JPS63283100A - Automatic mounting device for electronic component - Google Patents
Automatic mounting device for electronic componentInfo
- Publication number
- JPS63283100A JPS63283100A JP62117905A JP11790587A JPS63283100A JP S63283100 A JPS63283100 A JP S63283100A JP 62117905 A JP62117905 A JP 62117905A JP 11790587 A JP11790587 A JP 11790587A JP S63283100 A JPS63283100 A JP S63283100A
- Authority
- JP
- Japan
- Prior art keywords
- component
- sensor
- detection
- fiber
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims abstract description 18
- 239000013307 optical fiber Substances 0.000 claims abstract description 4
- 239000000835 fiber Substances 0.000 abstract description 12
- 210000000078 claw Anatomy 0.000 abstract description 11
- 230000003287 optical effect Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はチップ状電子部品の自動袋＠装置に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an automatic bagging device for chip-shaped electronic components.
従来、チップ状電子部品の自動装着装置における部品装
置ヘッド部の部品保持状態検出手段は第３図に示す通り
、吸着ノズル６により吸着されたチップ状電子部品７は
水平方向位置決めツメ５及び８により位置決め後、真空
センサー２１によって、部品の仔無状態検出が行われて
いた。Conventionally, as shown in FIG. 3, the component holding state detecting means of the component device head in an automatic mounting device for chip-shaped electronic components is as shown in FIG. After positioning, the vacuum sensor 21 detects whether the component is free or not.
しかし、従来の真空センサーによる検出手段では、部品
の仔無や保持の状態の検出は可能であるが、第４図（ａ
）に示す吸着ミス、第４図（ｂ）に示す吸着方向ミスに
よる装置不良の主要因の検出が不可能であり自動袋＠装
置の信頼性が問題であった。又真空センサー２１と吸着
ノズル６の距離が離れている事から真空センサーの作動
に時間を要し、装置の高速化を妨げていた。However, with conventional detection means using vacuum sensors, it is possible to detect the presence of parts and the state of retention, but
) and the suction direction error shown in FIG. 4(b), which were the main causes of device failure, could not be detected, and the reliability of the automatic bag @ device was a problem. Furthermore, since the vacuum sensor 21 and the suction nozzle 6 are far apart, it takes time for the vacuum sensor to operate, which hinders speeding up of the device.
そこで、 本発明は従来の問題点を解決する為にチップ
状電子部品７が吸着ノズル６に無い場合及び吸着ミスや
方向ミスの保持状態を高速で検出し、信頼性の高い自動
装着装置を得る事を目的とする。Therefore, in order to solve the conventional problems, the present invention detects at high speed the case where the chip-shaped electronic component 7 is not present in the suction nozzle 6, the holding state due to a suction error or the wrong direction, and provides a highly reliable automatic mounting device. aim at something.
上記問題点を解決する為に、本発明の電子部品自動基＠
装置は、チップ状電子部品の供給部と、チップ状電子部
品を前記供給部から回路基板へ移載する部品装着ヘッド
部と、回路基板を支持する回路基板支持部とから構成さ
れる電子部品自動基＠装置において前記部品装着ヘッド
部の部品検出手段として光ファイバーセンサーを用い、
部品の保持状態の検出を行う事を特徴とする。In order to solve the above problems, the electronic component automatic base of the present invention @
The device is an electronic component automatic device that includes a supply section for chip-shaped electronic components, a component mounting head section that transfers the chip-shaped electronic components from the supply section onto a circuit board, and a circuit board support section that supports the circuit board. In the base @ device, an optical fiber sensor is used as a component detection means of the component mounting head,
It is characterized by detecting the holding state of parts.
本発明の上記構成によれば、装着ヘッド部の光ファイバ
ーセンサーにより、部品の有無、吸Ｖミスによる保持状
態が同時に検出でき、 高速でかつ、信頼性の高い装着
が可能となるものである。According to the above configuration of the present invention, the presence or absence of a component and the holding state due to a suction V error can be simultaneously detected by the optical fiber sensor in the mounting head, and high-speed and highly reliable mounting is possible.
