resin composition. 2 Equivalence ratio of the epoxy group (a) of the epoxy resin and the phenolic hydroxyl group (b) of the novolac type phenolic resin [
(a)/(b)] is within the range of 0.1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12017187A JPH0739468B2 (en) | 1987-05-19 | 1987-05-19 | Sealing resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12017187A JPH0739468B2 (en) | 1987-05-19 | 1987-05-19 | Sealing resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63286423A true JPS63286423A (en) | 1988-11-24 |
| JPH0739468B2 JPH0739468B2 (en) | 1995-05-01 |
Family
ID=14779684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12017187A Expired - Lifetime JPH0739468B2 (en) | 1987-05-19 | 1987-05-19 | Sealing resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739468B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02189326A (en) * | 1989-01-18 | 1990-07-25 | Mitsubishi Petrochem Co Ltd | Epoxy resin composition for sealing electronic component |
-
1987
- 1987-05-19 JP JP12017187A patent/JPH0739468B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02189326A (en) * | 1989-01-18 | 1990-07-25 | Mitsubishi Petrochem Co Ltd | Epoxy resin composition for sealing electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0739468B2 (en) | 1995-05-01 |
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