以下に本発明の実施例を図にもとづいて説明する。第１
図は本発明の装着ヘッド部断面構造図であり、昇降軸１
は吸着ノズル６とバネ１０、及び真空吸着穴２を備え、
チップ状電子部品７の吸着を行う。水平方向位置決ツメ
５及び８はツメ開閉軸３ツメ開閉カム９によって開閉さ
れる。ランプ１１より投光された光は、部品有無検出用
ファイバー１４、保持姿勢検出用ファイバー１３を伝送
し、水平方向位置決ツメ８を通り対向す′る水平方向位
置決ツメ５に固定された受光側ファイバー１９．２０に
伝送され部品有無検出用光センサー１５、 保持姿勢検
出用センサー１６に送られる。Embodiments of the present invention will be described below based on the drawings. 1st
The figure is a cross-sectional structural diagram of the mounting head part of the present invention, and shows the elevating shaft 1.
is equipped with a suction nozzle 6, a spring 10, and a vacuum suction hole 2,
The chip-shaped electronic component 7 is adsorbed. The horizontal positioning claws 5 and 8 are opened and closed by a claw opening/closing shaft 3 claw opening/closing cam 9. The light emitted from the lamp 11 is transmitted through a component presence/absence detection fiber 14 and a holding posture detection fiber 13, passes through a horizontal positioning claw 8, and is fixed to an opposing horizontal positioning claw 5. It is transmitted to the side fibers 19 and 20 and sent to the optical sensor 15 for detecting the presence or absence of parts and the sensor 16 for detecting the holding position.
部品を無検出センサーの光路がチップ状電子部品７によ
って遮断され、 保持姿勢検出用センサー１６が作動し
た状態が正常状態であり、 第２図（ａ）、第２図（ｂ
）に示す吸着ミス、方向ミスの保持状態では保持姿勢検
出用センサー１６の光路も遮断される。 又、部品が無
の場合には、部品有無検出用センサー１５と保持姿勢検
出用センサー１６は共に作動する。The normal state is when the optical path of the sensor that detects no components is blocked by the chip-shaped electronic component 7 and the holding posture detection sensor 16 is activated, as shown in Figures 2(a) and 2(b).
), the optical path of the sensor 16 for detecting the holding posture is also blocked in the holding state where there is a suction error or direction error. Further, when there is no component, both the component presence/absence detection sensor 15 and the holding posture detection sensor 16 operate.
本発明は以上の説明のとうり、従来困難であった吸着ミ
ス、方向ミスの保持状態検出が可能となり、装着不良が
大幅に解消され、信頼性の高い電子部品の自動装着が実
現された。As explained above, the present invention makes it possible to detect the holding state of suction errors and orientation errors, which was difficult in the past, and largely eliminates mounting defects, realizing highly reliable automatic mounting of electronic components.
又、従来の真空センサーに比べ応答時間が短縮され、装
着スピードがより高速化された。In addition, the response time is shortened compared to conventional vacuum sensors, and the installation speed is faster.
第１図は本発明の実施例の装着ヘッド部の断面図。
第２図（ａ）、第２図（ｂ）はこの発明の実施例におけ
る誤吸着を示す断面図。
第３図は従来の装着ヘッド部の断面図であり、第４図（
ａ）、第４図（ｂ）は従来の解決困難な吸着をした伏態
図である。
１・・・・・・昇降軸
２・・・・・・真空穴
３・・・・・・水平方向位置決ツメ開閉軸４・・・・・
・スプリング
５・・・・・・水平方向位置決ツメ
６・・・・・・吸着ノズル
７・・・・・・チップ状電子部品
８・・・・・・水平方向位置決ツメ
９・・・・・・水平方向位置決ツメ開閉カム１０・・・
・・・スプリング
１１・・・・・・投光ランプ
１２・・・・・・ファイバー保持具
１３・・・・・・保持状態検出ファイバー１４・・・・
・・部品有無検出ファイバー１５・・・・・・部品有無
検出用センサー１６・・・・・・保持状態検出用光セン
サ−１７・・・・・・保持具
１８・・・・・・ファイバー保持具
１９・・・・・・部品有無検出受光側ファイバー２０・
・・・・・保持姿勢検出受光側ファイバー２１・・・・
・・真空センサー
以 上
出願人 セイコーエプソン株式会社
代理人 弁理士 最 上 務 他１名藷３ 霞FIG. 1 is a sectional view of a mounting head portion according to an embodiment of the present invention. FIGS. 2(a) and 2(b) are cross-sectional views showing erroneous suction in the embodiment of the present invention. Figure 3 is a sectional view of a conventional mounting head, and Figure 4 (
a) and FIG. 4(b) are horizontal diagrams showing conventional suction which is difficult to solve. 1...Elevating axis 2...Vacuum hole 3...Horizontal positioning claw opening/closing axis 4...
・Spring 5...Horizontal positioning claw 6...Suction nozzle 7...Chip-shaped electronic component 8...Horizontal positioning claw 9... ...Horizontal positioning claw opening/closing cam 10...
... Spring 11 ... Flood lamp 12 ... Fiber holder 13 ... Holding state detection fiber 14 ...
...Component presence/absence detection fiber 15...Sensor for component presence/absence detection 16...Optical sensor for holding state detection 17...Holder 18...Fiber holding Tool 19... Component presence/absence detection light receiving side fiber 20.
...Holding posture detection light receiving side fiber 21...
...Vacuum sensors and above Applicant: Seiko Epson Co., Ltd. Agent Patent attorney Tsutomu Mogami and 1 other person Kasumi 3
Claims (1)
を前記供給部から回路基板へ移載する部品装置ヘッド部
と、回路基板を支持する、回路基板支持部とから構成さ
れる電子部品自動装着装置において、前記部品装着ヘッ
ド部の部品検出手段として光ファイバーセンサーを用い
、部品の保持状態の検出を行う事を特徴とする電子部品
自動装着装置。(1) An electronic component consisting of a supply section for chip-shaped electronic components, a component device head section that transfers the chip-shaped electronic components from the supply section onto a circuit board, and a circuit board support section that supports the circuit board. An automatic electronic component mounting device characterized in that an optical fiber sensor is used as component detection means in the component mounting head to detect a holding state of a component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62117905A JPS63283100A (en) | 1987-05-14 | 1987-05-14 | Automatic mounting device for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62117905A JPS63283100A (en) | 1987-05-14 | 1987-05-14 | Automatic mounting device for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63283100A true JPS63283100A (en) | 1988-11-18 |
Family
ID=14723096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62117905A Pending JPS63283100A (en) | 1987-05-14 | 1987-05-14 | Automatic mounting device for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63283100A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0661693A (en) * | 1992-08-04 | 1994-03-04 | Yamaha Motor Co Ltd | Component mounting machine |
| JPH06104596A (en) * | 1992-08-07 | 1994-04-15 | Yamaha Motor Co Ltd | Method and system for loading component |
| JPH06152195A (en) * | 1992-11-05 | 1994-05-31 | Yamaha Motor Co Ltd | Detecting equipment for component suction state of mounting machine |
| USRE38025E1 (en) | 1991-02-22 | 2003-03-11 | Cyberoptics Corporation | High precision component alignment sensor system |
-
1987
- 1987-05-14 JP JP62117905A patent/JPS63283100A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE38025E1 (en) | 1991-02-22 | 2003-03-11 | Cyberoptics Corporation | High precision component alignment sensor system |
| JPH0661693A (en) * | 1992-08-04 | 1994-03-04 | Yamaha Motor Co Ltd | Component mounting machine |
| JPH06104596A (en) * | 1992-08-07 | 1994-04-15 | Yamaha Motor Co Ltd | Method and system for loading component |
| JPH06152195A (en) * | 1992-11-05 | 1994-05-31 | Yamaha Motor Co Ltd | Detecting equipment for component suction state of mounting machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH1068759A (en) | Attracted matter detecting device attracted mater detecting method using the same, dislocation detecting method using the device and cleaning method using the device | |
| US4745295A (en) | Attitude detecting arrangement for detecting the length and thickness of a part using horizontally and vertically disposed line sensors | |
| JP2599510B2 (en) | Component mounting machine | |
| JPS63283100A (en) | Automatic mounting device for electronic component | |
| JP4029362B2 (en) | Adsorption leak detection device for adsorption head | |
| JPS6090641A (en) | Robot hand for ic insertion | |
| JPH1168390A (en) | Component suction device | |
| US6459382B1 (en) | Over clamp sensor | |
| JP3128406B2 (en) | Electronic component automatic mounting device | |
| JP4138089B2 (en) | Component mounting device | |
| JP3855216B2 (en) | Solder ball adsorption inspection device | |
| JPH0238480Y2 (en) | ||
| JPH0222899A (en) | Device for recognizing position of component | |
| JPS62263405A (en) | Apparatus for detecting posture of parts | |
| JPH0622983Y2 (en) | Semiconductor element mounting device | |
| JPH03229498A (en) | Holding device of electronic component | |
| JPH0444246A (en) | Semiconductor wafer carrying device | |
| KR100262895B1 (en) | Method and apparatus for exchanging nozzle for surface mounter | |
| JPH01225128A (en) | Shifting hand for wafer | |
| KR100442778B1 (en) | Finger for wafer transference | |
| JPS6325934A (en) | Bonding device for pellet | |
| JPS62122230A (en) | Device for detecting condition of vacuum attraction | |
| JPS59126700A (en) | Device for detecting erroneous insertion of automatic electronic part inserting machine | |
| JPH055388U (en) | Component mounting device | |
| KR19990085668A (en) | Transfer Robot Arm of Semiconductor Device |